Category Archives: Heat Sink Attach

#WeCoverTheBoard: ATS Has Thermal Solutions to Cover the Whole Board

We Cover The Board

Advanced Thermal Solutions, Inc. (ATS) has an extensive line of heat sinks and board level thermal solutions that allow ATS engineers to work with industry-leading components and solve the industry’s toughest thermal challenges. (Advanced Thermal Solutions, Inc.)

Advanced Thermal Solutions, Inc. (ATS) has an extensive product line of innovative, off-the-shelf and custom heat sinks and attachments that provides the broadest range of designs to meet the demanding thermal challenges presented by today’s high-powered electronics. Led by its patented maxiFLOW™, which provides the highest thermal performance for physical volume it occupies compared to other heat sinks on the market, ATS has a solution to meet any thermal problem.

In addition, ATS engineers have world-renowned expertise in thermal management and are capable of designing liquid and air cooling solutions using heat sinks, heat pipes, heat exchangers, fans, and cold plates. ATS has more than two decades of solving the industry’s toughest thermal challenges and have a proven record of success in handling the industry’s leading components.

From the latest generation of Intel processors to Altera’s high-powered Stratix FPGA to Qualcomm’s ARM processors to Texas Instruments, Nvidia, NXP, Cavium, and many more, ATS has the experience, the analytical capability, and the products to provide you with the necessary thermal management.

Board Level Solutions

maxiFLOW™ – maxiFLOW™ heat sink design provides the highest thermal performance for the physical volume that it occupies as compared to other heat sink designs. maxiFLOW™ heat sinks are ideally suited to meet the thermal requirements of a broad range of electronics packages, including: BGA, QFP, LCC, LGA, CLCC, TSOP, DIPs and LQFP.

Straight Fin – ATS offers a large variety of high performance Straight fin heat sinks that can be used in many applications where the direction of the airflow is clearly defined. The straight fin heat sink can be utilized in areas where the maxiFLOW™ flair-fanned cannot be used, providing an excellent alternative for cooling thermally sensitive devices.

Cross-Cut – Electronics packages are numerous and range from BGA, QFP, LCC, LGA, CLCC, TSOP, DIPs, LQFP and many others. ATS offers a large variety of cross cut heat sinks that can be used in a variety of applications where the direction of the airflow is ambiguous. The cross cut allow for the heat sink to receive air from any direction.

Pin Fin – Electronics packages are numerous and range from BGA, QFP, LCC, LGA, CLCC, TSOP, DIPs, LQFP and many others. ATS offers a large variety of cross cut heat sinks that can be used in a variety of applications where the direction of the airflow is ambiguous. The cross cut tape on allow for the heat sink to receive air from any direction and can be easily attached to the device by a thermally conductive tape.

fanSINK™ – In many electronic systems, such as telecomm and datacom chassis, or 1U, 2U servers and blades, the system air flow rate is not adequate for cooling of high power devices. Therefore, additional air flow introduced at the device level is required. ATS offers a large family of fanSINK™ products for applications where FPGA or ASICs in BGA packages are deployed. ThefanSINK™ can be either clipped on to the device by maxiGRIP™ or superGRIP™ heat sink attachment technologies or taped on.

Power Brick – DC/DC power converters are an essential part of PCB design and their performance requires a stable temperature for optimum performance. ATS has produced a broad array of high performance power brick heat sinks, based off of the patented maxiFLOW™ design, to effectively cool DC/DC power converters and power modules deployed in a host of electronics applications. ATS’ power brick heat sinks are available in full, half, quarter and eighth packaging.

pushPIN™ – With over 108K different push pin heat sink assembly configurations, ATS offers the largest push pin heat sink offering in the market. Select from fine and ultra-fine pitch heat sinks designed for high velocity air flows and coarse pitch heat sinks for low velocity air flow conditions. Offered in straight fin, cross-cut and the ultra performance maxiFLOW™ fin geometries, ATS pushPIN™ heat sink line is suited to meet a wide variety of applications for components ranging in size from 25mm-70mm. Push pins are offered in brass and plastic and are packaged with different compression springs to achieve precise force required for secure attachment.

blueICE™ (Ultra Low Profile) – In many electronics systems, such as Telecomm, Datacomm, Biomedical equipment and others, card-to-card spacing is small, yet stringent thermal requirements remain the same. Electronics packages such as BGA, QFP, LCC, LGA, CLCC, TSOP, DIP, LQFP are commonly used with stringent thermal requirements in a tight space with limited airflow. Ultra low profile heat sinks offered by ATS range from 2 to 7mm in height and are ideally suited for tight-space application electronics since they offer the best thermal performance. Their thermal resistance is as low as 1.23° C/W within an air velocity of 600 ft/min.

Standard Board Level – ATS’ high quality, low cost, aluminum stamped heat sinks are ideal for low power thermal management solutions. The simple design and manufacturing of these heat sinks allows high volume manufacturing and reducing assembly costs. Stamped heat sinks are ideally used for TO packages and other power devices.

Extrusions – Aluminum extrusions are the most cost-effective solutions for the majority of electronic cooling applications. ATS offers a wide variety of aluminum profiles used for heat sink fabrication and other aluminum applications. Whether you are seeking a standard extrusion profile or the expertise from our design team to create a new and innovative profile, ATS has the capabilities and expertise to meet your requirements.

Heat Sink Attachments

superGRIP™ – superGRIP™ is a two component attachment system which quickly and securely mounts heat sinks to a wide range of components, without needing to drill holes in the PCB. superGRIP™ provides a strong, even attachment force with minimal space required around the components perimeter, making it ideal for densely populated PCBs. superGRIP™ is available with ATS maxiFLOW™ heat sink and straight fin heat sinks.

maxiGRIP™ – maxiGRIP™ is a unique, two component attachment system which quickly and securely mounts heat sinks to a wide range of components, without needing to drill holes in the PCB. The steady, even attachment force provided by maxiGRIP™ allows the heat sink and thermal interface material to achieve maximum thermal performance. maxiGRIP™ is available with ATS maxiFLOW™, straight fin, fanSINK™ and device specific heat sinks.

Thermal Tape
– The interface material plays a pivotal role in transporting the heat from the component to the heat sink. The tape is applied to the base of the heat sink and then the heat sink is attached to the component. For tape to work well, proper cleaning of the component surface and the base of heat sink is required. Also, it is usually necessary to apply the tape with a certain amount of pressure.

Attaching Heat Sinks with Push Pins

Heat Sink with push pin attachment and maxiFLOW fins

In certain conditions, lightweight heat sinks can be mounted to hot components with thermally conductive adhesive tape.

But, many heat sinks need a mechanical attachment system for optimum thermal performance and security. These systems typically feature metal and/or plastic hardware, along with a high performance TIM (thermal interface material).

Several attachment systems are available, and one way to categorize them is by whether or not the circuit board becomes part of the solution. For example, will holes be drilled into the board for mounting pins or anchors to help clamp down the heat sink?

If such holes can be safely added around a component, the most versatile heat sink attachment method is push pins. These are now used with many commonly available heat sinks. The sinks have integral holes that align with standard PCB locations. Each pin has a pointed barb end that attaches permanently through the drilled hole. A wire spring on the pin adds a continuous compressive force.

Push pin type heat sinks provide many options for a wide variety of conditions under which electronics are deployed.  They come in a range of material and lengths, as well as choices of springs.

Common push pin material options include:

  • Plastic push pin
  • Brass push pin
  • Stainless Steel PEM

Plastic Push Pins are useful for applications where the push pin heat sink attachment should not conduct heat or electricity. They are a good choice when weight is a critical design factor.  Plastic is also a good option when water or high humidity conditions can occur. Corrosion and chemical resistance are two key advantages of plastics. As with any plastic fastener, the plastic itself has to be particularly robust in order to handle the strain of fastener insertion and subsequent high stress around the pin.

plastic push pins to attach a heat sink to a PCB

Thought should be given to the material type of the pin and the plating used in the PCB through hole that will sheath the fastener when you attach the heat sink to the PCB.  Depending on what material is used, that material will have a CTE (co-efficient of thermal expansion) that needs to be matched to the attachment being specified.

Brass push pins are useful for applications that are corrosive, high heat, and require a strong, durable, material for attachment.  Brass can also be used in situations where it is important that sparks not be struck, as in fittings and tools around explosive gases. Brass attachment should not be used in environments that include ammonia or that release ammonia as this compound can cause stress corrosion cracking in brass.

Brass can often be cheaper than the same attachment in stainless steel since brass costs much less to machine.  Brass is a reasonably good conductor of heat as well (109 W/(m KM)), increasing the overall thermal management of an application where it used to secure a heat sink.

brass push pin attachment for heat sinks being mounted to a PCB

And, push pin fasteners cost less than metal PEMs, which can be similarly used to mount heat sinks via PCB holes.

Screwed in PEM fasteners are perfect for applications where there is only a plain, round hole. They provide high push-out and torque-out resistance. The holes for these fasteners do not need to be specially prepared by deburring or chamfering.  PEMs are also good for meeting DFMA requirements because there are few parts to handle and few assembly steps. Because many of the PEMs used in heat sink applications are made from stainless steel, they have good corrosion resistance, strength and fabrication characteristics.  Like brass, stainless steel is excellent for use in corrosive environments.  But stainless steel’s low thermal conductivity (16 W/(m KM) means that in applications where the heat conduction of the heat sink attachment must be as low as possible, while still providing corrosion resistance and strength, stainless steel can be a reasonable choice.

push pin attachment schematic showing length

brass and plastic push pins side by side comparison

The right length for a push pin is determined by the combined thickness of the heat sink base, the hot component, thermal interface material (TIM) and the thickness of the board.

The other variable is the choice of compression springs, an essential feature on push pin fasteners. Springs add the force needed to hold the assembly together. They’re sized for the length of the pin. Here, length refers to the space between the bottom of the heat sink and the top of the PCB. Overall height refers to the length of the pin, from is barbed tip to the top of its flat head. For ATS brass push pins, overall heights for brass push pin sizes range from 9 to 20mm. Plastic push pins are a standard 7.3 mm in length.

stainless steel springs for push pin heat sink attachment

Spring Choices

Wire compression springs come in choices of size (diameter and length) and material type. The pin length dictates the free length of the spring, but its solid length – when fully compressed, varies by the spring’s diameter and its material. The basic material choices are music wire, a commonly used carbon steel alloy, and stainless steel 302 wire. The music wire has a standard zinc plated finish, and the stainless steel wire has a passivated finish per ASTM A967.

The compressive force for achieving the solid length is determined by the combination of the spring’s free length, wire diameter and its inside and outside coil diameters. For ATS push pin springs, compression requirements range from 0.211 up to 3.543 lbs/mm. The final spring choice should provide a force that meets the performance needs of the TIM, and does not cause undo upward force on the component or on the PCB itself. Too great an insertion force can result in the die cracking and consequent component failure.

Installing Push Pins

All push pins feature flexible barbs that lock securely into PCB holes. The location of the holes in the heat sink will determine where holes must be drilled into the board. Industry standards for these locations are readily available for board designers or from ATS. The required hole diameter for all ATS push pins is 3.175 mm

Each push pin has a flexible barb at its install end that engages with the bottom of the hole in the PCB; once installed, the barb securely retains the pin. The compression spring holds the assembly together and maintains contact between the heat sink and component.

Pre-Load Advantages

Push pin springs add a pre-load pressure on the TIM in the completed assembly. Pre-load is the force holding the sink/TIM/component assembly together before the component is operating. Once the component heats up, a phase-change TIM will turn liquid (from a waxy solid) to increase thermal transfer. The push pins’ permanent pre-load pressure helps optimize the TIM’s thermal transfer performance with every power up and resulting TIM phase change.

Attachment Using PEMs

Push pin fasteners cost less than metal PEMs, which can be similarly used to mount heat sinks via PCB holes. However, PEMs have some advantages.

PEMS for mounting heat sinks to a PCB Board

Screwed in PEM fasteners are perfect for applications where there is only a plain, round hole. They provide high push-out and torque-out resistance. The holes for these fasteners do not need to be specially prepared by deburring or chamfering.  PEMs are also good for meeting DFMA requirements because there are few parts to handle and few assembly steps. Because many of the PEMs used in heat sink applications are made from stainless steel, they have good corrosion resistance, strength and fabrication characteristics.  Like brass, stainless steel is excellent for use in corrosive environments.  But stainless steel’s low thermal conductivity (16 W/(m KM) means that in applications where the heat conduction of the heat sink attachment must be as low as possible, while still providing corrosion resistance and strength, stainless steel can be a reasonable choice.

References for this post:

  1. Canadian Centre for Occupational Health and Safety, “Non-Sparking Tools”, http://www.ccohs.ca/oshanswers/safety_haz/hand_tools/nonsparking.html
  2. Thermal conductivity of material, Engineering Toolbox  http://www.engineeringtoolbox.com/thermal-conductivity-d_429.html
  3. Machine Design, “Comparing Brass and Stainless Steel Inserts”, http://machinedesign.com/materials/comparing-brass-versus-stainless-steel-threaded-inserts
  4. ECN Magazine, “The Art of Using Plastic Instead of Metal”, https://www.ecnmag.com/article/2005/04/art-using-plastic-instead-metal
  5. Mechanical Design, “Joining Plastic”, http://machinedesign.com/fasteners/joining-plastic
  6. PEM, The Self Clinching Fastner Handbook, http://www.pemnet.com/fastening_products/pdf/Handbook.pdf
  7. Angelica Spring, “Stainless Steel Music Wire”, http://angelicaspringcompany.com/index.php?Stainless%20Steel%20Music%20Wire – See more at: http://www.coolingzone.com/index.php?read=539&onmag=true&type=press#sthash.DtkLI2ig.dpuf
  8. Design Guidelines for the Selction and and Use of Stainless Steel  https://www.nickelinstitute.org/~/Media/Files/TechnicalLiterature/DesignGuidelinesfortheSelectionandUseofStainlessSteels_9014_.pdf

Brass, Plastic, and PEM Push Pin Heat Sink Attachments Offer the Right Solution for Almost Any Environment and Application http://www.coolingzone.com/index.php?read=539&onmag=true&type=press

Temperature Cycling Fatigue Electronics  (plated through hole fatigue)
http://www.dfrsolutions.com/white-papers/temperature-cycling-fatigue-electronics/

Optimizing thermal and mechanical performance in PCBs: http://www.smtnet.com/library/files/upload/712mangroli

ATS’ Standard Board Level Heat Sinks for PCB

We’ve just released our new line of standard board level heat sinks. These stamped heat sinks are ideal for PCB application, especially where TO-220 packages are used. Available now through Digi-Key Electronics​ or at this link from ATS http://www.qats.com/eShop.aspx?produc…

 

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Blow Torch, ATS Heat Sink Attachments

This video shows a flame test of the ATS heat sink clips superGRIP and maxiGRIP. These are used in the ATS clipKIT. It shows that the clips do not ignite, a key requirement in Telecomm applications and for general safety.

For more on ATS’s clipKITS, visit http://www.qats.com/Heat-Sink/Attachments/clipKIT

ATS maxiGRIP and superGRIP Heat Sink Attachments

Advanced Thermal Solutions John O’Day and Len Alter showcase the patented heat sink attachments maxiGRIP and superGRIP. With its patented and discrete design, these heat sink attachments are well worth it for being your only choice for a cost-effective, high performing thermal solution.