By virtue of the fact that ATS is a provider of heat sinks and thermal management solutions to electronics, much of work is target at the junction temperature of semiconductors. We work with a lot of suppliers in this space, most recently Intel’s Sandybridge. Which leads me to the reason for addressing this topic.
Are Your Heat Sinks and Thermal Management Strategy for Your Target Seminconductors Optimized or Deadended?
Of all the semiconductor providers works with, ATS has done a great deal of work with Caviuim, TI and Freescale. It’s not that their processors are unusually hot, it’s that these firms recognize that ATS does a great job of optimizing a thermal design. Our case studies show a wide range of applications and successes in this optimization.
With Cavium, ATS is a thermal development partner. We’ve tackled a number of difficult designs with them and with Cavium customer’s whose design elements create very dense, high performance products but in some small and low air flow applications.
ATS has two off-the-shelf stocks solutions for Cavium that can be used as design starting points, The ATS-691-C2-R1 offers up a thermal resistance of .6 C/W at 200 LFM and the ATS-725-C1-R1 offers up a thermal resistance of 2 C/W at 200 LFM.
