In this article, Qpedia will explore some innovative thermal management products that have recently hit the market. These new thermal products encompass a variety of thermal management applications from CPU coolers to thermal interface materials (TIM) to sensors and test instruments to advanced materials and concepts.
Metal Oxide Microparticle Thermal Compound
NT-H2 is a second generation, hybrid thermal compound from Noctua. The compound uses a mixture of metal oxide microparticles for lower thermal resistance and reduced bond-line thickness at typical mounting pressures. Up to 2°C lower temperatures were attained In Noctua’s standardized internal testing at various platforms and heat loads. NT-H2 thermal compound does not require a break-in period. Because of its long-term stability, it can be used on the CPU for up to five years.
Both pastes are electrically non-conductive and non-corroding, so there is no risk of short circuits and they’re safe to use with all types of heat sinks. NT-H2 thermal compound will come in standard 3.5g and extra-large 10g package that come with a supply of pre-moistened wipes for effective surface cleaning.
Form in Place Liquid Thermal Gap Filler is Peel-able
The new Bergquist Gap Filler TGF 1500RW offers thermal interface material (TIM) re-workability without sacrificing thermal conductivity or automation performance in a single material. TGF 1500RW is a one-part, cure-in-place liquid gap filler that can be used with automated dispensing equipment for high-volume manufacturing operations.
Because the material is applied as a liquid, it is ideal for miniaturized, high-density assemblies and complex architectures, penetrating small gaps for complete coverage. Once cured, the material provides optimized surface contact and thermal transfer with a 1.5 W/m-K thermal conductivity and delivers excellent low and high temperature mechanical and chemical stability.
While traditional cure-in-place TIMs generally require very high force for disassembly, TGF 1500RW peels away cleanly from contact surfaces to safeguard delicate componentry and preserve product value.
All-In-One Liquid Cooler for Demanding Workloads
Asetek has introduced its highest performance all-in-one (AIO) liquid cooler, designed in collaboration with Intel. The Asetek 690LX-PN liquid cooler is approved for the Intel Xeon W-3175X processor. The AIO liquid cooler features extreme performance to enable overclocking up to 500 watts (W) and provides stable operation for demanding workstation and content creation workloads.
The 690LX-PN cooler uses the new Gen6-s pump from Asetek – the same core technology that is used to cool some of the world’s fastest supercomputers and includes a highly efficient copper radiator. A large cold plate covers the entire CPU package and ensures optimal plate-to-package thermal contact.
The 690LX-PN liquid cooler is approved to cool the new 28-core/56 thread Intel Xeon W-3175X processor, which offers up to 4.3 GHz single-core turbo frequency.
Data Center Racks Enhance Thermal Management
The NRSe series of data center racks from NetRack helps achieve effective air flow management at the rack level. These racks are manufactured out of steel sheet punched, formed, welded and powder coated with highest quality standards under stringent ISO 9001-2008 Manufacturing and Quality management system.
Thermal management with air seal kit and blanking panels and bottom brushed access with enhanced grounding and bonding assures 100 per cent compatibility with all equipment, conforming to general industry standards. Features like Intelligent Locking and Rack Monitoring add to easy management of data centers.
Silicon-Based Microchannel Heat Sink
Imec, a research and innovation hub in nanoelectronics and digital technologies has introduced a silicon-based compact microchannel heat sink that enables high heat flux dissipation. When assembled to a high performance chip for cooling, the Imec heat sink achieves a low total thermal resistance of 0.34-0.28 K/W at less than 2 W pump power. It is directly integrable in the semiconductor infrastructure.
The Si-based microchannel heat sinks are fabricated separately and then interfaced to the back side of a heat-dissipating chip. Using an optimized Cu/Sn-Au interface, very low thermal contact resistance is achieved between both parts.
Because the fluidic performance and thermal behavior can be predicted with a high degree of accuracy, the new microcooler can be tailored according to external system constraints such as space and liquid supply.
Air to Air Heat Exchangers for Closed Loop Systems
The new Pfannenberg PKS Series Air to Air Heat Exchangers use the Pfannenberg Kinetic System next generation cooling technology that out-performs conventional heat exchangers. The units are lightweight and easy to install, while air to air technology takes advantage of a cooler ambient environment when closed-loop cooling is required, sealing against gas, humidity, and dust.
Designed for indoor, outdoor, remote and washdown applications that require a closed loop system to protect electronics, the PKS Series of exchangers are ideal for keeping rain and dust from sensors and drives on outdoor systems and protecting against corrosion and contamination.
For more information about Advanced Thermal Solutions, Inc. (ATS) thermal management consulting and design services, visit https://www.qats.com/consulting or contact ATS at 781.769.2800 or ats-hq@qats.com. To register for Qpedia and to get access to its archives, visit https://www.qats.com/Qpedia-Thermal-eMagazine.