Category Archives: Heat Sink Attach

New Heat Sink Attachment Video Tutorial

Heat sink attachment is as important as the heat sink itself, in fact, with the heat sink and thermal interface material, the three pieces form a thermal managment system.  But what kind of heat sink attachment should you choose?  Clip?  Pins?  Tape?  Our latest video tutorial is 3 minutes long and covers the pros and cons of the major heat sink attachments.

Which Heat Sink Family Is Designed For A Wide Array of Spring Compression and Air Velocity Applications?

Alot of thought went into creating the ATS line of Push Pin Heat Sinks.  Some of the key questions that were considered included:

  • How do we create a heat sink family where a set of applications might be either low air flow or high air flow?
  • What type of environments, including shock and vibration, will a given application have and how do our engineers insure the right compression springs and hardware for a wide range are available.
  • What are the widest array of semiconductor package sizes that we will need to be accommodate?

The Push-Pin 2-minute video gives a quick overview of the product line with these key design points in mind:

Also available through Digi-Key!

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Why Blue and Green Color Anodization for Push Pin Heat Sinks?

ATS’s push pin heat sink line has a number of important characteristics but you’d think the least of them would be their color.   Why the colors and how do they help heat sinks be better heat spreaders – or do they?

First off, why the colors?   Are they there for marketing purposes or do they have a more engineering centric mission?  The colors are actually part of the anodization itself.    But first what is anodizing?   The Aluminum Anodizers Council has the key definition:

Anodizing is an electrochemical process that converts the metal surface into a decorative, durable, corrosion-resistant, anodic oxide finish. Aluminum is ideally suited to anodizing, although other nonferrous metals, such as magnesium and titanium, also can be anodized.

But most heat sinks are themselves inside electronic systems such as computers, telecommunications equipment.  Any electronic component that generates heat can benefit from a heat sink (also known as a heat spreader).   So, do heat sinks inside computers need to be protected by anodizing them?  The short answer is no.  There are use cases of course but in general, protection is not the reason heat sinks in general (and ATS’s Push Pin line of Heat Sinks) are anodized.  In many cases the anodization color makes it easier to brand the heat sink from a particular manufacture or to distinguish between different branches of a heat sink family.  In the case of ATS’s Push Pin Line, the green anodized heat sinks use ATS’s  ultra performance maxiFLOW™ fin geometries while the blue anodized heat sinks feature straight fin or cross-cut fin designs.

So anodization is just about marketecture?   Well, no.  While the colors are convenient and helpful the real answer is a technical reason.  As we’ve noted in our 2010 article series, “How Heat Sink Anodization Improves Thermal Performance (see them on qats.com at these links, part 1 and part 2)”  anodization is about treating the surface of the heat sink to improve the radiation heat transfer of the heat sink:

Radiation heat transfer can be as important as convection heat transfer in electronics cooling, especially in natural convection and low-airflow applications.  Depending on the type of surface treatment used, radiation heat transfer is enhanced in two distinct ways: by increasing the emissivity of the surface or by increasing the surface area.  Anodization is one such way to treat the surface area.

Various protective benefits and aesthetically pleasing colors have extended the use of anodization to many industrial and commercial applications. For electronics cooling, however, the advantages of surface anodizing are the dielectric isolation of the cooling components from their electronics environment, and the significant increase in their surface emissivity. The increase in the emissivity coefficient on the anodized surfaces of heat exchangers, electronics cabinets and enclosures, heat sinks, etc. is typically on the order of 0.83 to 0.86 [4]. When compared to the emissivity coefficient of bare aluminum, 0.04 to 0.06 [5], the importance and significance of enhancement of radiation heat transfer would become evident.

So for ATS’s push pin heat sinks and for other firms who anodize their heat sinks the reason is really for the purpose of improving the thermal performance of the heat sink.  Also available through Digi-Key!

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Getting the Maximum Performance from Heat Sink Clips

As power levels for board components have risen, thermal engineers have been forced to design larger and more innovative heat sinks than ever before. Along with the thermal challenge has come the mechanical challenge of attaching these heat sinks to the components in a reliable fashion.

One of the most popular methods uses some form of clip. These are low in price and easily applied. Smart engineering has led to clip systems that provide strong, even pressure well beyond the working life of the component. They hold their heat sinks tight even when dropped or shocked, but they can be unclipped manually whenever it’s necessary.

Clips that attach directly to the component provide an advantage over other clip types, (e.g. z-clips) in that no holes are required in the PWB. The ATS maxiGRIP is an example of such an attachment. maxiGRIP uses a plastic frame clip that attaches directly to the component and provides a mounting platform for a custom spring clip (Figure 5).


The frame clip is installed, using a special tool which expands all four sides of the clip simultaneously, allowing the clip to be placed directly over the component package (A keep out area is usually required). Once released, tabs on each side engage and secure the clip to the component, creating a secure mounting platform for the spring clip. The spring clip, which is designed to provide a very precise load, is then installed to hold the heat sink in place, maintaining continuous pressure at the heat sink component interface. The maxiGRIP assembly has a big advantage over other heat sink attachment methods in that it allows for the use of high performance phase change interface materials.

Extensive FEA and shock and vibration testing of the maxiGRIP assembly have been done to provide a carefully engineered heat sink attachment solution with a high-level of reliability.

Three questions an engineer should ask prior to using thermal epoxy for their heat sinks

We’ve seen a big uptick in use of epoxy by our customers here at ATS. To our engineers that is alarming. While thermal epoxy initially appears to be a good solution for attaching a heat sink to a chip, accomplishing both the attachment and the thermal interface material in one “quick” glue application design engineers and manufacturing engineers should stop and ask themselves the following three questions before deciding to move ahead.

(1) Does it have to be glued?
Many times glue looks like the easy answer since its generally cost-effective and can be easily applied. But the question “does it have to be clued” really stops you short to make you examine potential alternatives. Don’t forget, thermal epoxy can expire and lose it’s properties.

(2) Is the perceived cost/time savings in assembly worth the actual cost of rework?
Many times thermal epoxy is a quick default choice, “just glue it on” has the sound of a quick solution that should work in average applications.  But that’s not the case.While it looks easy, thermal epoxy requires consistent application to the semiconductor the heat sink is being glues onto. To get that consistent application can require some training (a “soft” cost). But the real caution is the rework. No one “expects” reworks but reworking a company’s computer boards is reality. And with thermal epoxy being used for your heat sinks the rework requires either hot air guns (an additional expense) or destruction of the components under the heat sink. The cost of the rework may exceed the cost savings of using epoxy. Don’t forget the cost of  using thermal epoxy for your heat sinks includes training on how to use epoxy, special equipment to remove epoxied heat sinks and the cost of the material (which has a shelf life and many times must be refrigerated).

(3) Is epoxy being chosen to secure your heatsink?
While the epoxy bond is secure, it’s not foolproof. In fact ATS has seen many epoxied heat sinks that fell off during shock and vibe testing. What generally happens is that heat will weaken the epoxy mechanical bond then, when a strong shock or other mechanical stress is applied, the weakened bond with break, leaving your heat sink in free fall and your semiconductors overheating.

Want some alternatives? Check out our blog post series,

How to choose a heat sink attachment method to secure your heat sink and for optimal heat transfer Part 1

How to choose a heat sink attachment method to secure your heat sink and for optimal heat transfer Part 2