Category Archives: Thermal

Isothermal Plate Provides Precise, Controllable Heat Source to Simulate Hot IC’s for Heat Sink Development or Test and Measurement

Posted on April 7, 2010 by | 1 comment

Advanced Thermal Solutions, Inc. (ATS) CIP-1000 is a controllable isothermal plate system which produces surface temperatures from 10 to 170°C. The temperature can be controlled with an accuracy of +/- 0.1°C. The CIP-1000 heat source system features a 75 mm diameter isothermal copper plate whose constant temperature can be raised or lowered both automatically and manually. A three wire RTD sensor and integral PID controller ensure specific, uniform temperature across the entire plate. Temperature settings can be programmed for automated ramping, including hold times for each step. Manual temperature management is also supported.

Applications include:

  • Simulating a hot semiconductor for thermal development of heat sinks
  • Temperature control for bio-technology applications
  • Quick spot heating of materials needed in electronics hardware lab prototyping work

You can learn more by visiting the ATS CIP-1000 Information Page

1 Comment

Posted in Engineering, Heat Sinks, Thermal, Thermal Design

ATS Thermal Design Webinar April 8: Strategies in Cooling High Capacity/High End Systems

Posted on April 2, 2010 by | Leave a comment

As the definition of what a high capacity/high end system is changes to accommodate the ever increasing needs for computer and storage resources, so do the thermal management challenges. Attendees of this webinar will learn about the strategies for cooling high capacity systems, including the use of liquid cooling. Webinar taught by Dr. Kaveh Azar of Advanced Thermal Solutions. It is free of charge. You may register at ATS’s webinar registration by clicking to: Strategies in Cooling High Capacity and High End Systems

Leave a comment

Posted in cooling, Thermal, Thermal Design, Training, Webinar

ATS Candlestick Sensor: A Thin Profile Sensor for Measuring both Temperature and Velocity

Posted on March 30, 2010 by | 3 comments

The Candlestick sensor from Advanced Thermal Solutions, Inc. is narrow and low profile to minimize disturbance to airflow when studying heat conditions in electronic enclosures. The sensor’s robust base-and-stem design allows continuous repositioning and reading during the testing process. One Candlestick sensor measures both temperature and velocity to eliminate errors that can occur when airflow is non-isothermal. Its all-plastic design prevents shorting of electronics. Multiple sensors are easily installed to thoroughly map a system’s thermal and airflow conditions. Double-sided adhesive makes the sensors easy to mount on any surface.

  • Temperature Range: -30°C to 150°C (±1°C)
  • Velocity Range: 0 to 51 m/s (10,000 ft/min) (± 2%)

You can learn at this link at qats.com:  ATS Candlestick Sensors

3 Comments

Posted in Instrument, Product Highlights, Sensor, Thermal, Thermal Design