Tag Archives: heat sinks

ATS maxiGRIP is flame retardent and our engineers prove it on video!

From time to time ATS engineers are asked if maxiGRIP, our patented heat sink attach technology that allow phase change interface material to be properly used, can resist  high heat.

Would ATS design something that didn’t pass every possible, necessary rating – never.  We can’t bring ourselves to design it poorly.  We know that thermal management is not just an afterthought and that it can make or break a system performance.

So, to prove our point, we’ve produced this short video on maxiGRIP and a simple flame test.  It’s a simple video of what happens when you use heat stress maxiGRIP.  Enjoy!  I think you can guess the outcome: .

Click to our link to buy your own heatsinks with maxiGRIP by visiting our maxiFLOW/maxiGRIP product page at qats.com

Thermal Management in Medical Diagnostic Equipment : ATS Thermal Webinar, June 11, 2PM

Thermal challenges in medical diagnostic equipment such as EKG machines, defibrillators, telemetry, ultrasound and other products present both similar challenges to other electronics as well as their unique set of needs due to their importance in people’s lives. This free vertical webinar will focus on the specific needs that medical diagnostic equipment requires.

To register for this free webinar, please click to: Thermal Management in Medical Diagnostic Equipment, June 11 2PM

Mentor Grapics Webinar: Heat Sink 201 – Even More About Heatsink Design; 5/19 & 5/20 11AM taught by Dr. John Parry, CEng

Another great webinar is coming up on how to design a heat sink. This time it’s sponsored by Mentor Graphics and taught by Dr. John Parry. Entitled, “Heat Sink 201 – Even More About Heatsink Design” You can register to attend either on 5/19 or on 5/20 at 11AM.

Mentor provides a description of their course:

In this webinar we will discuss how manufacturer’s data is obtained, and why this may not be applicable for use in design by showing a simple example of how a heatsink interacts locally with the surrounding airflow.

We will illustrate why heatsinks are not as simple to use as they first appear, and why they should be designed for a particular application. We will also talk more about the myths surrounding heatsinks and their application, and give some practical advice concerning heatsink design and attachment. The presentation will conclude by looking at different optimization strategies for heatsink design.

At ATS we couldn’t agree more. This is a terrific topic. As we’ve noted in past posts here, such as our post, “The Fallacy of the Drop-In Replacement Heat Sink” a heat sink is not necessarily a heat sink. And the published data isn’t always accurate.

There are a number of vectors of influence in heat sink design and application. For example, the TIM (thermal interface material) and attachment method can have dramatic effects on the thermal efficiency. In our testing here in ATS’s Thermal Labs, we’ve found that a simple straight fin heat sink can have a significantly better thermal performance when a proper attachment method and phase change material TIM are used.

You can register for Mentor Graphics webinar at the following link: “Heat Sink 201 – even more about heat sink design“.

Should you find you need help designing your next generation heat sink or thermal management solution ATS’s world class design team, deep CFD capability and Tier 1 class thermal development lab can lend you a hand. Click through to learn more about ATS Thermal Management Design Consulting Services or tell us a bit about your project through our on-line project submission: Thermal Design On-Line Project Request.

How to stretch a new project’s thermal management budget by optomizing PCB layout for airflow; an ATS Thermal Labs White Paper

Hardware engineers all bump into this problem eventually: The cost of the heat sink solution part of the thermal management design is out of balance with the overall programs development costs.

The first thought is, “get a cheaper heat sink”. That’s a natural response that probably won’t work since the reason the originally chosen heat sink is so expensive is that it has a thermal resistance geared to your challenging application.  The second thought is, “get a bigger fan”. Afterall, the chips will eventually cool down with enough air, right? (yes your users might go deaf when you implement that bigger fan).

A better strategy within the limits of project time constraint, budget, and technical requirements for trace length, might be to consider how the PCB board can be layed out for optimal air flow. In this ATS Thermal White Paper we talk about how to do that. We give you specific tools and strategies. Why do that when we could sell you a better heat sink? Because at ATS we are passionate about cooling hot stuff down (and saving users from going deaf from larger fans). Have a read here at our white paper: “The Effect of Compact PCB Layout on Thermal Management“.

And ATS can help you with that of course through our Engineering Consulting Services, click to learn more about us: ATS Thermal Management Design Consulting Services or tell us a bit about your project through our on-line project submission: Thermal Design On-Line Project Request

Adaptive Cooling in Datacenters; an ATS Thermal Management “How To” white paper

If you caught our earlier post today featuring Google’s Bill Weihl, you know there are many issues related to having an energy efficient datacenter. Thermal management is part of that as well. So while you might have the best heat sink and system cooling design, that heat still has to be dealt with once it comes out of the system. At ATS we think about heat transfer from chip to datacenter. In our latest white paper on this topic we cover what an adaptive cooling approach might look like for a datacenter. We use a sample 4 MW center with 100 racks of servers for our exercise and consider what needs to be considered in order to develop such an adaptive cooling solution to the thermal management of a datacenter. Download you free copy from ATS here: “Adaptive Cooling in Data Centers“