Author Archives: akoss

The use of liquid metals as a cooling method is on the peripherery of high performance electronics thermal management. The thermal conductivity of liquid metals can be orders of magnitude greater than water, glycol, or engineered dielectric fluids.

This means an equivilent amount of cooling can be performed using much less mass flow rate. The requirements for pumping and pressure heads are reduced, which can in turn increase reliability.

To read more about this important technology, what’s needed to make it work, and how you might apply it in place of standard heat sinks for your thermal engineering and thermal design work, please click to our white paper article in QPedia, “Fundamentals of Magenetofluiddynamic Pumps“.