Category Archives: Cooling News

Cooling News: New Thermal Products Showcase

By Norman Quesnel
Senior Member of Marketing Staff
Advanced Thermal Solutions, Inc. (ATS)

In this article, Qpedia will explore some innovative thermal management products that have recently hit the market. These new thermal products encompass a variety of thermal management applications from CPU coolers to thermal interface materials (TIM) to sensors and test instruments to advanced materials and concepts.

Graphene Sheets

Cooling News

Paragraf, a group affiliated with the University of Cambridge is producing graphene at up to eight inches (20cm) in diameter, large enough for commercial electronic devices. Engineers at Paragraf are creating graphene wafers and graphene-based electronic devices that can be used in transistors, where graphene-based chips could deliver speeds more than ten times faster than silicon chips.

They can also be used in chemical and electrical sensors, where graphene could increase sensitivity by a factor of more than 30. Paragraf’s devices will target markets including transistors, chemical and electrical sensors, and new energy generation devices.

QSFP-DD BiPass Thermal Cooling Configuration 

Molex, a global electronic solutions provider, highlights its new BiPass thermal management configuration cooling QSFP-DD modules up to 20 W with a 15°C change from the ambient temperature. First shown at DesignCon 2019, the Molex QSFP-DD thermal solution can cool a range of 15W to 20W in different configurations. The BiPass solution allows higher wattage modules to be cooled and will help designers on the path toward 112 Gbps.

As the industry is readying for the launch of next-generation copper and optical QSFP-DD transceivers, thermal management strategies are critical. During the demonstration, Molex showcased a QSFP-DD belly-to-belly BiPass configuration, QSFP-DD belly-to-belly SMT configuration, 2×1 QSFP-DD stacked configuration and 1×2 QFSP-DD BiPass in a vertical orientation with dual heat sinks.

Running at 15W, all configurations were able to cool at less than 25-degree Celsius delta T rise. The BiPass solution routes high-speed signals through Temp-Flextwinax cables enabling greater channel margin compared to PCB alone and allows for a second heat sink on the bottom side of the cage to make contact with the module, providing additional cooling.

The BiPass solution, allows designers to bypass the lossy printed circuit board by utilizing Temp-Flex high-speed twinax. Because of this, they can achieve lower insertion loss when going from an ASIC in a switch or a router to another server within a rack.

Micro and Macro Channel Liquid Cooling

Rogers now provides curamik CoolPower and CoolPower Plus as well as the curamik CoolPerformance and CoolPerformance Plus. The liquid coolers feature either a micro or macro channel structure made of thin copper foils that are put together into a hermetically tight block using Rogers’ curamik bonding process. The specific channel structure determines the thermal resistance, pressure drop and flow rate. The coolant usually enters and exits through openings connected with O-rings or screw fittings.

Ideal for high power applications, the curamik CoolPerformance coolers are high performance copper coolers for laser diode cooling. curamik CoolPerformance Plus coolers are high performance isolated copper coolers that contain an AlN isolation layer on top and bottom.

Thermal Tape Offers Low Thermal Resistance

DuPont Temprion AT adhesive thermal tapes deliver grease-like wettability at low application pressures, providing the freedom to assemble devices without introducing excess stress to a system’s complex circuitry.

The highly conformable pressure-sensitive adhesive tapes achieve low thermal impedance at only 20 psi of pressure to offer best-in-class thermal performance, easier package assembly, reduced device failure and higher system performance. Thermal conductivity is 0.7 W/m·K.

Use of Temprion AT thermal tapes eliminates the need for mechanical fasteners when assembling electronic packages. Applications include heat sink attachment for CPUs and GPUs, LED bonding, and assembly of flat panel displays.

Peltier Coolers Keep Machine Vision Systems Cool

The HiTemp ET Series Peltier thermoelectric module from Laird Thermal Systems is designed to keep the sensors in machine vision systems cool and operating at peak performance. Solid-state thermoelectric coolers can reduce the sensor’s temperature to meet proper design specifications.

A standard single-stage Peltier cooler can achieve temperature differentials of up to 70°C, while a multi-stage Peltier module can achieve much higher ΔTs. Thermoelectric modules are integrated directly into the sensor assembly and typically require a heat sink or other heat exchanger to dissipate heat into the surrounding environment.

Supporting applications operating in temperatures ranging from 80 to 150°C, the single-stage HiTemp ET Series offers a cooling capacity of more than 300 watts in a compact form factor. The HiTemp ET Series includes over 50 models with a wide variety of heat pumping capacities, form factors and input voltages.

InRow Data Center Cooling Solution 

Schneider Electric has expanded its EcoStruxur Ready cooling portfolio with a 30kW InRow DX solution. Available in a 300mm rack format, this data center cooling solution offers industry leading efficiency and addresses the increasing demand for higher density cooling in the data center.

The trend toward modernization and consolidation of data centers is driving the need for a cooling solution that provides more cooling capacity in a smaller footprint and flexible capacity to adapt to the actual data center load. The 30kW InRow DX is ideal for data centers that are being modernized or retrofitted, or anywhere IT space is at a premium.

Due to its powerfully compact size and energy efficient design, the InRow DX is the most versatile and predictable cooling system for next generation small and medium data centers and an optimal choice for edge and enterprise environments. The 30kW InRow system can provide 30% improved efficiency, reducing operating expenses and improving PUE (power usage effectiveness).

For more information about Advanced Thermal Solutions, Inc. (ATS) thermal management consulting and design services, visit or contact ATS at 781.769.2800 or To register for Qpedia and to get access to its archives, visit

Cooling News: New Thermal Products Showcase

In this article, Qpedia will explore some innovative thermal management products that have recently hit the market. These new thermal products encompass a variety of thermal management applications from CPU coolers to thermal interface materials (TIM) to sensors and test instruments to advanced materials and concepts.

Metal Oxide Microparticle Thermal Compound

New Thermal Products

NT-H2 is a second generation, hybrid thermal compound from Noctua. The compound uses a mixture of metal oxide microparticles for lower thermal resistance and reduced bond-line thickness at typical mounting pressures. Up to 2°C lower temperatures were attained In Noctua’s standardized internal testing at various platforms and heat loads. NT-H2 thermal compound does not require a break-in period. Because of its long-term stability, it can be used on the CPU for up to five years.

Both pastes are electrically non-conductive and non-corroding, so there is no risk of short circuits and they’re safe to use with all types of heat sinks. NT-H2 thermal compound will come in standard 3.5g and extra-large 10g package that come with a supply of pre-moistened wipes for effective surface cleaning.

Form in Place Liquid Thermal Gap Filler is Peel-able

The new Bergquist Gap Filler TGF 1500RW offers thermal interface material (TIM) re-workability without sacrificing thermal conductivity or automation performance in a single material. TGF 1500RW is a one-part, cure-in-place liquid gap filler that can be used with automated dispensing equipment for high-volume manufacturing operations.

Because the material is applied as a liquid, it is ideal for miniaturized, high-density assemblies and complex architectures, penetrating small gaps for complete coverage. Once cured, the material provides optimized surface contact and thermal transfer with a 1.5 W/m-K thermal conductivity and delivers excellent low and high temperature mechanical and chemical stability.

While traditional cure-in-place TIMs generally require very high force for disassembly, TGF 1500RW peels away cleanly from contact surfaces to safeguard delicate componentry and preserve product value.

All-In-One Liquid Cooler for Demanding Workloads

Asetek has introduced its highest performance all-in-one (AIO) liquid cooler, designed in collaboration with Intel. The Asetek 690LX-PN liquid cooler is approved for the Intel Xeon W-3175X processor. The AIO liquid cooler features extreme performance to enable overclocking up to 500 watts (W) and provides stable operation for demanding workstation and content creation workloads.

The 690LX-PN cooler uses the new Gen6-s pump from Asetek – the same core technology that is used to cool some of the world’s fastest supercomputers and includes a highly efficient copper radiator. A large cold plate covers the entire CPU package and ensures optimal plate-to-package thermal contact.

The 690LX-PN liquid cooler is approved to cool the new 28-core/56 thread Intel Xeon W-3175X processor, which offers up to 4.3 GHz single-core turbo frequency.

Data Center Racks Enhance Thermal Management

The NRSe series of data center racks from NetRack helps achieve effective air flow management at the rack level. These racks are manufactured out of steel sheet punched, formed, welded and powder coated with highest quality standards under stringent ISO 9001-2008 Manufacturing and Quality management system.

Thermal management with air seal kit and blanking panels and bottom brushed access with enhanced grounding and bonding assures 100 per cent compatibility with all equipment, conforming to general industry standards. Features like Intelligent Locking and Rack Monitoring add to easy management of data centers.

Silicon-Based Microchannel Heat Sink

Imec, a research and innovation hub in nanoelectronics and digital technologies has introduced a silicon-based compact microchannel heat sink that enables high heat flux dissipation. When assembled to a high performance chip for cooling, the Imec heat sink achieves a low total thermal resistance of 0.34-0.28 K/W at less than 2 W pump power. It is directly integrable in the semiconductor infrastructure.

The Si-based microchannel heat sinks are fabricated separately and then interfaced to the back side of a heat-dissipating chip. Using an optimized Cu/Sn-Au interface, very low thermal contact resistance is achieved between both parts.

Because the fluidic performance and thermal behavior can be predicted with a high degree of accuracy, the new microcooler can be tailored according to external system constraints such as space and liquid supply.

Air to Air Heat Exchangers for Closed Loop Systems

The new Pfannenberg PKS Series Air to Air Heat Exchangers use the Pfannenberg Kinetic System next generation cooling technology that out-performs conventional heat exchangers. The units are lightweight and easy to install, while air to air technology takes advantage of a cooler ambient environment when closed-loop cooling is required, sealing against gas, humidity, and dust.

Designed for indoor, outdoor, remote and washdown applications that require a closed loop system to protect electronics, the PKS Series of exchangers are ideal for keeping rain and dust from sensors and drives on outdoor systems and protecting against corrosion and contamination.

For more information about Advanced Thermal Solutions, Inc. (ATS) thermal management consulting and design services, visit or contact ATS at 781.769.2800 or To register for Qpedia and to get access to its archives, visit

Cooling News: New Thermal Products Showcase

In this article, Qpedia will explore some innovative thermal management products that have recently hit the market. These new thermal products encompass a variety of thermal management applications from CPU coolers to thermal interface materials (TIM) to sensors and test instruments to advanced materials and concepts.

One Part, Silver Conductive Epoxy

Silver filled epoxy adhesive system Master Bond EP3HTSDA-2 was developed for crucial thermal management applications. As a one component system, it is not premixed and frozen and has a very long working life at room temperature. This compound possesses a high thermal conductivity of 45-49 BTU•in/ft2•hr•°F [6.5-7.0 W/(m•K)].

It can be applied in ultra-thin bond lines and contains particles with an average size of 2-3 microns. EP3HTSDA-2 exhibits very low thermal resistance of 2-3 x 10 -6 K•m2/W. It also has outstanding electrical conductivity with a volume resistivity less than 0.001 ohm-cm. EP3HTSDA-2 meets NASA low outgassing specifications and is serviceable from -80°F to +450°F [-62°C to +232°C].

This product adheres well to similar/dissimilar substrates such as aluminum, ceramic, copper, fiberglass, polyimide and silicone die. This formulation is designed to cure in 20-30 minutes at 250°F or 5-10 minutes at 300°F. Die shear strength has a 20-20 Kg-f value at 75°F measured for a die size of 2×2 mm [80×80 mil].  EP3HTSDA-2 is packaged in syringes or glass jars. Common sizes range from 20 grams, 50 grams, 100 grams to one and multiple pound units.

For storage simple refrigeration is recommended. Shelf life is a minimum of 3 months in original unopened syringes or jars.

Portable AC Keeps Computer Systems Cool

Tripp Lite’s SRCOOL12K is a new-generation air conditioner designed for supplemental area cooling, emergency cooling and off-hour cooling applications. Efficient, compact, self-contained and portable, the 120V, 60 Hz SRCOOL12K is ideal for use in data centers, server and wiring closets, IT environments, home and small business offices, conference rooms, warehouses, entertainment centers or other venues with heat-sensitive equipment, particularly in areas that facility air conditioning can’t reach.

The SRCOOL12K not only adjusts ambient room temperatures, but can also dehumidify and filter the air, providing better air quality for enhanced equipment performance with minimal noise and power consumption. The SRCOOL12K uses environmentally friendly R410a Freon, which complies with EPA standards for 2010 and beyond, and is accepted worldwide. Designed for quick, simple installation, the SRCOOL12K plugs into a standard 5-15R outlet with no adapter required.

Both a standard louvered vent (for general room cooling) and a directional ducted cooling vent (to direct cold air where most needed) are provided. A directional exhaust duct safely removes hot air from the room. The built-in dehumidifier expels condensed water through the exhaust duct, with no need for a drain tube, drain pan or water collection tank. The SRCOOL12K meets the needs of the most demanding applications with 12,000 BTU of cooling power.

A built-in timer enables the unit to be programmed for unattended startup and shutdown. Controls and displays are conveniently mounted on the top panel. An included window/drop ceiling kit provides multiple installation options.

Technology Enables Thin, Safe, Heated Garments

DuPont Advanced Materials (DuPont) today announced the newest offering from DuPont™ Intexar – a powered smart clothing technology for on-body heating. Intexar Heat is a thin lightweight and durable heating solution for outdoor clothing that is designed to be easily integrated into garments. Intexar Heat is a revolutionary stretchable ink and film that when powered, creates a comfortable warmth.

The heater that feels like fabric, doesn’t rely on cables, thick wires or big batteries, and can stand up to very cold environments. From outdoor enthusiasts to industrial workers, Intexar Heat can help conquer the elements in comfort, increasing focus and improving performance. Intexar materials also can enable biometric monitoring in smart clothing.

Pulse rate, respiratory rate, muscle activity and form awareness are all measurable using sensors and conductive pathways built from Intexar.

Heat Shield Technology Protects EV Batteries

Freudenberg-NOK Sealing Technologies has produced a light weight, low volume silicone rubber heat shield for lithium battery systems. The product was developed in response to trends with original equipment manufacturers for battery systems that will increase the driving range for electric vehicles. OEMs have found ways to increase the energy density inside battery cells, packing more chemical energy in the same cell volume. Individual cells also are stored tightly together to maximize the energy density of the system.

Today’s battery systems need to support ultra-fast charging, with OEMs looking for a complete system charge within 10-15 minutes. This pushes a high amount of energy into the system, creating a safety issue with thermal management.  Placing heat shields between the cells, would keep heat from transferring from one cell to another in the case of a thermal event. Freudenberg developed a heat shield based on a silicone rubber that remains flexible under heat and adjusts to changing size of a cell during charging or over its lifetime.

The critical issue is to block the heat, which is caused by the cell in a thermal runaway state. Typical values are 600°C at the surface of the housing for some 30 seconds. The goal was to create a heat shield that could withstand those parameters while maintaining a temperature of 200°C or below.

The silicone rubber heat shield is made with a waffle structure that creates air pockets between the shield and the cell, as well as limits the amount of direct contact area between the shield and the cell surface.

Gap Filler Transfers Heat and Absorbs EM Waves

Fujipoly has introduced a new thermal interface material that also absorbs a wide range of unwanted electromagnetic energy. The tacky, gel-like consistency of Sarcon EGR-11F makes it easy to handle and apply without requiring additional adhesive. When placed on top of a heat source such as an IC chip, the compliant material fills any unwanted air gaps allowing for more efficient transfer of heat to nearby components or heat sinks. 

Sarcon EGR-11F also provides excellent shielding effectiveness across a broad frequency spectrum while exhibiting a thermal conductivity of 1.0 W/m°K (ASTM D 2326) and a thermal resistance of 1.05°Cin2/W at 14.5 PSI. This highly versatile material is available in three sheet thicknesses (0.5, 1.0, 1.5mm) up to a maximum dimension of 300mm x 200mm. Sarcon EGR-11F can also be ordered in die-cut form to fit almost any application shape.

The material is well-suited for environments with operating temperatures that range from -30 to +120°C and exhibits a UL94 flame retardant rating of V-0. 

High Performance IR Sensor Uses MEMS Technology

New Thermal Products

The D6T-1A-02 from Omron is the latest in sensory innovation with super-sensitive, infra-red (IR), non-contact temperature sensing capabilities using MEMS technology. The D6T thermal sensor is ideal for building automation applications, measuring the temperature in a room, or detecting occupancy, even when people are stationary.

Additionally, because the D6T is fully non-contact it offers a wider detection range, as well as ultra-sensitive heat sensors – an excellent alternative to PIR detectors and pyroelectric sensors. Making full use of MEMS technology, the D6T provides the ability to measure surface temps anywhere between -40° to 80°C (-40°-176°F) with an accuracy of +/- 1.5°C, and resolution of 0.06°.

The new sensor combines state-of-the-art MEMS thermopile, a sensor ASIC (Application Specific Integrated Circuit), and a signal processing microprocessor in a 12.0mm x 11.6mm x 9.2mm package. Its narrow field of view at 26.52 allows for accurate readings of a specific object within range.

For more information about Advanced Thermal Solutions, Inc. (ATS) thermal management consulting and design services, visit or contact ATS at 781.769.2800 or To register for Qpedia and to get access to its archives, visit

Cooling News: New Thermal Products Showcase

In this article, Qpedia will explore some innovative thermal management products that have recently hit the market. These new thermal products encompass a variety of thermal management applications from CPU coolers to thermal interface materials (TIM) to sensors and test instruments to advanced materials and concepts.

EC fans provide low-power cooling

A new family of EC (electronically commutated) fans provide cooling in AC applications that prioritize low power and energy savings. Provided by Orion Fans, the fans offer up to 50% lower overall power consumption, with brushless DC motors and voltage transformation inside their motors. This allows applications to meet energy-consumption requirements for programs like Energy Star.

The EC fans are available in 60 mm, 120 mm, 172 mm, and 250 mm sizes. Most of the models are available with a universal voltage range. The 250 mm fans can be purchased with dual-speed functions in 115 V and 230 V models. The series also includes 60 mm, 120 mm, and 172 mm models with IP68-ATEX ratings, enabling them to be used in applications that might involve flammable gas or explosive atmospheres.

3D-Printed Cooler for High Performance Chips

Imec has developed a new impingement chip cooler that uses polymers to achieve a cost-effective fabrication. The cooler features nozzles of only 300 µm, made by high-resolution stereolithography 3D printing. This method allows customization of the nozzle pattern design to match the heat map and the fabrication of complex internal structures. The 3D printing allows production of the whole structure in one part, reducing production cost and time.

Imec’s impingement cooler achieves a high cooling efficiency, with a chip temperature increase of less than 15°C per 100W/cm2 for a coolant flow rate of 1 l/min. It outperforms benchmark conventional cooling solutions in which the thermal interface materials alone already cause a 20-50°C temperature increase.

Thermally Optimized Wedgelocks

Advanced Cooling Technologies, Inc. (ACT) has introduced Isothermal Card Edge, ICE-Lok wedgelocks. Wedgelocks are used when electronics cards must be easily replaceable. The wedgelock is a mechanical clamp that allows a card to be swapped quickly, but has the drawback of being a relatively poor thermal conductor. The new ICE-Lok is designed to enhance the card-to-chassis, through-the-wedgelock heat conduction by adding more contact surfaces between the card and the chassis.

The new wedgelock design offers a 30% reduction in thermal resistance compared to similarly sized COTS wedgelocks. This has enabled reduction of component temperatures of up to 10°C in some 100W card applications. ICE-Lok wedgelocks have been thoroughly tested for thermal and mechanical stability with repeated insertion/removal testing. They are designed to meet the dimensional requirements of the VITA specification; and the new friction lock feature ensures that card deformation is avoided.

Boron Arsenide Crystals for Chip Cooling

Three teams from around the US are now saying that crystals of the semiconductor boron arsenide (BAs) show promise in this context and they have measured a high thermal conductivity of more than 1000 W/m/K at room temperature for this material. This value is three times higher than that of copper or silicon carbide, two materials that are routinely employed for spreading heat in electronics.

Researchers predicted that BAs should have a theoretical thermal conductivity as high as that of diamond (2,200 W/m/K), which is the best heat conductor known, back in 2013. However, to reach this high value, high quality crystals are needed since defects and impurities dramatically degrade thermal properties.

Updated Thermal Management Software

Enclosure manufacturer Eldon has updated its thermal management software tool. The software tool has been designed to assist engineering firms, panel builders, and users in dimensioning cooling or heating equipment for electrical enclosures. The tool is used to define a solution that ensures the temperature inside the enclosure does not fall below or exceed the limits required. The tool calculates climate control requirements including heat dissipation within the enclosure, component by component, and generates solutions for both indoor and outdoor applications.

It recommends an array of temperature or humidity modulating and measuring devices, such as air conditioners, heat exchangers, filter fans, vortex coolers, heaters, thermostats and hygrostats. It takes the size of the enclosure as well as the environmental conditions under which it will operate into account. Included in the new version are: ‘Save’ and ‘Load’ functionality; improved power data layout presentation; and a voltage selector for vortex coolers.

Cold Plates Cool IGBTs

New IGBT cold plates from Advanced Thermal Solutions feature a mini-channel fin design for unmatched thermal performance. This ATS series offers a 30% or more improvement in thermal performance compared to commercially available cold plates.

These IGBT cold plates offer a maximum pressure of 60 psi. ATS-CP-1000 cold plate, at a flow rate of 4L/min, transfers 1kW of heat at 5.5°C temperature difference between the cold plate base and inlet fluid temperature. If the coolant has particles, a #60 filter or finer is recommended to remove possible particles in the liquid.

Cooling News: New Thermal Products Showcase

In this article, Qpedia will explore some innovative thermal management products that have recently hit the market. These new thermal products encompass a variety of thermal management applications from CPU coolers to thermal interface materials (TIM) to sensors and test instruments to advanced materials and concepts.

Wireless Temperature Sensor for Data Centers

New Thermal Products

The IoT-enabled EkkoSense Wireless Temperature and Humidity Sensor. (EkkoSense)

The EkkoSensor Wireless Temperature and Humidity Sensor from U.K.-based EkkoSense is the first IoT-enabled wireless sensor for data centers. Its low cost enables its use in large quantities to provide true real-time thermal management of data centers and other critical facilities.

The sensor features a local display of the measured temperature and relative humidity values, with additional screens that can be cycled through to show temperature profiles over the last hour, 24 hours and seven days for quick thermal assessment on-site. Wireless EkkoSensors are entirely self-contained and battery-powered for simpler installation.

The sensors provide a direct sensor-to-hub linkage to keep the radio network simple and deliver predictable levels of battery life and performance. All temperature and humidity data is encrypted with 128-bit AES encryption before transmission to an EkkoHub wireless data receiver for forwarding to EkkoSense’s cloud-based EkkoSoft 3D visualization and analysis software.

Non-Silicone TIMs for LED Cooling

Non-silicone TIMs from Electrolube can be used in LED cooling applications. (Electrolube)

Electrolube has introduced non-silicone TIMs for use in LED cooling in response to silicone-related issues with long term reliability, contamination and availability. Heat can substantially impacts the lifetime, cost and performance of an LED luminaire. Without suitable thermal management, a luminaire will be thermally inefficient, have a reduced operating life and high maintenance costs.

Electrolube’s non-silicone thermal pastes include HTC (Heat Transfer Compound) and HTCP (Heat Transfer Compound Plus), which avoid silicone migration onto electrical contacts. Potential issues with silicone migration include high contact resistance, arcing, soldering problems and mechanical wear.

Electrolube’s X range of non-silicone thermal products features the low viscosity HTCX, for ease of use, and HTCPX for gap filling applications. These ‘Xtra’ versions of HTC and HTCP provide increased thermal conductivity, lower oil-bleed and lower evaporation weight loss, making them comparable or better than some silicone-based materials.

Heat Insulating Sheets Have Air-Like Conductivity

Panasonic introduced NABSIS (nano silica balloon insulator sheet) composed of an aerogel and polyester fiber. (Panasonic)

Panasonic, a worldwide leader in thermal protection products has introduced NASBIS insulating sheets. NASBIS stands for Nano Silica Balloon Insulator Sheet. This new addition to Panasonic’s line of thermal management solutions is a thin, flexible Nano-Silica heat insulation material composed of silica aerogel and polyester fiber that has high thermal isolative properties.

The thermal conductivity of NASBIS is comparable to that of air, making it a very attractive material for heat insulation. NASBIS sheets protect thermally weak products from heat and work to maintain a uniform temperature throughout a device. When combined in a stack with Panasonic’s pyrolytic graphite sheet or PGS, NASBIS insulating sheets enable the control of heat direction.

The proprietary composite material provides greater heat insulating performance. Applications include wearable devices, LED modules and drivers, micro inverters, IGBT modules, radio devices, notebook and tablet PCs, satellites and cameras.

High Performance CPU Cooler for Gaming PCs

The HEX 2.0 CPU Cooler from Phononic pushes a processor up to 140 watts TDP. (Phononic)

The HEX 2.0 CPU cooler from Phononic offers superb performance in a compact design that allows users to push their processor up to 140 watts TDP (thermal design power) and beyond. The cooler’s innovative design combines a small form factor measuring just 125 x 112 x 95 millimeters, unique styling via a swappable 92-millimeter fan, and customizable LED illumination.

Users can select cooling profiles, change LED colors and keep up-to-date with the latest firmware through the HEX 2.0 software application dashboard. The HEX 2.0 offers an alternative for high performance cooling without going to a much larger heat sink/fan or a water-based solution.

The HEX 2.0 has an integrated electronic control board and utilizes an active and passive cooling design to deliver high performance cooling only when necessary, minimizing the power and fan noise. The HEX 2.0 requires zero power consumption when the CPU is under low stress, up to a peak power of 35 Watts when the CPU is under stress or in overclocked mode.

High Performance, Low Compression Gap Filler

Henkel introduced the new GAP PAD HC 5.0 to manage high power density components. (Henkel)

The new GAP PAD HC 5.0 for Henkel is designed to manage the heat generated by today’s reduced form factor, high power density components. A soft and compliant gap filling material, GAP PAD HC 5.0 has a thermal conductivity of 5.0 W/mK and delivers outstanding thermal performance with very low compression stress.

The low modulus and unique filler package is ideal for applications that require minimal component or board stress during assembly, yet demand high heat transfer across the interface with very low thermal resistance. GAP PAD HC 5.0 allows for superb interfacing and wet out, even to rough surfaces and topographies, which ensures uniform material coverage across the component and heat sink for maximum performance.

Compared to previous-generation materials, GAP PAD HC 5.0 offers better handling, an enhanced dielectric constant, improved volume resistivity and better thermal impedance performance. Manufactured with a natural tack on both sides, GAP PAD HC 5.0 contains no thermally-impeding adhesive layers and is available in a range of thickness from 0.508 mm up to 3.175 mm.

Top Mount Enclosure Air Conditioner

Thermal Edge has released a new top mount air conditioner for enclosures. (Thermal Edge)

Thermal Edge now provides the Top Mount series of enclosure air conditioners. Mounting an air conditioner on the sides or doors of an electrical enclosure is not always possible due to spacing constraints.

To accommodate these applications, Thermal Edge has added a series of Top Mount enclosure air conditioners in a variety of capacities and voltages that provides the same unique features as their side mounted models, including an active condensate evaporation system, digital controller, and a thermal expansion valve to maintain cooling capacity over a broad ambient temperature range.

The Top Mount models also offer a unique option that allows engineers to enhance the airflow inside the cabinet by adjusting the distance between the cold air outlet and the warm air intake. The Top Mount models are designed to be filter free (filters optional) and are available with 6,000 and 8,000 BTU/H performance. The air conditioners are available in NEMA Types 12, 4 and 4X.

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