Tag Archives: thermal management

Choosing and Fabricating a Heat Sink Design for Thermal Management, Part 2

In part 1 of our 3 part series, “Choosing and Fabricating a Heat Sink Design for Thermal Management” we discussed different heat sink manufacturing methods. Today we want to discuss the pros and cons of each method so you can make an educated decision on which method to choose.

The pros and cons of each manufacturing technique:

Type Best for Thermal Resistance Pros Cons
Bonded Large applications High Close tolerances Expensive
Convoluted (folded) fin Ducted air High at low flows and low at high flows High heat-flux density Expensive, needs ducting
Die-cast Low power applications High Can be inexpensive Low thermal conductivity and expensive die charge
Extruded Most applications Varies Versatile Limited size
Forged Many applications Moderate Inexpensive Limited in design and flow management
Machining Prototypes Design dependent Quickly available for testing High aspect ratio fins difficult to machine – inconsistent fin geometry
Single Fin Assembly (SFA) All applications Very low Light weight and low profile with high degree of flow Expensive
Skived Many applications Moderate Close tolerance Thick base, higher weight, directionally sensitive
Stamped Low Power High Inexpensive Low performance
Swaged High power applications Medium Good for power devices Heavy and bulky, limited ability for flow management

The manufacturing process has a direct impact on a heat sink’s thermal performance. This stems from the number of fins that can be produced by a given manufacturing technique and from the interfacial resistances created when using that process. Bonded fin and swaging assembly techniques introduce a third material between the fins and the base. Single-fin assembly (SFA) places a third material in between the fins. Although SFA is a brazing process and the metallurgical joints very close to solid, nevertheless, all three of these techniques are impacted by the presence of the third material. Among other methods, stamped, extrusion and die-casting are perhaps the oldest technologies for high volume production. Most heat sinks on the market are made by such processes.

More recent heat sink fabricating methods were developed to meet the need for more fins on a flat surface. SFA, micro die-casting and forging produce higher performing heat sinks suitable for high power application. Of the three, SFA can produce the highest number of fins per linear length because of its manufacturing process. (Advanced Thermal Solutions, Inc. has made SFA heat sinks with 26 fins per cm, or 67 fins per inch.). Manufacturing technology has advanced enough to produce high aspect ratio as well as high fin count heat sinks.

In part 3 we’ll conclude our series on “Choosing and Fabricating a Heat Sink Design” with the salient features of high performance heat sinks.

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Choosing and Fabricating a Heat Sink Design for Thermal Management, Part 1

Today we’ll be kicking off a three-part series on choosing and fabricating a heat sink design for thermal management.

For data and voice communications, speed is now the driving factor in the market. As a result, high frequency devices have become a major element for meeting consumer demands. Further, by combining higher packaging density and intelligent (software driven) PCBs there is much more power dissipation at both the component and board level.This situation creates great opportunities and significant challenges for thermal management and electronics packaging.

A first step in addressing thermal challenges is to consider heat sink choice and design. Looking at the market we find a strong presence of extruded heat sinks which can provide only limited thermal performance. Old or off-the-shelf extruded heat sinks do not meet the stringent temperature requirements of today’s ASICs. There’s a sore need for high performance heat sinks that can expand the envelope of heat dissipation in current and near term electronics. With many different types of heat sinks available, the question is: what type of heat sink is suitable for my application?

Heat Sink Types
The general function of a heat sink is the same, irrespective of its fabrication process. Thus we can distinguish between heat sinks by their manufacturing method.

Heat sinks fall into three broad categories:

  1. Plate-fin: suitable for generally straight airflows
  2. Pin-fin: suitable for omni-directional airflow
  3. Foam-fin: suitable for ducted airflow (high pressure drop)

Excluding foam-fins, there are a number of high volume manufacturing processes for creating a heat sink fin field on a flat surface. Many articles are available that describe the details of such manufacturing techniques. Therefore, they are not covered here.  The following table below highlights the details of each manufacturing process:

Bonded Individual fins are bonded with epoxy to a pre-grooved base
Convoluted (folded fin) Fins are pre-folded and then brazed or soldered to a base plate
Die-Casting Heat sinks are formed as a result of molten metal solidifying in a prefabricated die
Extruded Molten metal is drawn through a die
Forged Molten metal is pressed into a prefabricated mold to form the desired shape
Machining Heat sinks are formed by the machining process
Single Fin Assembly Individual pieces of fin and spacer material are stacked and then brazed to create the desired shape
Skived Fins are “skived” from a solid piece of material
Stamped Metal stamped to form a particular shape
Swaged Individual fins are placed in a pre-grooved base, then a roller swages the sides of the fins to keep them in place

In part two of “Choosing and Fabricating a Heat Sink Design for Thermal Management” we’ll discuss the pros and cons of each manufacturing technique.

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Thermal Management Webinars from ATS now featured at Digi-Key

If you do any purchasing at Digi-Key you can now also sign up for any of ATS’s thermal management webinars right from the ATS site at Digi-Key! ATS is delighted to be partnered with Digi-Key for distribution of our heat sink and heat sink attach products. Our webinars are long on technical data and short on marketing fluff, so, we invite you to have a look at ATS’s “store” at Digi-Key and while your there, sign up for a free webinar (under the events and seminars tab).

Thermal Computations for Electronic Equipment by Gordon Ellison

At our webinar we broadcast today live from our studios here in Norwood, MA, “Analytical, Computational and Experimental Thermal Analysis of a xTCA Chassis” we mentioned Gordon Ellison as a resource for thermal modeling equations. We wanted to follow up with how to find his material.

Gordon’s book, “Thermal Computations for Electronic Equipment” can be purchased from Amazon.

You can also find an article written by Gordon on “Fan cooled enclosure analysis using a first order method” at Cooling Zone.

Next Generation Tools give Data Centers New Strategies for Thermal Management

Todd Schneider over at Electrorack has penned an article on some new approaches to thermal management in the data center. Among the topics Tom covers:

  • An update on metrics being used to determine facility efficiency
  • What’s behind the pressure on data center managers to comply with Go Green initiatives for power usage
  • Discussion of different solutions including: air side solutions, aisle containment solutions, active and passive ducted containment, water-side refrigerant and rear-door exchangers

Todd’s article is well worth a read to help in thinking through what might be next in your data center thermal management strategy. You can read the entire article at Data Center Knowledge by clicking through to this link: “Combatting Thermal Issues with Next-Gen Tools“