Tag Archives: thermal management

What is a Heat Pipe and How Does it work in Thermal Management? (part 1 of 2)

Heat Pipes have been called Heat Superconductors! In this two part series we’ll talk about what a heat pipe, how they are made, compare them with heat sinks, and talk about performance in various thermal management applications.

Diagram of a basic heat pipeFigure 1 Schematic View of a Heat Pipe [1]

Heat pipes are transport mechanisms that can carry heat fluxes ranging from 10 W/cm2 to 20 KW/cm2 at a very fast speed. Essentially, they can be considered as heat super conductors. Heat pipes can be used either as a means to transport heat from one location to another, or as a means to isothermalize the temperature distribution.

The first heat pipe was tested at Los Alamos National Laboratory in 1963. Since then, heat pipes have been used in such diverse applications as laptop computers, spacecraft, plastic injection molders, medical devices, and lighting systems. The operation of a heat pipe is described in Figure 1.

A heat pipe has three sections: the evaporator, the adiabatic, and the condenser. The interior of the pipe is covered with a wick, and the pipe is partially filled with a liquid such as water. When the evaporator section (Le) is exposed to a heat source, the liquid inside vaporizes and the pressure in that section increases. The increased pressure causes the vapor to flow at a fast speed toward the condenser section of the heat pipe (Lc). The vapor in the condenser section loses heat to the integral heat sink and is converted back to liquid by the transfer of the latent heat of vaporization to the condenser. The liquid is then pumped back to the evaporator through the wick capillary action. The middle section of the heat pipe (La), the adiabatic portion, has a very small temperature difference.

Chart showing pressure drop distribution in a heat sinkFigure 2 Pressure Drop Distribution in a Heat Pipe [1]

Figure 2 shows the pressure drop distribution inside a heat pipe. In order for the capillary force to drive the vapor, the capillary pressure of the wick should exceed the pressure difference between the vapor and the liquid at the evaporator. The graph also shows that if the heat pipe is operated against the force of gravity, the liquid undergoes a larger pressure drop. The result is less pumping of the wick with reduced heat transfer. The amount of heat transfer decrease depends on the particular heat pipe.

A typical heat pipe is made of the following:

  1. Metallic pipe: The metal can be aluminum, copper or stainless steel. It must be compatible with the working fluid to prevent chemical reactions, such as oxidation.
  2. Working fluid: Several types of fluids have been used to date. These include methane, water, ammonia, and sodium. Choice of fluid also depends on the operating temperature range.
  3. Wick: The wick structure comes in different shapes and materials. Figure 3 shows the profiles of common wick types: axial groove, fine fiber, screen mesh, and sintering. Each wick has its own characteristics. For example, the axial groove has good conductivity, poor flow against gravity, and low thermal resistance.
    Conversely, a sintering wick has excellent flow in the opposite direction of gravity, but has high thermal resistance.

Different Wick Structures in a Heat PipeFigure 3 Different Wick Structures

That ends part 1 and in part 2 we’ll address factors that can limit a heat pipes effectiveness, differences in the thermal performance of various heat pipe types, and the spreading resistance of different materials.

Have you got a question on heat pipes or their application? How about an interest in bringing ATS’s team of experienced thermal engineers into one of your projects? You can reach us by visiting http://www.qats.com Purchase heat sinks through our Heat Sink eShop or email us at [email protected] or give us a call at 781-769-2800

References:
1. Faghri, A. Heat Pipe Science and Technology Taylor & Francis, 1995.
2. Thermacore Internation, Inc., www.thermacore.com.
3. Xiong, D., Azar, K., Tavossoli, B., Experimental Study on a Hybrid

How ATS heat sinks helped two tier 1 telecommunications companies implement effective thermal management for their LTE and WiMAX equipment

Advanced Thermal Solutions, Inc (ATS), a leader in offering Innovations in Thermal Management, recently demonstrated that its maxiFLOW heat sink with superGRIP heat sink clip can cool semiconductor-dense and thermally-challenging LTE and WiMAX telecommunications network equipment. Two Tier 1 telecommunications equipment OEMs had faced significant thermal and mechanical challenges on their new designs.

Telecommunications

(Wikimedia Commons)

Deploying ATS thermal management technology allowed them both to ship their network equipment to customers in Japan and the United States, meeting schedules, and winning the confidence of their major customers, both wireless providers.

In example one, an ATS customer was faced with a real dilemma. Having used microTCA and other modular technologies to develop both their WiMAX and LTE telecommunications infrastructure equipment, they faced the challenge of dealing with high heat and restricted air flow in their system. After considering various options, they opted to test ATS’s solution.

The results were dramatic, reducing board temperature 15%. The temperature reduction made it possible for the systems to operate at the designed performance levels, and keep the manufacturer’s development costs in check since no architecture changes or fan additions were necessary. Their U.S. and Japanese wireless customers received their equipment and successfully trialed.

In example two, ATS’s customer was at the start of launching their new 4G LTE telecommunications platform. Early trials showed great promise but thermal issues dogged the design, making reliability a concern. This customer knew their design needed some additional thermal management technology to realize its design specification. They called in ATS to perform root cause analysis of the problem and provide a solution.

After performing both CFD and physical tests, the problem was identified. ATS’s maxiFLOW and superGRIP technologies were then deployed in the customer’s system. Resultant tests successfully improved reliability, while only adding single digit percentages to the product cost.

Both these examples show the advantage of ATS thermal management technology in telecommunications equipment.

Learn more about how your next or current telecommunications equipment project can be cooled so it can operate at its peak performance level, visit https://www.qats.com/Consulting/Custom-Cooling-Solutions.

How Heat Sink Anodization Improves Thermal Performance (part 2 of 2)

In part 1 of this 2 part article, we discussed heat sink anodization, and how it affects radiation cooling in thermal management. In part 2 we’ll cover the heat sink anodization process and different types of anodization.

A typical anodizing process has five steps: cleaning, pretreatment, anodizing, coloring and sealing. First, alkaline and acidic cleaners are used to remove any residual grease or dirt on the surface. Next, the surface is etched using sodium hydroxide to remove minor surface imperfections. At this stage, a thin layer of metal is removed to create a matte or dull finish. This surface is then brightened to a near mirror finish with a concentrated mixture of phosphoric and nitric acids which chemically smooths the metal surface. The surface is now ready to be anodized by passing an electrical current through an acid electrolyte bath in which the metal is immersed. The coating thickness and surface characteristics are tightly controlled to meet end product specifications [3].

Coloring can be achieved in a number of different ways. The most technically advanced color quality is obtained from the two-step electrolytic coloring method. The anodized part is immersed in a bath containing an inorganic metal salt, and then current is applied which deposits the salt in the base of the pores. The resulting color is dependent on the metal used, the processing conditions and the dye intensity of the organic dyes. Commonly used metals in inorganic salt baths include tin, cobalt, nickel, and copper [3].

Even though the main concept of surface anodizing is the same, the process could differ in terms of the acidic electrolyte used. One of these is chromic acid, or type 1, anodizing. In this process, the color will vary from clear to dark gray depending on the alloy. Copper alloys only yield gray colors. The thickness of the surface anodizing for this process usually ranges from 0.5 to 7.6 microns [3]. Because the anodized thickness in type I is not thick, it is not as readily dyed as the other types of anodized surfaces uses sulfuric acid. This is known as type II anodizing and can produce an anodized layer with a thickness from 1.8 to 25.4 microns. Because the thickness of type II anodizing is sufficiently large, an organic dye or color could be easily applied with the two-step electrolytic coloring method.

Type III anodizing refers to hard coat anodizing (hard anodizing) with a thickness from 12.7 to 115 microns. This method is often used where the environment is harsh and extreme and the anodizing must protect the part against long term corrosion, weather and wear damages. The thickness for these three types of surface anodizing is summarized in Table 1.

heat sink anodization types

References:

  1. Radiation Heat Transfer and Surface Area Treatment, Qpedia Thermal eMagazine, June 2008.
  2. Edwards, J., Coating and Surface Treatment Systems for Metals, Finishing Publications Ltd. and ASM International, 1997.
  3. Aluminum Anodizer Council Web Forum.
  4. Gustavsen, A. and Berdahl, P. Spectral Emissivity Of Anodized Aluminum And Thermal Transmittance Of Aluminum Windows Frames, Nordic Jounnal Of Building Physics, Vol.3, 2003.
  5. Ozisik, N.,Heat Transfer: A Basic Approach, McGraw-Hill, 1984.
  6. Highly Emissive Ion Beam Textured Surfaces for Improved Cooling of Electronic Devices, Electronics Cooling Magazine, September 1997.
  7. Chi, T. , Ballinger, R., Olds, R., and Zecchino, M., Surface Texture Analysis Using Dektak Stylus Profilers, Veeco Instruments, Inc.

OEM cuts project costs, improves MTBF using ATS heat sink solution: An ATS Thermal Labs Case Study

A California based optical networking company asked ATS for thermal management services to manage excess heat in a telecom cabinet.

The OEM’s optical transport board employed 16 heat sinks, two of which were ATS maxiFLOWTM heat sinks. These were attached to hot processors using the ATS maxiGRIPTM clip system. The other heat sinks were all 15mm x 15mm straight fin designs attached to various semiconductors using a thermally conductive epoxy. The thermal epoxy was meant to provide a secure, mechanical bond for mounting the heat sinks to the ICs on their circuit board. But the results were not as expected. The epoxy-attached heat sinks began falling off the PCBs in both field and lab deployments.

The customer’s team considered alternative approaches, including thermal adhesive tape but were unable to find a suitable solution. ATS was brought onto the team to find the problems root cause and provide a suitable solution that met the OEMs technical requirements and cost constraints.

ATS analyzed the customer’s circuit boards, heat sinks, and the thermal epoxy, and completed thermal modeling and analysis of the application. Following this approach, ATS recommended using the originally designed-in heat sinks. The thermal analysis showed their performance was satisfactory, with margin, for this application. ATS recommended a heat sink clip be used instead of thermal epoxy. The ATS superGRIPTM heat sink clip and a phase change thermal interface material were then introduced.

ATS supplied early samples of a standard superGRIP and 15mm x 15mm straight fin heat sink. After physical testing, both thermal teams came to the conclusion that the new solution would improve both the mechanical attachment and thermal performance. However, the standard off the shelf superGRIP was not the right dimensions for a best fit; critical to it’s mechanical attachment and capability to apply the right amount of pressure for phase change material to be effective. That correct amount of pressure is critical to phase change material so it can give the best heat transfer from the semiconductor to the heat sink.

ATS developed a custom superGRIP for the application, and upon further testing found the combination of straight fin heat sink, superGRIP, and phase change interface to meet the design requirements.

The result of this partnering work between ATS and their customer were:

  • Reduced cost of production as epoxy required more training to use and had a shelf life
  • Passing of NEBS shock and vibration testing
  • Increased product MTBF and reliability
  • The OEM was able to ship their product to gain sales

If your team is facing a similar dilemma, contact us at ATS ; Phone: 781-769-2800, email: [email protected] or visit our web site at http://www.qats.com. You can also click to ATS’s You Tube Channel to see a demo of our superGRIP heat sink clip

Managing to the Junction Temperature for Thermal Management of Telecom and Datacom Equipment

Kontron has just released their first Cavium OCTEON® II AdvancedMC packet processor module, the AM2411. Kontron’s module features the Cavium Networks Octeon II CPU. It’s an incredibly powerful network processor and Kontron has really taken advantage of it to create an industry thumping feature set. This kind of product will serve telecomm companies very well in creating 4G networks using either LTE or WiMAX. The board designers clearly made the product durable as it has passed testing for Telcordia GR-1089, GR-63, IEC 60950-1, EN/CSA/ UL 60950-1. And this quote from their datasheet really tells it all regarding the 4211’s design point, quality: “This board is designed to meet NEBS Level 3, Earthquake Zone 4”

Board quality and specifications are not going to be a question with this product!

What is going to be a consideration is what this product is like in a chassis full of other boards operating at peak performance. There is no question Kontron has done a great job designing their board, but, their board now becomes a component in an integrated system. Such an integration of Commercial Off the Shelf Components (COTS)is almost always a challenge across a number of technical areas.

Trenton Technologies wrote a bit on this in their blog back in July of 2010 with their post, “Can You Really Simplify Integration of Industrial Computer Systems?” In that post they noted that 6 key factors to decided if a COTS solution could be used in an application, those six points are:

  1. System location requirements
  2. Projected service life of the system
  3. Number of option cards needed in the computer
  4. System expansion requirements
  5. System power and fail-over requirements
  6. System O/S and application software solution requirements

But the one piece they missed was the overall system thermal load. So let’s talk about that a bit. First, the key target temperature to keep in mind is the junction temperature. The junction temperature is the temperature of the silicon die within the package of the device when the device is powered. The junction temperature can also be referred to as the operating temperature. The goal of thermal management is to manage the heat to the junction temperature.

What is semiconductor junction temperature and how do you manage to it

A successful thermal design requires that the junction temperatures of all critical devices in a system be sufficiently below their critical level in the worst-case ambient temperature. Otherwise, higher temperatures may result in data transmission bit errors and/or a decrease in a system’s life expectancy. Thermal coupling and non-uniform PCB layout make this determination a complicated process.

The list of thermal parameters that a complete system has to manage to help reduce the junction temperature on a device are pretty long:

  1. Thermal coupling within the system and surrounding equipment
  2. System standardization (e.g., the ATCA Standard)
  3. Constrained space
  4. EMI/EMC requirements for high frequency devices, boards and packaging
  5. Acoustic noise/li>
  6. Limited air flow
  7. Rigid performance standards (e.g., 72 hours operation at 55oC)
  8. Non-uniform power distribution and congested PCBs
  9. Service Level Agreement(e.g., system operational within 4 hours of failure)

The following table shows the approach, domain, anticipated results, and the needed tools to successfully obtain the junction temperature of a device in the system.

Solution Order Package Level Expected Results Requirements and Tools
First System System flow distribution and boundary conditions for the card racks, T, V, and Pressure Measurement or
Second’ Card Rack (chassis) Boundary conditions for the PCB, and thermal coupling between the board and the rack Measurement or Simulation (CFD) and solid modeling (temperature gradient in the solid)
Third Board (PCB) Boundary conditions for the component on heat transfer and fluid flow Measurement of fluid flow distribution and board properties and board level solid modeling
Fourth Component (device or module) Boundary conditions for the Die (Tj) and its cooling solution Fluid flow and temperature measurement equipment; Heat sink; Interface materials and their properties;Solid modeling;Package material properties

Once the junction temperature is obtained by using two independent methods, it must be ensured that there is at least a 10% margin of safety in the design. Therefore, the following equation must be satisfied.

Junction temperature formula

Where

Tj, calculated = junction temperature as the result of above calculation.
Tj, spec = critical junction temperature specified by the manufacturer.
Ta, reference = reference ambient or approach air temperature.

With a properly determined junction temperature in hand, a cooling method can be selected for maintaining the desired performance. Depending on the data obtained from the table, we can choose from these options:

  • Natural convection
  • Forced convection (air-mover)
  • Active air cooling (not very common)
  • Jet impingement (air or liquid)
  • Advanced systems (liquid or refrigeration)

Although cooling by air is the most common and preferred system, liquid cooling has been used in unique circumstances. Regardless of the method selected, every cooling decision should consider the following parameters:

  • Cooling capacity – does it satisfy the junction temperature requirements?
  • Size – does it comply with the packaging requirements?
  • Regulatory requirements – does it meet the system and site implementation requirements (e.g., NEBS) ?
  • Reliability – does it meet the expected life requirements?
  • Budget – does it comply with the cost constraints imposed on the system?
  • Market availability – is it readily available? Can supply-chain requirements be met?

Obtaining a successful cooling solution is made possible by combining methodical thermal analysis (as delineated in our table) with the results from at least two independent approaches, and taking into account the above system parameters.