Tag Archives: thermal management

Are Your Heat Sinks and Thermal Management Strategy for Your Target Seminconductors Optimized or Deadended?

By virtue of the fact that ATS is a provider of heat sinks and thermal management solutions to electronics, much of work is target at the junction temperature of semiconductors. We work with a lot of suppliers in this space, most recently Intel’s Sandybridge. Which leads me to the reason for addressing this topic.

Are Your Heat Sinks and Thermal Management Strategy for Your Target Seminconductors Optimized or Deadended?

Of all the semiconductor providers works with, ATS has done a great deal of work with Caviuim, TI and Freescale. It’s not that their processors are unusually hot, it’s that these firms recognize that ATS does a great job of optimizing a thermal design. Our case studies show a wide range of applications and successes in this optimization.

With Cavium, ATS is a thermal development partner. We’ve tackled a number of difficult designs with them and with Cavium customer’s whose design elements create very dense, high performance products but in some small and low air flow applications.

ATS has two off-the-shelf stocks solutions for Cavium that can be used as design starting points, The ATS-691-C2-R1 offers up a thermal resistance of .6 C/W at 200 LFM and the ATS-725-C1-R1 offers up a thermal resistance of 2 C/W at 200 LFM.

Thermal Coupling in Electronics Cooling (part 2 of 2)

In part 1 we wrote about what thermal coupling is and how the coupling effect works. Here in part 2 we’ll explore the coupling effect of radiation, conduction and convection.

To better understand the coupling effects of radiation, conduction and convection and their relative contributions to heat transfer, a model of the case from part 1 of this 2 part series was constructed and solved in CFD. A picture of the set-up is shown in Figure 2.

View of Tunnel With Test Block for Thermal Coupling ExampleFigure 2. View of Tunnel With Test Block

The CFD analysis was performed for the following four cases:

  1. The test block was assumed to be made of aluminum and radiation boundary conditions were applied (the walls of the tunnel were assumed to be isothermal at a temperature of 5°C.)
  2. The block was assumed to be made of aluminum and no radiation boundary conditions were applied (there was no applied wall temperature or emissivity)
  3. The block was assumed to be made of multilayer PCB material and radiation boundary conditions were applied (the tunnel walls were assumed to be isothermal at a temperature of 5°C.)
  4. The block was assumed to be made of multilayer PCB material and no radiation boundary conditions were applied (no applied wall temperature or emissivity)

Each of the four cases above was solved for air velocities of 0.125, 0.25, 0.5, and 1 m/s. For each case, the maximum temperature at the heat source is shown in Table 1 below.

Temperature Data Obtained from CFD for Thermal Coupling ExperimentGraph of Radiation and Convections Results for CFD
Figure 3: Graph of Radiation and Convection Results for CFD

This graph is especially revealing. First, in all cases, increasing the air flow resulted in greater convective heat transfer and lower max temperatures. Further, as the surface temperature of the block decreased, the radiation heat transfer relative to the convective heat transfer was reduced. This is evidenced by the converging lines for each block material (with radiation on or off). Finally, the effect of conduction can be seen in the offset in temperatures between the aluminum and the layered PCB blocks. The max temperatures for the Al blocks were consistently lower than those for the PCB blocks. This makes sense because Al is a considerably better conductor than PCB material; and thus the source heat traveled more efficiently through the Al to the surface of the block where it was dissipated by convection and radiation. Figures 4 and 5 show the temperature distribution through the different block materials.

Temperature Distribution Through an Aluminum Block
Figure 4: Temperature Distribution Through an Aluminum Block

Temperature Distribution through a PCB Block
Figure 5: Temperature Distribution through a PCB Block

It is important to understand the role of thermal coupling in the cooling of electronic devices. The example above illustrates how the different modes of heat transfer are interrelated.

In general, the convective mode of heat transfer requires a fluid. Its effectiveness is strongly dependent on the convective heat transfer co-efficient, which is a function of the fluid velocity and temperature. Because convection is a dominant mode of heat transfer for many electronics cooling applications, thermal engineers should try to maximize the available air flow in a given situation.

The radiation mode of heat transfer requires no medium. It can occur in a vacuum, such as space. Radiation is dominant when temperature differences are great. As seen in the example above, the effect of radiation heat transfer can be significant and should not be ignored.

Finally, the conductive mode of heat transfer requires a solid. Conduction is dependent on the thermal conductivity of the solid, which is usually assumed to be constant for most materials. Thermal engineers should make use of high conductivity materials whenever possible.

Got a question on part 1 or part 2 from today? Contact us and we’ll clarify. And, lets see how ATS thermal engineers can make your next project a success! Email us at [email protected] , call us at 781-769-2800 or visit our Design Services

References

1. CFdesign® Software, Blue Ridge Numerics, Inc.

Free ATS Webinar: How to Properly Measure Temperature within Electronic Systems and Analyze the Results

On Thursday, April 28, 2011 2:00 PM – 3:00 PM EDT, ATS will be holding a free webinar, “How to Properly Measure Temperature within Electronic Systems and Analyze the Results”

Attendees will become familiar with the importance of temperature measurement in electronic systems. They will learn about the essential instruments and the locations within a system where testing should be conducted.  The webinar presenter will also discuss how to analyze the temperature data as part of a complete thermal analysis.

To register, click to our registration site at this link: https://www2.gotomeeting.com/register/952923650

For the Chinese Mandarin presentation of our webinar please register at http://bit.ly/ATS_temp_mesaurement_Mandarin

 

Compilers Come to the Rescue in Thermal Management

Generally when we think of thermal management here at ATS, we think of it in terms of hardware. We consider heat pipes or heat sinks. We look at air flow and it’s direction. We consider materials and if their thermal conductivity is sufficient for a project or not. But that’s not the only part of the equation. Software is as well. And not just software for thermal modeling, but in terms of controlling semiconductors to reduce the thermal load in a system.

The key here is temperature aware compiling for VLIW (very long instruction word) processors. By properly grouping instructions in a CPU, compiler developers can help reduce the overall thermal load in a system. They do this by grouping as many instructions as possible in parallel, thereby minimizing the CPU workload and it’s peak temperature. There are a couple of techniques that have been published in research papers that we want to make our readers aware of.

The first is the technique of TempIB or Temperature Aware Binding Technique. This approach was developed by Benjamin Carrion Schafer, Yongho Lee, and Taewhan Kim at the School of Electrical Engineering and Computer Science Seoul National University, Korea. This technique:

effectively binds the instructions executed in parallel to the coolest possible functional units for a given fixed schedule. It generates, for each instruction in a scheduled instruction word, a priority queue of the coolest functional units that can execute the instruction, and rebinds it to the coolest possible unit, considering the temperature as well as the power consumed by the instruction.

Tests by the team show that temperature can be lowered almost 13% using this technique in thermal management. You can read their paper at this link: “Temperature-Aware Compilation for VLIW Processors“.

Another approach by researchers Madhu Mutyam, at the International Institute of Information Technology, Hyderabad, India and Feihui Li, Vijaykrishnan Narayanan, Mahmut Kandemir, and Mary Jane Irwin at Pennsylvania State University uses

a compiler-based approach to make the thermal profile more balanced in the integer functional units of VLIW architectures. For balanced thermal behavior and peak temperature minimization, we propose techniques based on load balancing across the integer functional units with or without rotation of functional unit usage.

You can read their work at this link, “Compiler-directed thermal management for VLIW functional units”

Using software in this fashion may not be the standard approach to thermal management, but, adding it into the mix of strategies for electronics cooling, it can clearly help the overall goal.

What is a Heat Pipe and How Does it work in Thermal Management? (part 2 of 2)

We’re concluding a two part series today on what a heat pipe is and how it works in thermal management. In part one we talked about what a heat pipe is and the anatomy of a heat pipe. Here in part 2 we’ll conclude with factors that can limit a heat pipes effectiveness, differences in the thermal performance of various heat pipe types, and the spreading resistance of different materials.

Table 1 shows experimental data for the operating temperature and heat transfer for three different types of heat pipes [1].

Heat Pipes With Different Constructions and Operating ConditionsTable 1: Heat Pipes with Different Structures and Operating Conditions [1]

Certain factors can limit the maximum heat transfer rate from a heat pipe. These are classified as follows:

  1. Capillary Limit: Heat transfer is limited by the pumping action of the wick
  2. Sonic Limit: When the vapor reaches the speed of sound, further increase in the heat transfer rate can only be achieved when the evaporator temperature increases
  3. Boiling Limit: High heat fluxes can cause dry out.
  4. Entrainment Limit: High speed vapor can impede the return of the liquid to the condenser

A heat pipe has an effective thermal conductivity much larger than that of a very good metal conductor, such as copper. Figure 4 shows a copper-water heat pipe and a copper pipe dipped into an 80oC water bath. Both pipes were initially at 20oC temperature. The heat pipe temperature reaches the water temperature in about 25 seconds, while the copper rod reaches just 30oC after 200 seconds. However, in an actual application when a heat pipe is soldered or epoxied to the base of a heat sink, the effective thermal conductivity of the heat pipe may be drastically reduced due to the extra thermal resistances added by the bonding. A rule of thumb for the effective thermal conductivity of a heat pipe is 4000 W/mK.

Experiment Comparing Speed of Heat Transfer Between a Heat Pipe and a Copper PipeFigure 4. Experiment Comparing Speed of Heat Transfer Between a Heat Pipe and a Copper Pipe [1].

Heat pipe manufacturers generally provide data sheets showing the relationship between the temperature difference and the heat input. Figure 5 shows the temperature difference between the two ends of a heat pipe as a function of power [2].

Temperature Difference Between the Evaporator and the Condenser in a Heat PipeFigure 5. Temperature Difference Between the Evaporator and the Condenser in a Heat Pipe [2]

There are many heat pipe shapes in the market, but the most common are either round or flat. Round heat pipes can be used for transferring heat from one point to another. They can be applied in tightly spaced electronic components, such as in a laptop. Heat is transferred to a different location that provides enough space to use a proper heat sink or other cooling solution. Figure 6 shows some of the common round heat pipes available in the market.

Typical Round Heat Pipes in the Market.Figure 6. Typical Round Heat Pipes in the Market.

Flat heat pipes (vapor chambers) work conceptually the same as round heat pipes. Figure 7 shows a flat pipe design, they can be used as heat spreaders. When the heat source is much smaller than the heat sink base, a flat heat pipe can be embedded in the base of the heat sink, or it can be attached to the base to spread the heat more uniformly on the base of the heat sink. Figure 8 shows some common flat heat pipes.

Conceptual Design Schematic of a Flat Heat Pipe

Figure 7. Conceptual Design Schematic of a Flat Heat Pipe

Commonly Used Flat Heat PipesFigure 8. Commonly-used Flat Heat Pipes

Although a vapor chamber might be helpful in minimizing spreading resistance, it may not perform as well as a plate made from a very high conductor, such as diamond. A determining factor is the thickness of the base plate. Figure 9 shows the spreading resistance for 80 x 80 x 5 mm base plate of different materials with a 10 x 10 mm heat source. The vapor chamber has a spreading resistance that is better than copper, but worse than diamond. However the price of the diamond might not justify its application. Figure 9 also includes the spreading resistance from the ATS Forced Thermal Spreader (FTS), which is equal to that of diamond at a much lower cost. The FTS uses a combination of mini and micro channels to minimize the spreading resistance by circulating the liquid inside the spreader.

Thermal Spreading Resistances for Different Materials
Figure 9. Thermal Spreading Resistances for
Different Materials.

Heat pipes have a very important role in the thermal management arena. With projected lifespans of 129,000-260,000 hours (as claimed by their manufacturers), they will continue to be an integral part of some new thermal systems. However, with such problems as dry out, acceleration, leakage, vapor lock and reliable performance in ETSI or NEBS types of environments, heat pipes should be tested prior to use and after unsatisfactory examination of other cooling methods have been explored.

That ends our two part series on heat pipes. Have you got a question on heat pipes or their application? How about an interest in bringing ATS’s team of experienced thermal engineers into one of your projects? You can reach us by visiting http://www.qats.com Purchase heat sinks through our Heat Sink eShop or email us at [email protected] or give us a call at 781-769-2800

References:
1. Faghri, A. Heat Pipe Science and Technology Taylor & Francis, 1995.
2. Thermacore Internation, Inc., www.thermacore.com.
3. Xiong, D., Azar, K., Tavossoli, B., Experimental Study on a Hybrid