Category Archives: Analysis

Mentor Graphics Webinar 4/21 1PM EST: Using FloTHERM IC to automate key tasks for semiconductor thermal characterization

We blogged about Mentor Graphics FloTHERM IC back on March 3rd. Well, now Mentor Grapics is offering a webinar to help you understand and use FloTHERM IC.

Mentor Graphics FloTHERM IC is:

a new web-based tool from Mentor Graphics that incorporates a high level of automation for key tasks related to semiconductor thermal characterization and design.

The typical semiconductor thermal group spends 60% of engineering time on characterization and 40% on customer-specific applications. FloTHERM IC has been proven to reduce time spent on these two activities by 50% and 10%, respectively.

FloTHERM IC was designed by thermal experts specifically with the needs of the semiconductor designer in mind. With no additional software required, semiconductors can be designed “on the fly” without sacrificing package design. Designers can explore what-ifs on high-level package features through their impact on Theta metrics.

Mentor’s Webinar will Cover:

  • Integrate all characterization activities under one hood
  • Allow for rapid package-aware what-ifs
  • Allow mining of previous simulations data to optimize starting point of new design
  • Link closely with industry EDA tools
  • Keep pace with the evolving market of semiconductor packaging

You can join Mentor Graphics free webinar by clicking to their registration page at: Automating Semiconductor Package Thermal Characterization and Design Web Seminar

Tony Koryban Mail Bag Archives: finding the special air conditioner to cool computers that can handle watts?

As is our custom at ATS, we bring to you Tony Koryban’s Mail Bag archives, this week’s question?

Dear TK,

I got stuck with the job of getting quotes for the ventilating/air conditioning system for the new computer room. It will be filled with network routers and servers and such. All the power for that stuff is given in watts, but all the air conditioners seem to be rated in BTUs per hour, or TONS, even! Where can I find the special air conditioners for computer equipment that can handle watts?

Cheesed-off in Chesterton

Tons of fun answering this question where the answer is simpler than you might think!  You can read all about it at this link:  “Tony Koryban Mailbag Archives“

ATS announces QoolPCB – Fixed Price for All Heat Sinks on any PCB

Its a challenging time economically for many firms and ATS is ready to help!  Our new QoolPCB program is a fixed cost board cooling program program which offers users a single, fixed price for the complete set of heat sinks required to cool any PCB.

The QoolPCB program includes all design engineering, hardware, testing, procurement and delivery costs for the heat sinks, thermal interface materials, attachment devices and all other parts required for the effective thermal management of a board’s components. The fixed cost applies whether the solutions are for off-the-shelf heat sinks, custom designed, or a combination of both.

To participate, PCB developers simply provide 3D CAD models of their board layout, along with the technical specifications, including power dissipation of all board components. ATS performs a full thermal analysis of the PCB and develops a comprehensive cooling solution for each component on the board. For more information, visit the ATS web sites program here: QoolPCB

Case Study: Thermal analysis & heat sink design to optimize cooling of 16 Core packet processor

Computer-driven simulation and analysis of thermal characteristics can be used to develop optimal cooling solutions for high-performance board designs. Of course, those designs have to be verified by real-world testing to improve MTBF and shorten time-to-market.

ATS recently did just that. Facing a problem involving a PCI-X card, a hot 16-core 500Mhz packet processor, and a COTS PCI type, rack mount chassis, ATS found a solution where none could be found before. There was alot to do and we’re happy to share what we did in this white paper at RTC Magazine, “Thermal Analysis and Heat Sink Design Optimize Cooling of High-Performance Modules“