Monthly Archives: September 2018

Industry Developments: Cabinet Cooling Solutions

Critical electronics are routinely housed inside metal cabinets of different dimensions. Although their applications vary, a common issue within these enclosures is excess heat, and the danger it poses to their electronics. This heat can be generated by internal sources and intensified by heat from outside environments.

Cabinet Cooling

The trends toward compact, multi-function electronic controls, variable speed drives, programmable logic controllers, and tightly-packed processors and server racks can also cause thermal problems. Excess heat can adversely affect digital displays, controls, breakers, ICs and PCBs. In most cases this heat can’t be prevented, so it must be removed to ensure the proper function and service life of components and boards.

Issues with excess cabinet heat have been around for decades, and many cooling approaches have been utilized. Among the most popular are air conditioners, vortex coolers and heat exchangers. Each method has benefits and shortcomings, and improvements are continually made by the engineers who design these cooling systems.

Air Conditioners

As cabinet designs adapt to new needs, air conditioners are being designed for tighter spaces, higher performance and lower costs. Today’s ACs include traditional vapor-compression-refrigeration technology, as well as new thermoelectric systems.

IceQube is providing the Qube Series of air conditioners, which the company described as the world’s smallest compressor-based air conditioner and an ideal cooling solution for compact enclosures with high heat loads. The compact air conditioners are available in power coated and stainless-steel housings. [1]

Figure 1. The Qube series of vertical mount air conditioners from IceQube come in widths as narrow as six inches. [1]

The Blade air conditioners series, also from IceQube, is specially-designed for door mount applications on electrical enclosure cabinets. They have a space-saving, ultra-thin designs for use in NEMA type 12, 3R, 4 and 4X cabinet designs. Cooling performance from the Blade ACs is up to 50,000 BTU/hr. [2]

Thermoelectric ACs, also called Peltier ACs, work without compressors or refrigerants. Some feature efficiently-designed fans as their only moving parts to provide effective internal cabinet cooling. These models typically provide lower cooling performance, but enough to meet cabinet cooling requirements.

TECA recently introduced internally mounted thermoelectric air conditioners for enclosure cooling where there can be no external protrusions from the enclosure. Available in five sizes, the new air conditioners can be horizontally or vertically mounted inside an enclosure. Performance ratings range from 155 BTU/hr – 390 BTU/hr. These air conditioners use no refrigerants or compressors and have no moving parts other than their fans. [3]

Figure 2. Internally mounted TECA air conditioners are suited for use where space requirements prohibit external protrusion. [3]

When high levels of temperature drop are needed inside a cabinet, EIC Solutions offers an alternative to compressor-based air conditioners. EIC’s new High Delta T thermoelectric air conditioners provide a maintenance-free, solid-state solution for applications that require a large ΔT in any environment. ΔT is the difference between return air temperature and supply air temperature.

The new ThermoTEC 142 and 146 series air conditioners feature high ΔT capabilities to achieve greater drops from ambient temperatures compared to standard models. [4]

Figure 3. New thermoelectric air conditioners have high ΔT capabilities for greater drops from ambient temperatures than other TEC models. [4]

The 142 series (500 BTU/hr) and the 146 series (1000 BTU/hr) feature rugged, type 304 stainless steel, and NEMA 4X construction.

Another compressor-based air conditioner is the SpectraCool from Hoffman. Its filter-free design reduces clogging that can cause system failures. SpectraCool units feature an energy-efficient compressor and earth-friendly refrigerant. Models are available for up to 20,000 BTU/hr cooling performance.

The Hoffman SpectraCool ACs can also be controlled remotely. Access comes via a unique IP address to each equipped unit. This allows monitoring and control of cooling, heating, alarms, the compressor and the ambient fan. [5]

The company’s Easy Swap adaptor plenums provide a quick and easy way to upgrade the SpectraCool systems and deliver up to 23 percent greater energy efficiency.

Vortex Cabinet Coolers

Vortex enclosure cooling systems work by maintaining a slight pressurization in the cabinet to keep electrical and electronic components clean and dry. Most vortex systems are thermostatically-controlled to keep cabinet temperatures within a specified temperature range.

The core of these coolers is composed of vortex tubes, mechanical devices that separate compressed gas into hot and cold streams. Air emerging from the cold end can reach -50°C, while air emerging from the hot end can reach 200°C. The tubes have no moving parts. [6]

EXAIR Cabinet Cooler systems use vortex tube technology to create a cold air outlet flow which is pumped into an electronic cabinet. As air is pushed into the cabinet the Cabinet Cooler system also provides its own built-in exhaust. There is no need to vent the cabinet. This creates a positive purge on the cabinet to keep out dirt, dust and debris.

Figure 4. The Exair dual cabinet cooler system minimizes compressed air use and produces 20°F air for cabinet cooling. [7]

EXAIR Cabinet Cooler systems are unaffected by vibration, which can cause refrigerant leaks and component failures in traditional air conditioners. They are UL listed for NEMA 12, 4 and 4X integrity and are marked CE for conforming to European Union safety standards.

ITW Vortec, a leader in vortex tube technology and enclosure cooling provides the UL-listed Electric Vortex A/C. The Electric Vortex A/C is an electric thermostat cabinet cooler with plug-and-play functionality. Unlike traditional electric thermostat enclosure coolers which require additional wiring and piping to properly install, the new Electric Vortex A/C comes pre-wired, requires no additional wiring and just needs an outlet within six feet of the unit.

This new solution eliminates the need for an external solenoid valve and the piping traditionally used to install other enclosure cooler solutions. An electric thermostat allows the user to set the desired temperature to be maintained in the enclosure. The cooler will only turn on when necessary, conserving energy from compressed air usage.

Figure 5. The Electric Vortex air conditioner from Vortec eliminates the need for an external solenoid valve. [8]

Heat Exchangers

Using heat exchangers as cabinet thermal solutions can provide an enhanced solution in terms of performance, cost-effectiveness and smaller size designs. There are both air-to-air, and liquid-to-air models.

Air-to-Air Exchangers

Air-to-air heat exchangers are a proven and dependable cooling method that relies on passive heat pipe or folded fin impingement cores to disperse the heat from within cabinet enclosures to the outside ambient air.

Figure 6. Air-to-air heat exchangers transfer heat without moving parts. [9]

The Stratus line of air-to-air heat exchangers from AutomationDirect includes 120 VAC and 24 VDC models. The series has a closed-loop cooling system, using the heat pipe principle to exchange heat from inside to outside the cabinet.

Each heat pipe has an evaporator section and a condenser section. These are separated by a permanent baffle to provide a closed loop. The coil systems use aluminum end plates and baffles, which improve conduction and reduce corrosion for longer life. The Stratus heat exchangers are available in models for NEMA 4 and 4X enclosures. Units come in three frame sizes (compact, deep, and tall) with up to 72 watts capacity. They are equipped with two circulating fans with sealed overload protectors. [9]

Liquid-to-Air Exchangers

Liquid-to-air heat exchangers provide cooling through a closed-loop system. They are designed for use where heat dissipation needs are too great for natural or forced air convection systems, or where remote heat dissipation is required. Much of their higher cooling performance comes from using fluids with much higher thermal conductivity than air. Typical applications include cabinets, MRI and process cooling.

Figure 7. The WL500 water-cooled, liquid-to-air heat exchanger has a high-pressure pump for fast flow rates. [10]

Conclusion

Cabinet-housed electronics are susceptible to excess heat generated from within along with heat from outside environments. Thus, keeping the electronics cool inside cabinets is essential to maximizing internal device life cycles. Numerous cooling methods are available, including air conditioning, vortex cooling, and heat exchangers.

Each of these methods has its own methodology, such as the choice of air or liquid cooling, to provide options for meeting cooling requirements. A thorough awareness of options, application requirements, and resources should lead to the best cabinet cooling solutions

References
1. IceQube, http://www.iceqube.com/air-conditioners/qube-series-mm/
2. IceQube, http://www.iceqube.com/blade-series-products/blade-series-air-conditioners/
3. TECA Corporation, http://www.thermoelectric.com/2010/ad/internal-mounted.htm
4. EIC Solutions, Inc., http://www.eicsolutions.com/
5. Hoffman, http://www.pentairprotect.com/hoffman/
6. Vortex Tube, https://en.wikipedia.org/wiki/Vortex_tube
7. EXAIR, http://www.exair.com/ https://www.youtube.com/watch?v=CoxzwJmbyxY
8. ITW Vortec, https://www.vortec.com/p-284-electric-vortex-ac.aspx
9. AutomationDirect, http://www.automationdirect.com
10. Laird, http://www.lairdtech.com/products/wl-500

Cooling News: New Thermal Products Showcase

In this article, Qpedia will explore some innovative thermal management products that have recently hit the market. These new thermal products encompass a variety of thermal management applications from CPU coolers to thermal interface materials (TIM) to sensors and test instruments to advanced materials and concepts.

Wireless Temperature Sensor for Data Centers

New Thermal Products

The IoT-enabled EkkoSense Wireless Temperature and Humidity Sensor. (EkkoSense)

The EkkoSensor Wireless Temperature and Humidity Sensor from U.K.-based EkkoSense is the first IoT-enabled wireless sensor for data centers. Its low cost enables its use in large quantities to provide true real-time thermal management of data centers and other critical facilities.

The sensor features a local display of the measured temperature and relative humidity values, with additional screens that can be cycled through to show temperature profiles over the last hour, 24 hours and seven days for quick thermal assessment on-site. Wireless EkkoSensors are entirely self-contained and battery-powered for simpler installation.

The sensors provide a direct sensor-to-hub linkage to keep the radio network simple and deliver predictable levels of battery life and performance. All temperature and humidity data is encrypted with 128-bit AES encryption before transmission to an EkkoHub wireless data receiver for forwarding to EkkoSense’s cloud-based EkkoSoft 3D visualization and analysis software.

Non-Silicone TIMs for LED Cooling

Non-silicone TIMs from Electrolube can be used in LED cooling applications. (Electrolube)

Electrolube has introduced non-silicone TIMs for use in LED cooling in response to silicone-related issues with long term reliability, contamination and availability. Heat can substantially impacts the lifetime, cost and performance of an LED luminaire. Without suitable thermal management, a luminaire will be thermally inefficient, have a reduced operating life and high maintenance costs.

Electrolube’s non-silicone thermal pastes include HTC (Heat Transfer Compound) and HTCP (Heat Transfer Compound Plus), which avoid silicone migration onto electrical contacts. Potential issues with silicone migration include high contact resistance, arcing, soldering problems and mechanical wear.

Electrolube’s X range of non-silicone thermal products features the low viscosity HTCX, for ease of use, and HTCPX for gap filling applications. These ‘Xtra’ versions of HTC and HTCP provide increased thermal conductivity, lower oil-bleed and lower evaporation weight loss, making them comparable or better than some silicone-based materials.

Heat Insulating Sheets Have Air-Like Conductivity

Panasonic introduced NABSIS (nano silica balloon insulator sheet) composed of an aerogel and polyester fiber. (Panasonic)

Panasonic, a worldwide leader in thermal protection products has introduced NASBIS insulating sheets. NASBIS stands for Nano Silica Balloon Insulator Sheet. This new addition to Panasonic’s line of thermal management solutions is a thin, flexible Nano-Silica heat insulation material composed of silica aerogel and polyester fiber that has high thermal isolative properties.

The thermal conductivity of NASBIS is comparable to that of air, making it a very attractive material for heat insulation. NASBIS sheets protect thermally weak products from heat and work to maintain a uniform temperature throughout a device. When combined in a stack with Panasonic’s pyrolytic graphite sheet or PGS, NASBIS insulating sheets enable the control of heat direction.

The proprietary composite material provides greater heat insulating performance. Applications include wearable devices, LED modules and drivers, micro inverters, IGBT modules, radio devices, notebook and tablet PCs, satellites and cameras.

High Performance CPU Cooler for Gaming PCs

The HEX 2.0 CPU Cooler from Phononic pushes a processor up to 140 watts TDP. (Phononic)

The HEX 2.0 CPU cooler from Phononic offers superb performance in a compact design that allows users to push their processor up to 140 watts TDP (thermal design power) and beyond. The cooler’s innovative design combines a small form factor measuring just 125 x 112 x 95 millimeters, unique styling via a swappable 92-millimeter fan, and customizable LED illumination.

Users can select cooling profiles, change LED colors and keep up-to-date with the latest firmware through the HEX 2.0 software application dashboard. The HEX 2.0 offers an alternative for high performance cooling without going to a much larger heat sink/fan or a water-based solution.

The HEX 2.0 has an integrated electronic control board and utilizes an active and passive cooling design to deliver high performance cooling only when necessary, minimizing the power and fan noise. The HEX 2.0 requires zero power consumption when the CPU is under low stress, up to a peak power of 35 Watts when the CPU is under stress or in overclocked mode.

High Performance, Low Compression Gap Filler

Henkel introduced the new GAP PAD HC 5.0 to manage high power density components. (Henkel)

The new GAP PAD HC 5.0 for Henkel is designed to manage the heat generated by today’s reduced form factor, high power density components. A soft and compliant gap filling material, GAP PAD HC 5.0 has a thermal conductivity of 5.0 W/mK and delivers outstanding thermal performance with very low compression stress.

The low modulus and unique filler package is ideal for applications that require minimal component or board stress during assembly, yet demand high heat transfer across the interface with very low thermal resistance. GAP PAD HC 5.0 allows for superb interfacing and wet out, even to rough surfaces and topographies, which ensures uniform material coverage across the component and heat sink for maximum performance.

Compared to previous-generation materials, GAP PAD HC 5.0 offers better handling, an enhanced dielectric constant, improved volume resistivity and better thermal impedance performance. Manufactured with a natural tack on both sides, GAP PAD HC 5.0 contains no thermally-impeding adhesive layers and is available in a range of thickness from 0.508 mm up to 3.175 mm.

Top Mount Enclosure Air Conditioner

Thermal Edge has released a new top mount air conditioner for enclosures. (Thermal Edge)

Thermal Edge now provides the Top Mount series of enclosure air conditioners. Mounting an air conditioner on the sides or doors of an electrical enclosure is not always possible due to spacing constraints.

To accommodate these applications, Thermal Edge has added a series of Top Mount enclosure air conditioners in a variety of capacities and voltages that provides the same unique features as their side mounted models, including an active condensate evaporation system, digital controller, and a thermal expansion valve to maintain cooling capacity over a broad ambient temperature range.

The Top Mount models also offer a unique option that allows engineers to enhance the airflow inside the cabinet by adjusting the distance between the cold air outlet and the warm air intake. The Top Mount models are designed to be filter free (filters optional) and are available with 6,000 and 8,000 BTU/H performance. The air conditioners are available in NEMA Types 12, 4 and 4X.

Read more articles from the Qpedia archive at https://www.qats.com/Qpedia-Thermal-eMagazine.

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Technology Review: Liquid Cooling Solutions

(This article was featured in an issue of Qpedia Thermal e-Magazine, an online publication dedicated to the thermal management of electronics. To get the current issue or to look through the archives, visit http://www.qats.com/Qpedia-Thermal-eMagazine.)

Qpedia continues its review of technologies developed for electronics cooling applications. We are presenting selected patents that were awarded to developers around the world to address cooling challenges. After reading the series, you will be more aware of both the historic developments and the latest breakthroughs in both product design and applications.

Liquid Cooling Solutions

The focus of this article is to highlight recent patents for liquid cooling devices. (Advanced Thermal Solutions, Inc.)

We are specifically focusing on patented technologies to show the breadth of development in thermal management product sectors. Please note that there are many patents within these areas. Limited by article space, we are presenting a small number to offer a representation of the entire field. You are encouraged to do your own patent investigation.

Further, if you have been awarded a patent and would like to have it included in these reviews, please send us your patent number or patent application.

In this issue our spotlight is on liquid-based cooling solutions.

There are many U.S. patents in this area of technology, and those presented here are among the more recent. These patents show some of the salient features that are the focus of different inventors.

Liquid Cooling Devices

Embedded Microchannel Cooling Package for a Central Processing Unit

US 7515415 B2, Monfarad, A. and Yang, J.

An indirect cooling liquid embedded package design for use with a computer central processor unit is suitable for thermal management of high heat dissipation electronic components such as server processors. The indirect contact cooling liquid embedded packaged CPU has mechanical coupling and embedded plumbing that attaches to the board pumped liquid supply and indirect cooling of the heat-generating portion of the CPU with an embedded microchannel heat exchanger. The coolant package system for the CPU removes higher levels of heat indirectly from the core of the processors by convective cooling.

Cooling liquid flows into the microchannel piping in the CPU substrate. Cooling liquid continues to flow out of the microchannel piping into a silicon or metallic microchannel heat exchanger that is directly bonded to a silicon die for cooling of the heat-generating portion of the CPU. As a result, an embedded microchannel indirect contact cooling liquid package for a CPU can be utilized to remove substantially higher levels of heat from the core of the processors by forced convective liquid flow through the microchannel heat exchanger attached to the core of the CPU. Cooling liquid is introduced into the package of the server CPU by mechanically attaching the CPU to the board through a socket interconnect. Pins of the socket serve to provide electrical connection between the board and the CPU, while a few pins are designed for the purpose of providing an inlet and an outlet for cooling liquid into and out of the CPU package.

The cooling system of the present invention also uses the existing package-to-board practice of using sockets and therefore the entire cooling system is embedded into the processor-to-board assembly. From the end user’s point of view, there is a tremendous amount of simplification of board design as the bulky fan and heat sink assemblies are removed. The replacement, according to the present invention, is a central liquid cooling system that can be made redundant to substantially prevent any reliability issues in the field.

Planar Heat Pipe for Cooling

US 8305762 B2, Wits, W., Mannak, J. and Legtenberg, R.

The invention claimed is a circuit board for cooling of heat-dissipating components assembled thereon, including at least two panels at least one of which is populated With heat-dissipating components, both panels being metal clad on a side, at least one of the panels being formed from a printed circuit board laminate and comprising a plurality of grooves on its metal clad side, the panels being bonded together by an adhesive layer With their metal clad sides oriented face to face so as to form a circuit board containing a sealed cavity having a height defined by a thickness of the adhesive layer and the separation of the metal clad sides, the cavity being partly filled with a fluid, the fluid circulating by capillary action along the grooves towards zones exposed to heat where the fluid vaporizes.

Vapor may circulate back by pressure gradient effect through the cavity towards zones not exposed to heat where it condenses. In a mode of implementation, the heat pipe may be embedded in a circuit board formed by the panels for inherent cooling of heat-dissipating components.

Thus, key advantage provided by the present invention in any of its aspects is that it is based on most standard processes of multilayer PCB fabrication such as laminating, selective metal plating and etching. Therefore, it is a highly cost-effective solution. Furthermore, the invention provides a very flexible design solution enabling to adapt the cooling paths to the PCB layout, especially to the higher heat dissipation locations. Not requiring any supplementary materials, it is even considerably lighter than a tubular heat pipe-based solution.

Implemented as enhancement of a computer aided engineering tool, heat pipe cooling cavities could be designed concurrently with the layout of components placement and printing of circuits, ensuring optimized thermal management. This enables multilayer PCB assemblies, which are high density electronic devices, to benefit the most from the integrated heat pipe cooling function.

Cooling System for Electronic Equipment

US 7508666 B1, Henneberg, M. and Johnson, L.

A cooling solution includes a system providing thermal energy dissipation for electronic equipment located in support racks or cabinets of a facility. According to one embodiment, the system is integrated with a facility where the support cabinets are located. The system providing thermal energy dissipation includes a cooling loop, a fan unit for moving air across the cooling loop and one or more ducts forming a confined flow pathway for the moving air between the fan unit and cabinets for delivery to the electronic equipment.

More specifically, the cooling loop contains a supply of circulating heat absorbing fluid such that the heat absorbing fluid removes thermal energy from the air moved by the fan unit. Each cabinet is formed with an exhaust pathway such that the moving air enters the cabinet from the duct, flows across the electronic equipment to remove thermal energy therefrom, and exits the cabinet.

Claims include a cooling system for a facility housing electronic equipment, the facility having a support surface on which a cabinet holding the electronic equipment is located, the system comprising: a cooling loop located beneath the support surface and containing a supply of circulating heat absorbing fluid; a fan unit located beneath the support surface and configured to move air across the cooling loop such that the heat adsorbing fluid removes thermal energy from the moving air; at least one duct forming a confined flow pathway for the moving air between the fan unit and the cabinet, wherein the cabinet is formed with a substantially lateral exhaust pathway such that the moving air enters via a back region of the cabinet, flows across the electronic equipment, housed by the cabinets, to remove thermal energy therefrom, and exits a front region of the cabinet; and a chilling plate positioned downstream of the flow of moving air exiting the cabinet such that the chilling plate is located outside of the front region of the cabinet, the chilling plate is coupled to a secondary cooling loop containing a supply of heat absorbing fluid.

Claims also include a method for providing thermal energy dissipation for network-based electronic equipment housed within a plurality of cabinets located on a support surface of a facility, each of the plurality of cabinets having an interior formed with a through passageway extending from an entrance at a first side of each of the plurality of cabinets to an exit at a second side of each of the plurality of cabinets, the method comprising: providing a cooling loop containing a supply of circulating heat adsorbing fluid; providing a fan unit configured to move air across the cooling loop such that the heat adsorbing fluid removes thermal energy from the moving air; directing the moving air from the fan unit to the through passageway of each of the plurality of cabinets such that the moving air flows across the electronic equipment to remove thermal energy therefrom, and exits the plurality of cabinets; and providing a plurality of chilling plates positioned downstream of the flow of moving air exiting the plurality of cabinets such that one of the plurality of chilling plates is located outside of each of the plurality of cabinets, respectively, each of the plurality of chilling plates is coupled to a secondary cooling loop containing a supply of heat absorbing fluid.

For more information about Advanced Thermal Solutions, Inc. (ATS) thermal management consulting and design services, visit https://www.qats.com/consulting or contact ATS at 781.769.2800 or ats-hq@qats.com.

Join ATS for Live Liquid Cooling Webinar

Advanced Thermal Solutions, Inc. (ATS) is hosting a series of monthly, online webinars covering different aspects of the thermal management of electronics. This month’s webinar will be held on Thursday, Sept. 27 from 2-3 p.m. ET and will cover the design and deployment of liquid cold plates in electronics systems. Learn more and register at https://qats.com/Training/Webinars.