Category Archives: Qpedia Thermal eMagazine

Qpedia, Issue 98, has just been released! Download the issue.

Featured articles in this issue include:

COOLING IGBTS USING VAPORIZABLE DIELECTRIC FLUIDS

Dramatic increases in both power density and total power dissipation for power electronic systems, especially vehicle and airborne systems, together with demands for increased performance and speed of response, limit the application of a traditional forced convection air-cooled or a single phase liquid system. This article discusses how the newly developed Vaporizable Dielectric Fluid (VDF) cooling system, uses common dielectric refrigerants to effectively cool IGBT devices.

OPTIMAL HEAT SINK DESIGN FOR NATURAL CONVECTION IN VERTICAL ORIENTATION

Many tough-to-cool electronics applications don’t allow the use of fans, therefore heat sink solutions need to be optimized through natural convection. This article explores and compares the optimal design of traditional pin, straight fin and nontraditional heat sink designs in natural convection.

FUNDAMENTALS: HEAT PIPE HEAT TRANSPORT CAPABILITY

In this new section, Qpedia reviews fundamental thermal engineering principles, calculations and equations needed for the successful cooling of electronics. In this issue we discuss the heat transport capabilities and limitations of heat pipes.

INDUSTRY DEVELOPMENTS: MILITARY ELECTRONICS COOLING

Modern militaries around the world are equipped with very hot-running electronics that must reliably provide high levels of performance in critical situations. In addition, thermal management for military electronics can be extremely challenging, due to the strict size, weight and power (SWaP) requirements, rugged use, harsh environments, and cost restraints. This article presents recent cooling developments for military electronics.

TECHNOLOGY REVIEW: LED THERMAL MANAGEMENT

Qpedia reviews innovative technologies developed for electronics cooling applications. This section presents selected patents that were awarded to developers around the world to address cooling challenges. In this issue our spotlight is on thermal management systems for LED lighting.

COOLING NEWS

The latest products & technology from around the thermal management industry.

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Qpedia, Issue 96 has just been released and can be downloaded at: http://www.qats.com/Qpedia-Thermal-eMagazine/Back-Issues

Featured articles include:

Using Integrated Planar Thermosyphon PCBs to Enhance Cooling of High Brightness LEDs

Because high brightness LEDs have a heat flux that reaches an excess of 80 W/cm², thermal management is critical to ensure the LED properly performs. This article discusses the promising idea of improving the heat dissipation from the LED package to the PCB using thermosyphons. While the concept of a planar thermosyphon to enhance heat transfer by itself is not new, integrating it into a printed circuit board is innovative and appears to be a promising technology.

Nanofluids in Heat Pipes

The thermophysical properties of the working fluid have a direct impact on a heat pipe’s performance. Water is the most common and effective heat transfer fluid in the electronics cooling industry, but its properties can be enhanced by adding nano-particles. This article discusses what nanofluids are available and their benefits on a heat pipe’s performance.

Fundamentals: Effective Thermal Conductivity of a Heat Pipe

In this new section, Qpedia reviews fundamental thermal engineering principles, calculations and equations needed for the successful cooling of electronics. This issue we discuss how to identify the thermal conductivity of a heat pipe.

Industry Developments: Cooling COB LEDs

Chip-on-board (COB) LED’s are one of the most widely used types of LED packaging. However, the tight spacing between the LEDs and small light emitting surface that make COB LEDs attractive, also present high heat fluxes that must be addressed. Because COBs have such a small surface area, addressing power density is the primary challenge. This article reviews the recent methods that LED manufacturers are using to cool COB LEDs.

Technology Review: Phase Change Materials

Qpedia reviews innovative technologies developed for electronics cooling applications. This section presents selected patents that were awarded to developers around the world to address cooling challenges. In this issue our spotlight is on phase change materials.

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Qpedia Thermal eMagazine, Issue 95, has just been released! Download the Issue.

Fundamentals: Basic Definition of Thermal Resistance

In addition to the standard featured articles, industry developments, technology review and cooling news that are featured every month, Qpedia has introduced a new section called “Fundamentals”. This new section will review fundamental thermal engineering principles, calculations and equations that are needed for the successful cooling of electronics. This issue focuses on thermal resistance, a vital component of heat transfer.

The full contents of Issue 95:

Measuring Heat Flux from a Component on a PCB

It is vital to understand heat dissipation from electronic components during their operation in order to properly design the cooling system and selection of the appropriate heat removal methodologies. Heat dissipation from a component in an electronic package not only influences its own performance but also affects the performance of neighboring components, leading to their failure. This article will discuss a new method of measuring the heat flux from a component on a PCB.

Design Parameters in Immersion Cooling

Two phase immersion cooling can be a viable option to cool power electronics and high performance computers. However, non-thermal aspects play a significant role in the proper functioning of the system. This article will review these parameters that thermal engineers need to understand in order for a successful implementation of two phase immersion cooling technology.

Industry Developments: Cooling With Lasers

While electronics inside laser systems may require thermal management, lasers may also one day have a major role in cooling electronic components. Such developments are already underway, as researches are hoping laser cooling could lead to a new form of computer chip that could cool itself on its own. This article will discuss the promosing future that lasers have in the electronics cooling field.

Technology Review: Mobile Device Thermal Management

Qpedia reviews innovative technologies developed for electronics cooling applications. This section presents selected patents that were awarded to developers around the world to address cooling challenges. In this issue our spotlight is on the thermal management of mobile devices.

Cooling News

Qpedia reviews the latest technology, products and events from around the electronics cooling industry.

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This month’s Qpedia Thermal eMagazine has just been released and can be downloaded at qats.com.

Featured articles this month include:

Heat Transfer Calculations of a Thermosyphon

A thermosyphon is a simple device that can be used to transfer large amounts of heat without moving parts. The limitations of the device are similar to those of a traditional heat pipe with a wicking structure, but thermosyphons provide cost savings over common heat pipes. This article will discuss heat transfer calculations that can be used for thermosyphon pipe selection.

Data Center Hybrid Cooling: A Cost Saving Method

Data centers are the core of the information economy, representing government and academic institutions, financial, medical, media and high-tech industries. However, accelerating power consumption, environmental concerns and the cost of energy have created the need for change in data center design and thermal management. This article discusses the benefits of hybrid cooling compared to traditional air cooling of data centers.

Industry Developments: Porous Heat Sinks

Heat sinks are typically made from non-porous materials that are impermeable to water, air and other fluids, most commonly aluminum and copper. However, studies and applications have shown that porosity features can provide better heat sink performance. This article discusses recent developments on heat sinks that are made from semi-porous materials or with porous coatings.

Technology Review: Application of Phonons in Heat Transfer Devices

In this issue our spotlight is the application of phonons in heat transfer devices. There is much discussion about its deployment in the electronics industry and these patents show some of the salient features that are the focus of different inventors.

Cooling News

The latest product releases and news from around the electronics cooling industry.

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