Category Archives: heat sink

Heat Sink Types: The Pros and Cons (part 1 of 2)

At ATS we design many heat sinks. In fact, as of today, we have over 4000 different heat sink designs in our library, plus all our off the shelf designs. It’s likely we have designs that, with minor modifications will fit any thermal challenge.  But despite having over 4000+ designs in our library, there are some very basic designs that form the basis for all the variations in the market. In this two-part series, we want to cover these basic designs and give you the pros and cons. At the end of our series, we’ll have a concise cheat sheet for you for easy reference. Here in part 1 we’ll talk about the following heat sink types: Extruded, Stamped, Bonded Fin, and Folded Fin.

Extruded heat sinks are the “utility infielder” of our industry. They are relatively inexpensive, once a design is made the manufacturing is highly automated, and, in most cases, aluminum is the material used. Aluminum is cheap and a relatively good thermal conductor. They are used for most general applications, depending on the design, fin pitch and base thickness they can be low to high performers, and, as I mentioned earlier, they are cost effective.  The basic con is they are limited in their dimensions being that they are based on an aluminum extrusion with a given width.

108K different push pin heat sink assembly configurations featuring 3 different pitch heat sink types, 3 different fin geometries, brass and plastic push pins

 

Stamped heat sinks are literally made from a piece of metal being stamped out in a press. A tool is made to the form of the heat sink, then, metal is moved through a stamping machine and the stamp creates the heat sinks. This too is a highly automated process and, as you might guess, once the heat sink design is complete and the prototypes OK’d, then the actual production is a relatively “simple”.  Stamped heat sinks are generally use for low power applications since they are typically low in performance. They are cheap, even less expensive than extruded heat sinks.

Bonded fin heat sinks are generally geared towards physically large applications that require moderate performance. Bonded fin heat sinks are made by bonding individual fins of metal to a base. The bonding can be done by a thermal epoxy (somewhat cost-effective) or by brazing (expensive). The main advantage to this type of heat sink is it can be used for large applications, such as a DC-DC Brick, or an electric welder. The main drawback is manufacturing process isn’t automated on the scale of stamped, extruded, or folded fin heat sinks, resulting in a high cost for bonded fin.

Folded fin heat sinks are best when there is ducted air, that is, air flow is directed through a duct of some kind directly at the heat sink. Fin pitch can be optimized in the manufacturing process making this kind of heat sink, with ducted air flow, very high performing. Also, because the heat sink material is folded, there can be a big increase in surface area over which heat can be dissipated. Fold fin heat sinks have high heat flux density [1]. The drawbacks to this type of heat sink are the cost including manufacturing and ducting necessary in your system. In some cases, plastic can be used to create a folded fin heat sink.

In part 2 of our 2 part series on heat sink types, we’ll look at active heat sinks, forged, swaged, single fin assembly and skived.

Need a heat sink like the ones we discussed here? Then please check out our eSHOP to purchase online, visit our heat sink section to see our complete list, or email us at [email protected] with your questions and we’ll respond as quick as we can!

And don’t forget our QoolPCB program, Cool an entire PCB, all heat sinks included, for $50!!

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References:

[1] Heat Flux or Thermal Flux is the rate of heat energy transfer through a surface. Heat flux density is the heat flux unit per area http://en.wikipedia.org/wiki/Heat_flux

How to increase a heat sinks surface area without increasing its size using microscopic texturing (part 2 of 2)

In part 1 of our 2 part series, “How to increase a heat sinks surface area without increasing its size using microscopic texturing” we covered what this technology is, options to apply, and under what conditions it is effective. In part 2 we’ll cover accurate surface texture characterization.

Accurate surface texture characterization is often needed to control and fine tune the texturing process. Surface texture is not a measurable quantity but it is possible to measure some of its intrinsic characteristics and parameters. These parameters have been developed based on data obtained using a stylus-based instrument. This device, known as 3D Surface Profilers, uses a diamond-tipped stylus to detect minute surface variations and topology. The stylus is mechanically couples to an LVDT (Linear Variable Differential Transformer). The sample is precisely guided underneath the stylus while the stylus rides over the surface, detecting roughness variations as small as ten angstroms in height [7]. The LVDT produces an analog signal in response to the stylus movement. This signal is then sent to a computer data acquisition system where the signal is amplified, digitized and analyzed.

The main parameters of a texture surface are waviness and roughness. These parameters are repetitive and random irregularities from the normal surface that forms the three dimensional topography of the surface. The spacing of these irregularities is what differentiates waviness from roughness. Two or more spacings between irregularities will cause a wavy surface. However, as the space between them decreases excessively, the resulting surface would become flat but rough. A typical surface exhibits roughness superimposed over waviness [7]. A sophisticated Profiler implements advanced high and low pass filters in order to measure each parameter separately while filtering out the other.

The one parameter that is standardized all over the world and is specified and measured far more frequently than any other is the arithmetic average roughness height, or roughness average, designated by Ra. It is defined as the arithmetic mean of the departures of the profile from the mean line. An approximation of the average roughness, Ra is obtained by adding the Y values without regard to sign and dividing the sum by the number of the samples. Ra is used to detect general deviation in overall profile height but it is incapable of detecting differences in spacing and its distribution [7].

Advanced Thermal Solutions Roughness AverageRoughness Average, Ra Is Sum Total Of The Maximum Valley
And Maximum Peak Of Roughness [7].

Another parameter that is often used in analysis of a texture surface is the root-mean-square average of the departures of the roughness profile from the mean line. This is known as RMS and designated by Rq. RMS or Rq has statistical significance because it represents the standard deviation of the profile heights and it is used in the more complex analysis of skewness, the measure of symmetry of a profile about the mean line [7].

Advanced Thermal Solutions value of roughnessRMS Value of Roughness [7].

A well equipped Profiler system includes both the Ra and Rq standard analytical functions as well as other widely used parameters to analyze surface roughness and waviness. Contrary to general beliefs radiation heat transfer could be as important as convection heat transfer in electronics cooling, especially in natural convection and low-airflow applications. To further enhance radiation, surface treatments such as surface anodize and surface texturing is a viable option that could increase effective surface area and increases surface emissivity. Surface Anodize also has the advantage of corrosion and wear resistance and it also electrically isolates the cooling components from the electrically charged electronics.

References:

  1. Radiation Heat Transfer and Surface Area Treatment ,Qpedia Thermal eMagazine, June 2008.
  2. Edwards, J., Coating and Surface Treatment Systems for Metals, Finishing Publications Ltd. and ASM International, 1997.
  3. Aluminum Anodizer Council Web Forum, http://www.anodizing.org/index.html.
  4. Gustavsen, A., Berdahl, P. Spectral Emissivity Of Anodized Aluminum And Thermal Transmittance Of Aluminum Windows Frames, Nordic Jounnal Of Building Physics, Vol.3, 2003.
  5. Ozisik Necati, M., Heat Transfer A Basic Approach, McGraw Hill, 1985.
  6. Highly Emissive Ion Beam Textured Surfaces For Improved Cooling Of Electronic Devices, Electronics Cooling Magazine, September 1997.
  7. Chi, T. , Ballinger, R., Olds, R., Zecchino, M., Surface Texture analysis using Dektak Stylus Profilers, Veeco Instrument Inc.http://www.veeco.com/pdfs/appnotes/an525%20_dektak_surface_97.pdf

How to increase a heat sinks surface area without increasing its size using microscopic texturing (part 1 of 2)

Microscopic texturing is a method to increase the effective How to increase a heat sinks surface area without increasing the heat sink size. We’ll explore this compelling strategy for making heat sinks more efficient in this two part article series. Part 1 covers what this technology is, options to apply, and under what conditions it is effective.

Microscopic texturing not only increases the surface area, it also increases the emissivity of the surfaces at the same time. However, while this surface enhancement can be used for boiling heat transfer, it is of little importance for air cooling. This is due to the fact that radiation heat transfer is primarily a surface phenomenon and certain texturing processes that provide sufficient control over surface feature morphology could increase surface emissivity [6].

There are several surface texturing methods. A common one is chemical etching. Another is ion beam texturing where ion beam bombardment is used to selectively etch materials in applications from electronics substrate pattering to the creation of high surface-area pace maker electrode tips. It is based on a phenomenon known as sputtering, which is the process of removing material from a surface at the atomic level through collisions between energetic ions and substrate atoms. Because it is done on such a fine scale, this process provides a great degree of control over surface features. In principal, it is used to create almost any type of surface topography, whether smoother or rougher than the original surface [6]. Examples of ion beam texturing are shown in the following figure:

Ion Beam Textured Surface to enhance heat sink emmisivity

Ion beam textured surfaces typically absorb over 90% of the incident light across a wide range of wavelengths, implying that the surface is highly emissive. Such textured surfaces would be ideal for electronics cooling using liquids in boiling mode due to its significantly increased surface area. Increased surface area would enhance radiation as well as convection heat transfer provided that the texturing will provide excellent surface for pool boiling heat transfer often seen in cooling of high power electronics. Surface texturing will not be useful for applications using unducted low-speed airflow, since air cannot flow easily in the microstructures.

In part 2 we’ll cover accurate surface texture characterization.

References:

  1. Radiation Heat Transfer and Surface Area Treatment ,Qpedia Thermal eMagazine, June 2008.
  2. Edwards, J., Coating and Surface Treatment Systems for Metals, Finishing Publications Ltd. and ASM International, 1997.
  3. Aluminum Anodizer Council Web Forum, http://www.anodizing.org/index.html.
  4. Gustavsen, A., Berdahl, P. Spectral Emissivity Of Anodized Aluminum And Thermal Transmittance Of Aluminum Windows Frames, Nordic Jounnal Of Building Physics, Vol.3, 2003.
  5. Ozisik Necati, M., Heat Transfer A Basic Approach, McGraw Hill, 1985.
  6. Highly Emissive Ion Beam Textured Surfaces For Improved Cooling Of Electronic Devices, Electronics Cooling Magazine, September 1997.
  7. Chi, T. , Ballinger, R., Olds, R., Zecchino, M., Surface Texture analysis using Dektak Stylus Profilers, Veeco Instrument Inc.http://www.veeco.com/pdfs/appnotes/an525%20_dektak_surface_97.pdf

How Heat Sink Anodization Improves Thermal Performance (part 2 of 2)

In part 1 of this 2 part article, we discussed heat sink anodization, and how it affects radiation cooling in thermal management. In part 2 we’ll cover the heat sink anodization process and different types of anodization.

A typical anodizing process has five steps: cleaning, pretreatment, anodizing, coloring and sealing. First, alkaline and acidic cleaners are used to remove any residual grease or dirt on the surface. Next, the surface is etched using sodium hydroxide to remove minor surface imperfections. At this stage, a thin layer of metal is removed to create a matte or dull finish. This surface is then brightened to a near mirror finish with a concentrated mixture of phosphoric and nitric acids which chemically smooths the metal surface. The surface is now ready to be anodized by passing an electrical current through an acid electrolyte bath in which the metal is immersed. The coating thickness and surface characteristics are tightly controlled to meet end product specifications [3].

Coloring can be achieved in a number of different ways. The most technically advanced color quality is obtained from the two-step electrolytic coloring method. The anodized part is immersed in a bath containing an inorganic metal salt, and then current is applied which deposits the salt in the base of the pores. The resulting color is dependent on the metal used, the processing conditions and the dye intensity of the organic dyes. Commonly used metals in inorganic salt baths include tin, cobalt, nickel, and copper [3].

Even though the main concept of surface anodizing is the same, the process could differ in terms of the acidic electrolyte used. One of these is chromic acid, or type 1, anodizing. In this process, the color will vary from clear to dark gray depending on the alloy. Copper alloys only yield gray colors. The thickness of the surface anodizing for this process usually ranges from 0.5 to 7.6 microns [3]. Because the anodized thickness in type I is not thick, it is not as readily dyed as the other types of anodized surfaces uses sulfuric acid. This is known as type II anodizing and can produce an anodized layer with a thickness from 1.8 to 25.4 microns. Because the thickness of type II anodizing is sufficiently large, an organic dye or color could be easily applied with the two-step electrolytic coloring method.

Type III anodizing refers to hard coat anodizing (hard anodizing) with a thickness from 12.7 to 115 microns. This method is often used where the environment is harsh and extreme and the anodizing must protect the part against long term corrosion, weather and wear damages. The thickness for these three types of surface anodizing is summarized in Table 1.

heat sink anodization types

References:

  1. Radiation Heat Transfer and Surface Area Treatment, Qpedia Thermal eMagazine, June 2008.
  2. Edwards, J., Coating and Surface Treatment Systems for Metals, Finishing Publications Ltd. and ASM International, 1997.
  3. Aluminum Anodizer Council Web Forum.
  4. Gustavsen, A. and Berdahl, P. Spectral Emissivity Of Anodized Aluminum And Thermal Transmittance Of Aluminum Windows Frames, Nordic Jounnal Of Building Physics, Vol.3, 2003.
  5. Ozisik, N.,Heat Transfer: A Basic Approach, McGraw-Hill, 1984.
  6. Highly Emissive Ion Beam Textured Surfaces for Improved Cooling of Electronic Devices, Electronics Cooling Magazine, September 1997.
  7. Chi, T. , Ballinger, R., Olds, R., and Zecchino, M., Surface Texture Analysis Using Dektak Stylus Profilers, Veeco Instruments, Inc.

How Heat Sink Anodization Improves Thermal Performance (part 1 of 2)

Radiation heat transfer can be as important as convection heat transfer in electronics cooling, especially in natural convection and low-airflow applications. In part 1 of this 2 part article, we’ll talk a bit about heat sink anodization, and how it affects radiation cooling in thermal management. In part 2 we’ll cover the heat sink anodization process and different types of anodization.

Depending on the type of surface treatment used, radiation heat transfer is enhanced in two distinct ways: by increasing the emissivity of the surface or by increasing the surface area. The effect of both these parameters is shown in the Stephen-Boltzmann Equation[1]:

Radiation Heat Transfer and Surface Area Treatment For a Heat Sink

Where, q is the amount of radiation energy that is exchanged between two bodies whose temperatures are TH and TC. FHC is the surface shape factor, ƒ is the Stephen-Boltzmann coefficient, and ε and A are the emissivity and area of the surface, respectively.

The Stephen-Boltzmann Equation indicates that the temperature difference between the hot and cold bodies is the driver for radiation heat transfer. However, in almost all electronics applications, neither of these temperatures is a controlled parameter. Therefore, radiation heat transfer can only be enhanced by increasing the emissivity and surface area.

The most common method of surface treatment in electronics cooling is surface anodizing. Anodizing can be an environmentally safe electrochemical process that thickens and toughens the naturally occurring protective oxide layer on the surface of metal parts. Surface anodizing changes the microscopic texture of a metal, making the surface durable, corrosion and weather resistant. In the process, the metal forms the anode (the positive electrode) of an electrolytic circuit. Through an acidic electrolytic solution, the electrical current releases hydrogen at the cathode (the negative electrode) and oxygen at the surface of the metal anode (the positive electrode), building up a deposit of metal oxide. The acid action is balanced with the oxidation rate to form a coating with microscopic pores, 10-150 nm in diameter. The thickness of the metal oxide depends on the anodizing method and is anywhere from 0.5 to 115 microns thick. It is controlled by electrolyte concentration, acidity, solution temperature, and the process electrical current and voltage [2].

A typical anodizing process will form an oxidized layer on a metal surface with a thickness ranging anywhere from 1.8 to 25 microns. However, some industrial applications require parts with exceptionally high wear resistance. The process used on such surfaces is termed hard anodizing and produces surfaces that are thick compared to standard anodizing. The coating of a hard anodized surface can be greater than 25 microns thick and is made under special conditions of high current density, very low temperature and the use of special electrolytes [3].

Various protective benefits and aesthetically pleasing colors have extended the use of anodization to many industrial and commercial applications. For electronics cooling, however, the advantages of surface anodizing are the dielectric isolation of the cooling components from their electronics environment, and the significant increase in their surface emissivity. The increase in the emissivity coefficient on the anodized surfaces of heat exchangers, electronics cabinets and enclosures, heat sinks, etc. is typically on the order of 0.83 to 0.86 [4]. When compared to the emissivity coefficient of bare aluminum, 0.04 to 0.06 [5], the importance and significance of enhancement of radiation heat transfer would become evident.

The pores created by acidic anodizing on aluminum can easily absorb dyes. Colored dyes are often used on heat sinks for cosmetic and marketing purposes. The color of anodization has no impact on radiation heat transfer. A clear anodized surface has the same emissive characteristics as a black anodized surface. To further protect the surface of dyed anodized heat sinks from corrosion, they are usually sealed by immersion in boiling hot de-ionized water or steam [2].

In part 2 we’ll cover the heat sinks anodization process and different types of anodization.  “How Heat Sink Anodization Improves Thermal Performance – Part 2”

push pin heat sinks

References:

  1. Radiation Heat Transfer and Surface Area Treatment, Qpedia Thermal eMagazine, June 2008.
  2. Edwards, J., Coating and Surface Treatment Systems for Metals, Finishing Publications Ltd. and ASM International, 1997.
  3. Aluminum Anodizer Council Web Forum.
  4. Gustavsen, A. and Berdahl, P. Spectral Emissivity Of Anodized Aluminum And Thermal Transmittance Of Aluminum Windows Frames, Nordic Jounnal Of Building Physics, Vol.3, 2003.
  5. Ozisik, N.,Heat Transfer: A Basic Approach, McGraw-Hill, 1984.
  6. Highly Emissive Ion Beam Textured Surfaces for Improved Cooling of Electronic Devices, Electronics Cooling Magazine, September 1997.
  7. Chi, T. , Ballinger, R., Olds, R., and Zecchino, M., Surface Texture Analysis Using Dektak Stylus Profilers, Veeco Instruments, Inc.