Category Archives: Liquid Cooling

What is a Heat Pipe and How Does it work in Thermal Management? (part 1 of 2)

Heat Pipes have been called Heat Superconductors! In this two part series we’ll talk about what a heat pipe, how they are made, compare them with heat sinks, and talk about performance in various thermal management applications.

Diagram of a basic heat pipeFigure 1 Schematic View of a Heat Pipe [1]

Heat pipes are transport mechanisms that can carry heat fluxes ranging from 10 W/cm2 to 20 KW/cm2 at a very fast speed. Essentially, they can be considered as heat super conductors. Heat pipes can be used either as a means to transport heat from one location to another, or as a means to isothermalize the temperature distribution.

The first heat pipe was tested at Los Alamos National Laboratory in 1963. Since then, heat pipes have been used in such diverse applications as laptop computers, spacecraft, plastic injection molders, medical devices, and lighting systems. The operation of a heat pipe is described in Figure 1.

A heat pipe has three sections: the evaporator, the adiabatic, and the condenser. The interior of the pipe is covered with a wick, and the pipe is partially filled with a liquid such as water. When the evaporator section (Le) is exposed to a heat source, the liquid inside vaporizes and the pressure in that section increases. The increased pressure causes the vapor to flow at a fast speed toward the condenser section of the heat pipe (Lc). The vapor in the condenser section loses heat to the integral heat sink and is converted back to liquid by the transfer of the latent heat of vaporization to the condenser. The liquid is then pumped back to the evaporator through the wick capillary action. The middle section of the heat pipe (La), the adiabatic portion, has a very small temperature difference.

Chart showing pressure drop distribution in a heat sinkFigure 2 Pressure Drop Distribution in a Heat Pipe [1]

Figure 2 shows the pressure drop distribution inside a heat pipe. In order for the capillary force to drive the vapor, the capillary pressure of the wick should exceed the pressure difference between the vapor and the liquid at the evaporator. The graph also shows that if the heat pipe is operated against the force of gravity, the liquid undergoes a larger pressure drop. The result is less pumping of the wick with reduced heat transfer. The amount of heat transfer decrease depends on the particular heat pipe.

A typical heat pipe is made of the following:

  1. Metallic pipe: The metal can be aluminum, copper or stainless steel. It must be compatible with the working fluid to prevent chemical reactions, such as oxidation.
  2. Working fluid: Several types of fluids have been used to date. These include methane, water, ammonia, and sodium. Choice of fluid also depends on the operating temperature range.
  3. Wick: The wick structure comes in different shapes and materials. Figure 3 shows the profiles of common wick types: axial groove, fine fiber, screen mesh, and sintering. Each wick has its own characteristics. For example, the axial groove has good conductivity, poor flow against gravity, and low thermal resistance.
    Conversely, a sintering wick has excellent flow in the opposite direction of gravity, but has high thermal resistance.

Different Wick Structures in a Heat PipeFigure 3 Different Wick Structures

That ends part 1 and in part 2 we’ll address factors that can limit a heat pipes effectiveness, differences in the thermal performance of various heat pipe types, and the spreading resistance of different materials.

Have you got a question on heat pipes or their application? How about an interest in bringing ATS’s team of experienced thermal engineers into one of your projects? You can reach us by visiting http://www.qats.com Purchase heat sinks through our Heat Sink eShop or email us at [email protected] or give us a call at 781-769-2800

References:
1. Faghri, A. Heat Pipe Science and Technology Taylor & Francis, 1995.
2. Thermacore Internation, Inc., www.thermacore.com.
3. Xiong, D., Azar, K., Tavossoli, B., Experimental Study on a Hybrid

ATS Webinar Selecting and Designing Liquid Cold Plates for Deployment in Electronic Systems

Advanced Thermal Solutions (ATS, Inc. www.qats.com) will be hosting a free webinar, led by Dr. Kaveh Azar, on selecting and designing liquid cold plates for deployment in electronic systems on August 26th at 2PM EST.

This webinar provides the best practices for implementing a liquid cooling system at the device level. Topics covered include:

  • When should you cool with liquid?
  • What is the right liquid cooling system to use?
  • What is a cold plate and how and when to best implement them

To join this webinar on August 26th, click to our web site to register here:  Selecting and Designing Liquid Cold Plates for Deployment in Electronic Systems

ATS Labs Thermal Management White Paper: Liquid Cooling Systems for Electronics and Their Components

With Asetek’s very cool announcement of their closed loop liquid cooling system for the thermal management of a PC, our thermal engineering team thought that offering up a white paper on what components a liquid cooling system are composed of might be of interest to our followers.

In its most basic form, the purpose of a liquid cooling system is to transport heat from a device to a remote heat exchanger. The liquid cooling system helps to reduce the thermal spreading resistance associated with the movement of heat from a small component to an extended surface. This reduction of spreading resistance is critical in applications with very high heat flux and limited space in the immediate area for heat dissipation. Examples include laptops, IGBTs, traction motors and radar arrays.

With the ongoing increase in power dissipation, and tightening restriction on packaging, the need for more sophisticated and compact liquid cooling systems is clear. This paper will describe the classic setup of a liquid cooled loop, as well as several examples of novel designs.

You can grab your own copy by clicking on the link here:  “Liquid Cooling Systems and Their Components“

A liquid cooling system for thermal management of desktops hits the mark: An ATS thermal management technology analysis

liquid cooling from Asetek seen at heatsinks.wordpress.comGizMag, an online magazine covering invention, innovation and emerging technologies, reported on a very cool find from Asetek, liquid cooling for a desktop computer that is both innovative and usable. ATS’s thermal team did a bit of paper analysis on their design and feel that, Asetek has done a wonderful job by first developing a low profile pump with adequate pressure drop and flow rate to accommodate their design requirements, and secondly, provide excellent packaging to deliver the high-speed computing in a very slick and ergonomically attractive desktop computer.

The design is nicely done and there are a couple of areas worthy for Asetek engineering to expand on the rear of the monitor and its support are used as intake of cooler air and exhaust of the heated air through the heat exchanger. Because of its random use at customer premises, there is a high possibility of such vents being blocked accidentally. Such accidental blockages or reduction of cross sectional area by insects or other means will adversely impact thermal performance and may create significant slow down of the computer to its eventual failure. It will be worthy to know how this issue, that plays a pivotal role in the performance of the design, is addressed by the engineering team.

We must also add that Asetek approach exemplifies excellence in product development and R&D. They clearly had a vision of what the final product was supposed to do and look like. They put together a focused R&D effort to develop the technology and the design infrastructure required to materialize this concept. We applaud them for such an accomplishment and wish them success in market introduction of this product.

Jet Impingement Cooling Provides High Heat Transfer Rates for Thermal Management of High Power Electronics

Jet impingement Cooling is an attractive mechanism for thermal management because of its capability for high heat transfer rates. This cooling method has been used in many industrial applications such as annealing metals, cooling gas turbine blades, cooling grinding processes and cooling photovoltaic cells. Over the past 30 years, jet impingement has been explored as a cooling option for microelectronics. Liquid jet impingement is being actively explored for cooling power electronics components, in particular the insulated gate bipolar transistors (IGBTs) used in the inverters of hybrid automobiles. This ATS Thermal Labs White Paper article discusses single-phase jet impingement and its effectiveness for cooling electronics components.

To get your copy of this ATS Thermal Labs white paper, click to qats.com at this link: “Jet Impingement Cooling”

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