Tag Archives: heat sink

How Heat Sink Anodization Improves Thermal Performance (part 1 of 2)

Radiation heat transfer can be as important as convection heat transfer in electronics cooling, especially in natural convection and low-airflow applications. In part 1 of this 2 part article, we’ll talk a bit about heat sink anodization, and how it affects radiation cooling in thermal management. In part 2 we’ll cover the heat sink anodization process and different types of anodization.

Depending on the type of surface treatment used, radiation heat transfer is enhanced in two distinct ways: by increasing the emissivity of the surface or by increasing the surface area. The effect of both these parameters is shown in the Stephen-Boltzmann Equation[1]:

Radiation Heat Transfer and Surface Area Treatment For a Heat Sink

Where, q is the amount of radiation energy that is exchanged between two bodies whose temperatures are TH and TC. FHC is the surface shape factor, ƒ is the Stephen-Boltzmann coefficient, and ε and A are the emissivity and area of the surface, respectively.

The Stephen-Boltzmann Equation indicates that the temperature difference between the hot and cold bodies is the driver for radiation heat transfer. However, in almost all electronics applications, neither of these temperatures is a controlled parameter. Therefore, radiation heat transfer can only be enhanced by increasing the emissivity and surface area.

The most common method of surface treatment in electronics cooling is surface anodizing. Anodizing can be an environmentally safe electrochemical process that thickens and toughens the naturally occurring protective oxide layer on the surface of metal parts. Surface anodizing changes the microscopic texture of a metal, making the surface durable, corrosion and weather resistant. In the process, the metal forms the anode (the positive electrode) of an electrolytic circuit. Through an acidic electrolytic solution, the electrical current releases hydrogen at the cathode (the negative electrode) and oxygen at the surface of the metal anode (the positive electrode), building up a deposit of metal oxide. The acid action is balanced with the oxidation rate to form a coating with microscopic pores, 10-150 nm in diameter. The thickness of the metal oxide depends on the anodizing method and is anywhere from 0.5 to 115 microns thick. It is controlled by electrolyte concentration, acidity, solution temperature, and the process electrical current and voltage [2].

A typical anodizing process will form an oxidized layer on a metal surface with a thickness ranging anywhere from 1.8 to 25 microns. However, some industrial applications require parts with exceptionally high wear resistance. The process used on such surfaces is termed hard anodizing and produces surfaces that are thick compared to standard anodizing. The coating of a hard anodized surface can be greater than 25 microns thick and is made under special conditions of high current density, very low temperature and the use of special electrolytes [3].

Various protective benefits and aesthetically pleasing colors have extended the use of anodization to many industrial and commercial applications. For electronics cooling, however, the advantages of surface anodizing are the dielectric isolation of the cooling components from their electronics environment, and the significant increase in their surface emissivity. The increase in the emissivity coefficient on the anodized surfaces of heat exchangers, electronics cabinets and enclosures, heat sinks, etc. is typically on the order of 0.83 to 0.86 [4]. When compared to the emissivity coefficient of bare aluminum, 0.04 to 0.06 [5], the importance and significance of enhancement of radiation heat transfer would become evident.

The pores created by acidic anodizing on aluminum can easily absorb dyes. Colored dyes are often used on heat sinks for cosmetic and marketing purposes. The color of anodization has no impact on radiation heat transfer. A clear anodized surface has the same emissive characteristics as a black anodized surface. To further protect the surface of dyed anodized heat sinks from corrosion, they are usually sealed by immersion in boiling hot de-ionized water or steam [2].

In part 2 we’ll cover the heat sinks anodization process and different types of anodization.  “How Heat Sink Anodization Improves Thermal Performance – Part 2”

push pin heat sinks

References:

  1. Radiation Heat Transfer and Surface Area Treatment, Qpedia Thermal eMagazine, June 2008.
  2. Edwards, J., Coating and Surface Treatment Systems for Metals, Finishing Publications Ltd. and ASM International, 1997.
  3. Aluminum Anodizer Council Web Forum.
  4. Gustavsen, A. and Berdahl, P. Spectral Emissivity Of Anodized Aluminum And Thermal Transmittance Of Aluminum Windows Frames, Nordic Jounnal Of Building Physics, Vol.3, 2003.
  5. Ozisik, N.,Heat Transfer: A Basic Approach, McGraw-Hill, 1984.
  6. Highly Emissive Ion Beam Textured Surfaces for Improved Cooling of Electronic Devices, Electronics Cooling Magazine, September 1997.
  7. Chi, T. , Ballinger, R., Olds, R., and Zecchino, M., Surface Texture Analysis Using Dektak Stylus Profilers, Veeco Instruments, Inc.

Advanced Thermal Solutions ATS-X53190P-C1-R0 Straight Fin Heat Sink with superGRIP heat sink clip has 24.3 C/W Thermal Resistance at 200LFM

ATS straight fin heat sink with superGRIP heat sink clip Advanced Thermal Solutions ATS-X53190P-C1-R0 Straight Fin Heat Sink with superGRIP attachment has 24.3 C/W Thermal Resistance at 200LFM. Probably one of the best things about this heat sink “system” is the fact that you can use phase change thermal interface material (TIM) with it. Phase change TIM, under the right amount of pressure, can improve your thermal performance from 10% to 20% in a given application.

Speaking of thermal interface material for heat sinks, Jeff McCutcheon, senior technical specialist at 3M, has written a very good article and resources on choosing TIM. You can get a copy at EP&T Magazine: Higher frequencies leading to rising power and EMI in traditionally low power electronic devices

To see a video demo of ATS’s heat sink clip, superGRIP, see below:
[youtube=http://www.youtube.com/watch?v=0MqyNReoo10]

For more information, talk to one of our application engineers or to purchase you may contact us at T: 781-769-2800, email us at [email protected] or visit our web site at http://www.qats.com

Managing to the Junction Temperature for Thermal Management of Telecom and Datacom Equipment

Kontron has just released their first Cavium OCTEON® II AdvancedMC packet processor module, the AM2411. Kontron’s module features the Cavium Networks Octeon II CPU. It’s an incredibly powerful network processor and Kontron has really taken advantage of it to create an industry thumping feature set. This kind of product will serve telecomm companies very well in creating 4G networks using either LTE or WiMAX. The board designers clearly made the product durable as it has passed testing for Telcordia GR-1089, GR-63, IEC 60950-1, EN/CSA/ UL 60950-1. And this quote from their datasheet really tells it all regarding the 4211’s design point, quality: “This board is designed to meet NEBS Level 3, Earthquake Zone 4”

Board quality and specifications are not going to be a question with this product!

What is going to be a consideration is what this product is like in a chassis full of other boards operating at peak performance. There is no question Kontron has done a great job designing their board, but, their board now becomes a component in an integrated system. Such an integration of Commercial Off the Shelf Components (COTS)is almost always a challenge across a number of technical areas.

Trenton Technologies wrote a bit on this in their blog back in July of 2010 with their post, “Can You Really Simplify Integration of Industrial Computer Systems?” In that post they noted that 6 key factors to decided if a COTS solution could be used in an application, those six points are:

  1. System location requirements
  2. Projected service life of the system
  3. Number of option cards needed in the computer
  4. System expansion requirements
  5. System power and fail-over requirements
  6. System O/S and application software solution requirements

But the one piece they missed was the overall system thermal load. So let’s talk about that a bit. First, the key target temperature to keep in mind is the junction temperature. The junction temperature is the temperature of the silicon die within the package of the device when the device is powered. The junction temperature can also be referred to as the operating temperature. The goal of thermal management is to manage the heat to the junction temperature.

What is semiconductor junction temperature and how do you manage to it

A successful thermal design requires that the junction temperatures of all critical devices in a system be sufficiently below their critical level in the worst-case ambient temperature. Otherwise, higher temperatures may result in data transmission bit errors and/or a decrease in a system’s life expectancy. Thermal coupling and non-uniform PCB layout make this determination a complicated process.

The list of thermal parameters that a complete system has to manage to help reduce the junction temperature on a device are pretty long:

  1. Thermal coupling within the system and surrounding equipment
  2. System standardization (e.g., the ATCA Standard)
  3. Constrained space
  4. EMI/EMC requirements for high frequency devices, boards and packaging
  5. Acoustic noise/li>
  6. Limited air flow
  7. Rigid performance standards (e.g., 72 hours operation at 55oC)
  8. Non-uniform power distribution and congested PCBs
  9. Service Level Agreement(e.g., system operational within 4 hours of failure)

The following table shows the approach, domain, anticipated results, and the needed tools to successfully obtain the junction temperature of a device in the system.

Solution Order Package Level Expected Results Requirements and Tools
First System System flow distribution and boundary conditions for the card racks, T, V, and Pressure Measurement or
Second’ Card Rack (chassis) Boundary conditions for the PCB, and thermal coupling between the board and the rack Measurement or Simulation (CFD) and solid modeling (temperature gradient in the solid)
Third Board (PCB) Boundary conditions for the component on heat transfer and fluid flow Measurement of fluid flow distribution and board properties and board level solid modeling
Fourth Component (device or module) Boundary conditions for the Die (Tj) and its cooling solution Fluid flow and temperature measurement equipment; Heat sink; Interface materials and their properties;Solid modeling;Package material properties

Once the junction temperature is obtained by using two independent methods, it must be ensured that there is at least a 10% margin of safety in the design. Therefore, the following equation must be satisfied.

Junction temperature formula

Where

Tj, calculated = junction temperature as the result of above calculation.
Tj, spec = critical junction temperature specified by the manufacturer.
Ta, reference = reference ambient or approach air temperature.

With a properly determined junction temperature in hand, a cooling method can be selected for maintaining the desired performance. Depending on the data obtained from the table, we can choose from these options:

  • Natural convection
  • Forced convection (air-mover)
  • Active air cooling (not very common)
  • Jet impingement (air or liquid)
  • Advanced systems (liquid or refrigeration)

Although cooling by air is the most common and preferred system, liquid cooling has been used in unique circumstances. Regardless of the method selected, every cooling decision should consider the following parameters:

  • Cooling capacity – does it satisfy the junction temperature requirements?
  • Size – does it comply with the packaging requirements?
  • Regulatory requirements – does it meet the system and site implementation requirements (e.g., NEBS) ?
  • Reliability – does it meet the expected life requirements?
  • Budget – does it comply with the cost constraints imposed on the system?
  • Market availability – is it readily available? Can supply-chain requirements be met?

Obtaining a successful cooling solution is made possible by combining methodical thermal analysis (as delineated in our table) with the results from at least two independent approaches, and taking into account the above system parameters.

6 questions to guide your engineering investigation in choosing the right heat sink for your application

Here’s a series of questions our engineers walk through when faced with a new thermal mangement project that requires choosing the right heat sink.

Component or Device Details: This includes asking questions to determine the components power level (generally expressed in watts), maximum temperature (Case or Junction C), package size, package type (BGA, flip chip, etc.), package material, and package configuration (exposed die or heat spreader, etc.)

System Airflow: Is there a fan or blower? Is it ducted or unducted? Is it pushing air onto the area needing thermal management or pulling air over the component needing thermal management? Or is it convection cooled?

Space Constraints: What is the allowable height off the PCB? What is the maximum heat sink height allowed? Is heat sink overhang over the component allowed? If heat sink over hang isn’t allowed, would it be allowed if a heat sink were cut out in place to allow closely positioned heat sinks to not be effected (yet overhang would happen in other places).

System Operating Conditions: What is the known to be maximum ambient temperature outside the system? What is the allowed maximum ambient inside the system? Is there a maximum altitude in which the system may eventually operate? Are there shock and vibration specifications to be considered (such as in MIL, NEBS, or ETST)?

Attachment Method Allowed: What attachment method is allowed for the heat sink? Are there pre-drilled, “industry accepted” holes already so that a push-pin heat sink is allowed or is it preferred that there are no holes in the PCB? Can a clip be used? Is a clip needed for compression of thermal interface material or simply to attach a heat sink loosely? If a clip is okay, how much keep out area around the components is available.

Thermal Interface Material In this section we ask questions to determine the best thermal interface material to use. Choosing and applying the right thermal interface material can reduce case temperature by as much as 50% We’ll want to know if the component has any surface irregularities or all out roughness, and we’ll need to know the surface area of the contact area.

We’ll take answers from all the questions and use them to help us get a complete picture of the thermal requirements for a given project. Stepping through questions such as these can be a logical road map to doing some basic thermal analysis that can lead to the right heat sink for your application.

If you need a team to hep you through the engineering investigation phase or if you’ve been through that phase already and just need a heat sink that meets your specifications, contact ATS! You can learn more about us at our website http://qats.com or you can email us with your request sending mail to [email protected]

Copper Heat Sinks? Aluminum Heat Sinks? Does it matter what you make a heat sink from?

True or False?  Heat sink materials make a difference in how efficient a heat sink will be?

Well, like a lot of things in thermal management, it depends on the constraints of your application. Neither copper heat sinks nor aluminum heat sinks are always the default choice.

108K different push pin heat sink assembly configurations featuring 3 different pitch heat sink types, 3 different fin geometries, brass and plastic push pins

 

Recently, ATS performed a study to provide some clarity to users on how different “standard” materials act as heat sinks. Our study included copper heat sinks, aluminum heat sinks and graphite foam heat sinks. We published our article in ECN under the title, “Comparing the Impact of Different Heat Sink Materials on Cooling Performance“.

The results of our study were quite interesting.  As you can see from the following graph, graphite was a good material but not the best. Copper and Aluminum performed better and similarly.

Comparison of copper, aluminum and graphite foam heat sinks

Our conclusions were:

  • Copper and Aluminum are very close in thermal performance. If weight is an issue or cost, then Aluminum is the way to go. The size of your heat sink or the thermal interface material can often make the difference too.
  • Pure copper has about 2x the conductivity of aluminum but that inherent advantage is only helpful when
  1. Air Flow speeds are 800LFM
  2. The hot spot on the CPU or other semiconductor is small in comparison to the size of the chip itself.
  • When air flow is 400LFM or lower or the hot spot on the CPU or semiconductor is spread throughout the chip, then Aluminum is a better choice.
  • The cost of a copper heatsink is often up to 3x the equivalent sized aluminum heatsink
  • Graphite foam-derived heat sinks show promise in specific applications, but exhibit several drawbacks in mainstream electronics cooling.

You can read the full study at ECN by clicking to “Comparing the Impact of Different Heat Sink Materials on Cooling Performance“. You can also check out our earlier conversations on this topic by clicking to our posts, “Is CPU Cooling best done with a Copper Heatsink or Aluminum Heatsink?” and “Intel’s nano-technology breakthrough for heat sinks has R&D promise but real-world applications are in the future; An ATS thermal management technology analysis”

Also, if you are a member of Linked-In, there is a Thermal Management group that is worth joining, plus, there is a sub-group off of that focusing on next generation materials for heat sinks. Well worth joining!