Author Archives: Josh Perry

Industry Developments: Thermal Imaging Cameras

(This article was featured in an issue of Qpedia Thermal e-Magazine, an online publication dedicated to the thermal management of electronics. To get the current issue or to look through the archives, visit http://www.qats.com/Qpedia-Thermal-eMagazine.)

Though invisible to the eye, thermal radiation can be detected by thermal imaging cameras, also called thermographic or infrared cameras. Heat is emitted by any object with a temperature above absolute zero. This radiation increases as an object’s temperature rises. Thermal cameras typically provide screen images, called thermograms that display variations in the heat their sensors detected. Thus, different levels of reflection can affect what the visualization looks like.

Visible light cameras work in the 0.45 – 0.75 µm (450-750 nm) wavelength range. Thermal imaging cameras detect wavelengths up to 14 µm (14,000 nm). For engineering use, these cameras allow one to view, pinpoint and analyze differing thermal patterns. They can detect heat dissipation and leakage from target objects or over an expanse. When used with electronic devices, thermal imaging cameras show if and where a device is running hot, or if it is running below its normal operating temperature.

Thermal Imaging Cameras

Figure 1. Keysight Technologies Thermal Imager for electronics design and troubleshooting. [1]

These cameras calculate surface temperature based on a combination of emitted, reflected and transmitted heat. Today’s cameras are capable of making temperature measurements from -80°C to +3000°C. Some cameras can detect temperature differences as small as 0.02°C.

Professional quality cameras integrate extremely high imaging performance and accurate temperature measurements with integral software for analyzing and reporting. They are suitable for research, testing, troubleshooting and product validation applications. [2] A wide range of thermal imaging cameras is available for general and recreational use. Most recently, new mobile apps allow phones and other portable devices to be used for basic but useful thermal imaging.

Cooled and Capable

In broad terms, thermal imaging cameras fall into two categories: those that are cooled and those are not.

Higher performance thermal imaging cameras have integral cooling systems to adjust their sensor temperatures to cryogenic levels, typically starting at -150°C. Most modern cooled detectors operate in the 60 to 100 K range (-215 to -175°C), depending on type and performance level. Cooled cameras typically are vacuum-sealed and feature cryocoolers or other systems to lower sensor temps. One cooling method uses pressurized gas, which is expanded via a micro-sized orifice and passed over a miniature heat exchanger resulting in regenerative cooling via the Joule–Thomson effect. [3]

Very cold sensor temperatures are needed to prevent these high-performance cameras’ own thermal radiation or any other away from target radiation – referred to as thermal noise – from interfering with the heat signal from whatever is being imaged.

Cooled cameras typically have greater magnification capabilities than uncooled cameras because they can detect shorter infrared wavelengths. Because cooled cameras are more sensitive they can employ lenses with more optical elements, or thicker elements can be used without degrading the signal to noise ratio. This results in better magnification performance. [4]

Highly sensitive cooled cameras can detect the slightest temperature differences. They can be designed to enable imaging in the mid-wave infrared band, 3-8 µm, and the long-wave infrared band, 8-15 µm, of the wavelengths spectrum where there is higher thermal contrast. The more thermal contrast, the easier it is to determine objects against a background not hotter or colder than the object.

Many applications of cooled thermal imaging cameras are found in space, typically in orbiting satellites. In those environments, cryocoolers help cool thermal imaging devices that need to reach as low as -195°C (-320°F) to detect what they’re designed to capture. Lockheed Martin’s new microcryocooler allows the use of large and highly sensitive IR sensors capturing very high-resolution images. [5]

Figure 2. Lockheed Martin’s microcryocooler cools satellite-based thermal imaging cameras, providing continuous operation for 10 or more years. [5]

Among the drawbacks of cooled infrared cameras are their price and operating costs. Cooling is both energy-intensive and time-consuming. A camera’s electronics may need several minutes to cool down before it can begin working. But while their cooling mechanisms are comparatively bulky and expensive, cooled infrared cameras provide superior image quality compared to uncooled ones.

Uncooled and User-Friendly

The image sensors in uncooled thermal cameras work at or near ambient temperature. No cryogenic cooling is needed. The sensors work by detecting changes in resistance, voltage or current when heated by infrared radiation. These changes are measured and compared to the values at the operating temperature of the sensor.

The primary type of uncooled detector today is the microbolometer, a device based on microelectromechanical (MEMS) technology. A microbolometer is a tiny vanadium oxide (VOx) resistor with a large temperature coefficient on a silicon element with large surface area, low heat capacity and good thermal isolation. When infrared radiation in wavelengths between 7-13μm strikes a microbolometer’s detector material and is absorbed, it heats up and the resulting change in its electrical resistance is the basic sensing technique.

Figure 3. Depiction of a microbolometer for use in uncooled thermal imaging cameras. [6]

These changes are processed by separate core electronics to create a thermal image. The detectors are quite sensitive and are able to sense heat radiated from objects depending on their temperature. [7]

Uncooled cameras are smaller and easier to use. However, their resolution and image quality tend to be lower than cooled detectors. This is due to difference in their fabrication processes, limited by currently available technology. Uncooled cameras can be used without cool-down intervals and require less power than cooled thermal imaging cameras.

Uncooled cameras are generally much less expensive than cooled infrared cameras and they have fewer moving parts, so they tend to have much longer service lives than cooled cameras under similar operating conditions. Uncooled image sensors are manufactured in fewer steps, and with higher yields, compared to cooled sensors, and uncooled cameras do not require cryocoolers, which are very costly devices. [7]

Thermal Imaging by Smartphones and Tablets

The FLIR ONE, from FLIR Systems, transforms a mobile device into a thermal imager that sees heat and measures temperature. The device provides users with the ability to see temperature variations smaller than a tenth of a degree. FLIR’s technology enables a host of practical applications, from identifying energy inefficiencies and water leaks in a home, to enabling safe and enjoyable outdoor exploration. Versions are available for both iOS and Android device platforms. [8]

Figure 5. The pocket-sized FLIR ONE transforms a mobile device into a thermal imager that sees heat and measures temperature. [8]

The FLIR ONE uses a micro-USB connector for Android devices and a Lightning connector for iOS devices to offer a compact accessory that connects to smartphones and tablets. Its power comes from an internal battery. Images are enhanced with FLIR’s multi-spectral dynamic imaging (MSX) technology, which embosses the edge details from FLIR ONE’s visible camera onto the thermal image producing high fidelity images.

Seek Thermal, in conjunction with defense and aerospace company Raytheon, developed a 32,000 thermal pixel imaging chip — with a resolution of 206 x 156 array. The Seek thermal camera, which weighs about half an ounce and measures 2.75 x 84 x .84 inches, plugs into the device’s Lightning connector. It is based on a proprietary 12-micron sensor chip and custom software. For temperature readings, the sensor can detect values from -40°C to 330°C. [9]

Figure 6. Seek Thermal’s app features four thermography modes with nine color overlays to apply to the temperature measurements. [9]

Seek Thermal’s app features four thermography modes with different kinds of information and gives a choice of nine color overlays to apply to the temperature measurements that will create an image.

The Seek Thermal camera works with Apple devices that have Lightning connectors, such as the iPhone 5, 5c, 5s, and 6 running iOS7 or iOS 8. It also connects to Android devices with a microUSB connector running Android 4.4.2 (KitKat) or later. Aside from the iPhone, the app has been tested with the Samsung Galaxy S4 and S5 and the Moto G and X.

Figure 7. The Therm-APP TH camera leverages modern smartphones’ high-definition and touchscreens. [10]

Thermal imaging cameras from Therm-App are designed for Android smartphones. Different models of Therm-App cameras feature long-range night vision along with video and sound recording. Their high-performance Hz model features a 384 x 288, 17µ thermal detector and 25 Hz frame rate that provides better image quality when tracking objects on the move. [10]

Thermal imaging cameras are valuable tools for detecting problems in electronics, and have myriad uses in everyday life. High end cooled thermal cameras provide impressive performance at premium costs and somewhat restricted use. Uncooled thermal imaging cameras can be used in many professions and by hobbyists. Among the newest developments for uncooled cameras are their use with smartphones and tablets.

References
1. Keysight Technologies, http://www.keysight.com/en/pc-2386399/trueir-series-thermal-imagers?nid=-32903.0&cc=US&lc=eng
2. Quality Magazine, http://www.qualitymag.com/articles/92609-high-speed-thermal-imaging-for-automation-applications
3. http://www.flirmedia.com/MMC/CVS/Tech_Notes/TN_0005_EN.pdf
4. FLIR Systems, http://www.flir.com/science/display/?id=65982
5. Lockheed Martin, http://www.lockheedmartin.com/us/news/press-releases/2015/august/space-Microcryocooler-payloads.html
6. Ipi-Infrared, http://www.ipi-infrared.com.au/how-do-infrared-cameras-work/
7. Sofradir-EC, http://www.sofradir-ec.com/wp-uncooled-detectors-achieve.asp
8. FLIR Systems, https://www.flir.com/news-center/press-releases/flir-systems-announces-availability-of-third-generation-flir-one-thermal-imaging-cameras-for-smartphones-and-tablets/
9. Seek Thermal, http://thenextweb.com/creativity/2014/09/25/seek-thermals-new-mobile-camera-attachments-let-see-heat
10. Therm-App, https://therm-app.com/

For more information about Advanced Thermal Solutions, Inc. (ATS) thermal management consulting and design services, visit https://www.qats.com/consulting or contact ATS at 781.769.2800 or [email protected].

ATS Cold Plates Displayed at PCIM Europe in Richardson RFPD Booth

Thanks to its new distribution partnership with Richardson RFPD, Advanced Thermal Solutions, Inc. (ATS) was given the chance to display its new, high-performance cold plates at PCIM Europe 2018 held in Nuremberg, Germany at the beginning of June.

PCIM Europe 2018

ATS cold plates were displayed at the Richardson RFPD booth with Vincotech’s new mid-power VINcoPACK E3, which is a low-profile package for motion control and UPS applications that features a six-pack configuration. (Richardson RFPD)

The showcased solution demonstrated how a high-powered device easily connects with the mounting patterns manufactured on ATS cold plates to meet industry-standard insulated-gate bipolar transistors (IGBT), such as those from Mitsubishi, Vincotech, which was on display at PCIM (pictured above), and other leaders in the power electronics industry.

The flexibility in the ATS design allows for cooling of high-powered devices, such as those made from silicon carbide (SiC) or gallium nitride (GaN), without the need for associated tooling costs, which are commonly found when changing the mounting pattern of liquid cold plates.

The cold plates have an innovative, high aspect ratio fin field that provides 30% better thermal performance than comparable products on the market and are manufactured to be easily customizable for systems with specific thermal or space requirements.

ATS cold plates are the perfect choice for engineers looking for liquid cooling solutions for high-powered systems.

Richardson RFPD has a rich history of providing engineering solutions and distributing components for the global electronics market, with more than 35 locations around the world and specialized knowledge in power electronics. Richardson RFPD is the leader in helping customers design-in the latest products and most innovative technology from the market leaders on its line card.

PCIM Europe 2018, one of the largest power electronics shows on the continent, featured more than 11,000 visitors, more than 500 exhibition, and more than 800 conference attendees. Having ATS cold plates on display, thanks to the relationship with Richardson RFPD, gave ATS a host of potential new customers for its liquid cooling and power electronics cooling solutions.

For more information about Advanced Thermal Solutions, Inc. (ATS) thermal management consulting and design services, visit https://www.qats.com/consulting or contact ATS at 781.769.2800 or [email protected].

Cooling Wide-Bandgap Materials in Power Electronics

Engineers are always looking for an edge in their designs to extract as much power and performance as possible from a system, while attempting to meet industry trends in miniaturization. In the power electronics industry, this has required an examination of the materials being used to overcome inherent limitations from heat, voltage, or switching speed.

Engineers are using wide-bandgap materials to expand the capabilities of power electronics, pushing them beyond the thermal and electrical limits of silicon-based components.

For years, silicon was the answer for the power electronics market, but in the past decade there has been a growing movement towards wide-bandgap materials, particularly silicon carbide (SiC) and gallium nitride (GaN). Wide-bandgap materials have higher breakdown voltage and perform more efficiently at high temperatures than silicon-based components. [1] Recent research indicated, “For commercial applications above 400 volts, SiC stands out as a viable near-term commercial opportunity especially for single-chip current ratings in excess of 20 amps.” [2] This efficiency allows systems to consume less power, charge faster, and convert energy at a higher rate.

A recent article from Electronic Design explained that SiC power devices “operate at higher switching speeds and higher temperatures with lower losses than conventional silicon.” SiC has an internal resistance that is 100 times lower than silicon and a breakdown electric field of 2.8 MV/cm, which is far higher than silicon’s 0.3 MV/cm, meaning that SiC components can handle the same level of current in smaller packages. [3]

Engineers use the new material to produce systems with higher power-density and energy efficiency. While some industries have adopted new materials quicker than others, recent research from Yole Développement, a semiconductor and advanced packaging company based in France, indicated that there has been a significant growth in the SiC market in recent years. The research placed the market at $200 million as of 2015 and said that the market would reach an inflection point in 2017. [4]

New Electronics wrote that silicon carbide technology had reached a “tipping point” where engineers would focus more attention on new materials than on silicon, “pushed by the space, weight and efficiency requirements of electric vehicles and hybrids and by some particular industrial applications.” [5] All About Circuits added, based on the Yole research, that SiC was the material of choice for “power factor correction (PFC) power supplies, chargers, photovoltaic inverters, and trains.” [6]

As evidence of the industry’s acceptance of wide-bandgap materials, JEDEC Solid State Technology Association, a leader in standards development for the microelectronics industry, announced in September that it formed a committee on Wide Bandgap Power Electronic Conversion Semiconductors with sub-committees for SiC and GaN. “GaN and SiC technologies are poised to benefit from the development of standards focused on quality and reliability, datasheets, and test methods,” said Tim McDonald, Senior Director, GaN Applications and Marketing at Infineon Technologies. [7]

Industry leaders such as Texas Instruments (TI), Infineon, and Wolfspeed have signed on to the JEDEC committee and have already established products based on SiC technology. For instance, Infineon has released CoolSiC™ semiconductor solutions that include MOSFET, Schittky diodes, and hybrid modules. [8] ROHM Semiconductor recently announced that it had produced full SiC power modules that it claims reduces switching losses by 64 percent at 150°C. The company also announced that it is supplying power modules for the Venturi Formula E racing team. [9]

At the recent APEC 2018 show in San Antonio, sponsored by the PSMA (Power Sources Manufacturers Association), TI unveiled a new reference design (pictured below) for an HEV/EV onboard charger that used SiC-isolated gate drivers. [10]

ATS cold plates were on display at the TI booth, as a thermal solution for a new TI design. (Advanced Thermal Solutions, Inc.)

Thermal Management Concerns for SiC

SiC (and GaN) is clearly not just the future of semiconductor technology, it is also the present, but while wide-bandgap material allows components to perform at higher temperatures, there are thermal management concerns that engineers need to consider when designing the devices into a system. While SiC and other wide-bandgap materials may be able to withstand high temperatures, there are potential performance issues, such as higher rates of switching losses, and researchers still recommend that SiC dies operate at temperatures lower than 100°C for best efficiency. [11]

Higher temperature limits mean that, in theory, less complex cooling systems are required, which also means that SiC component packaging can be smaller since it no longer needs to account for larger, more intricate thermal management designs. It also means potential cost- and energy-savings for designers. But, the higher heat loads and the desire for smaller packaging mean passive, air cooling techniques are unlikely to accommodate the thermal management needs of the system. Liquid cooling is usually required, particularly the use of liquid cold plates to increase the rate of heat transfer to the ambient.

A recent presentation by SatCon Applied Technology showed that, despite higher power outputs, SiC components required smaller thermal contact areas and suggests the use of cold plates (copper in this particular example) to achieve the necessary cooling. [12] This was backed up by research from the European Research Council, which reported that active thermal management systems improved the performance of power electronics systems. [13]

Research from Cal Tech and the Jet Propulsion Laboratory (Pasadena, Calif.) explored the use of novel thermoelectric (TEC) microcoolers at the device level that provided spot cooling at higher heat fluxes than standard passive heat sinks. [14] According to researchers, the use of diamond or aluminum substrates enhanced the thermal performance of the microcoolers and thick-film coolers were able to achieve power densities greater than 100 W/cm2.

As noted in a research report by the National Renewable Energy Lab, while wide-bandgap materials can withstand much higher junction temperatures, those high heat loads can have a detrimental effect on other components in a system. Increasing the temperature of the system as a whole can lead to more failures, switching losses, and other issues for components that are not built to withstand high-temperature operation. Therefore, cooling needs to take not only a device-level but also system-level outlook. [15]

The NREL research suggested the following tactics for cooling SiC: using thermal interface material (TIM) that has low thermal resistance and is “reliable at functional temperatures,” using microchannels in cold plates to lower device junction temperatures, enhancing the surface and including “turbulence promoters” in the module, and incorporating both advanced manufacturing techniques and “multiple mode cooling” at the system level.

This slide from the presentation by the NREL explains how thermal management of wide-bandgap materials encompassed device-level, module-level, and system-level solutions. (NREL)

SiC has found a niche in the automotive world where the material is frequently mentioned in reports of new designs for electric vehicle batteries, as well as brake components and other components in high-heat environments. Some recent studies have gone beyond standard liquid cooling to include jet impingement cooling, which demonstrated significant thermal enhancement. According to a 2015 study, simulations demonstrated that a commercial, off-the-shelf (COTS) cold plate reduced the junction temperature of an SiC power module operating at a design heat load of 151 W from 290°C to 215°C. A COTS microchannel heat exchanger reduced the junction temperature to 215°C and a jet impingement-cooled heat exchanger lowered the junction temperature to 169°C at the same flow rate. [16]

The European Commission’s Community Research and Development Information Service (CORDIS) recently closed its SMARTPOWER project that brought together 15 partners from seven countries to examine the use of SiC and GaN technologies in industrial power devices. [17] The research led to the creation of forced cooling solutions with TEC modules to enhance heat sink thermal performance by as much as 200%, dropping device junction temperature from 250°C to 125°C. The research also developed enhanced TIM composed of vertically-aligned carbon nanotubes that increased heat transfer away from the devices, as part of novel 3-D packaging solutions.

Advanced Thermal Solutions, Inc. (ATS) continues to work on thermal solutions to meet the latest developments in power electronics. ATS recently released a new line of high-performance liquid cold plates that provide 30% improved performance compared to other commercially-available cold plates. An innovative, internal fin array with an optimized aspect ratio makes ATS cold plates, available in aluminum or copper and easily customizable to meet specific size or thermal requirements, the perfect choice for cooling high-powered electronics, including wide-bandgap devices.

ATS cold plates are the perfect solution for cooling high-powered electronics, such as IGBT modules. (Advanced Thermal Solutions, Inc.)

ATS cold plates provide uniform surface temperature across an IGBT or other high-powered device and can be fitted to a variety of components including Semikron SemiTRANS® Case D56, Infineon 62 mm, Fuji Semiconductor M127, M234, and M235, Powerex 62 mm, Mitsubishi 62 mm, and Vincotech 62 mm packages among many others.

As wide-bandgap materials proliferate across the power industry, ATS has liquid cooling solutions that will ensure optimal thermal management. For example, the TI reference design mentioned above used a customized ATS cold plate to provide the necessary cooling.

Learn more about ATS liquid cold plates and its array of liquid cooling solutions at https://www.qats.com/Products/Liquid-Cooling/Cold-Plates.

References
1. https://repository.kulib.kyoto-u.ac.jp/dspace/bitstream/2433/50531/1/04267750.pdf
2. http://jss.ecsdl.org/content/2/8/N3055.short
3. http://www.electronicdesign.com/analog/making-jump-wide-bandgap-power
4. https://www.i-micronews.com/compound-semi-expertise/8113-yole-analysis-the-sic-power-electronics-market-will-reach-an-inflection-point-in-2017-but-growth-brings-supply-chain-worries.html
5. http://www.newelectronics.co.uk/electronics-technology/silicon-carbide-technology-reaches-tipping-point/151641/
6. https://www.allaboutcircuits.com/news/sic-chips-kickstart-a-new-era-in-power-electronics/
7. https://www.jedec.org/news/pressreleases/new-jedec-committee-set-standards-wide-bandgap-power-semiconductors
8. https://www.infineon.com/cms/en/product/power/silicon-carbide-sic/
9. http://www.rohm.com/web/global/groups/-/group/groupname/SiC%20
Power%20Devices

10. https://www.qats.com/cms/2018/04/19/ats-power-solutions-on-display-at-apec-2018/
11. https://hal.archives-ouvertes.fr/hal-01473614/file/REYNES_Thermal%20Management%20Optimization.pdf
12. http://www.sandia.gov/ess/docs/pr_conferences/2005/Casey.pdf
13. https://www.sciencedirect.com/science/article/pii/S0026271414002650
14. https://pdfs.semanticscholar.org/ef32/8d5d3e0f617ada86cc02d
96398be97d48775.pdf

15. https://www.nrel.gov/docs/fy15osti/63002.pdf
16. https://www.researchgate.net/publication/273394047_Liquid_Jet_Impingement
_Cooling_of_a_Silicon_Carbide_Power_Conversion_Module_
for_Vehicle_Applications

17. https://cordis.europa.eu/project/rcn/99996_en.html

For more information about Advanced Thermal Solutions, Inc. (ATS) thermal management consulting and design services, visit https://www.qats.com/consulting or contact ATS at 781.769.2800 or [email protected].

ATS Releases New Liquid Cooling eBook

Advanced Thermal Solutions, Inc. (ATS) has created an new Engineering eBook on Liquid Cooling and its applications in the thermal management of electronics. Click here to download this free, 16-page eBook loaded with technical content.

What is the Thermal Impact of Imperfections in Phase-Change Material

Advanced Thermal Solutions, Inc. (ATS) engineers have received several questions from customers about the phase-change material that comes standard on the base of all ATS heat sinks. Engineers have asked whether imperfections on the surface of the grey foil that protects the phase-change material, such as dents or wrinkles, have a significant impact on the thermal interface material’s thermal performance. Do these imperfections have any impact at all? Should the liner be removed?

ATS uses Parker Chomerics Thermflow™ T766 thermal interface material (TIM), which comes with a thin, protective layer of metal foil that should not be removed when placing the heat sink on the device it is intended to cool.

Phase-Change Materials

ATS heat sinks come with Chomerics T766 phase-change material standard. (Advanced Thermal Solutions, Inc.)

When pressure is applied, the phase-change material (and the metal foil) conform to both surfaces, completely removing air gaps or voids to maximize heat sink performance. The phase-change material will “attain minimum bond-line thickness” and “maximum surface wetting,” according to information from Chomerics, to limit the thermal resistance path and ensure almost no thermal contact resistance between the device being cooled and the heat sink. For the T766, the phase-change temperature is listed as 55°C. The liner should remain in place when placing heat sink on the device it is intended to cool (see the video below).[1]

Should engineers be concerned about the appearance of the metal foil lining? Do the dents or wrinkles in the lining impact the performance of the phase-change material and potentially impact the efficiency of the heat sink?

To reassure engineers that the appearance of the metal foil would have a negligible impact on the thermal performance of the TIM, the Chomerics Research and Development Department released the results of tests that the company performed on the T766 conformable metal foil. [2] Chomerics studied the impact on thermal impedance when the foil was wrinkled, dented, and even folded.

Researchers tested materials that were not wrinkled, lightly wrinkled, moderately wrinkled, and severely wrinkled under different pressures (20 psi, 50 psi, and 100 psi). The results (shown below) demonstrated that even when wrinkled “to a far greater extent than would be expected in actual handling” thermal impedance never increased more than 0.02°C-in22/W. The report explained, “For 50 W of power, through one square inch of material, that’s only 1.0°C change!”

The dent test was created using a wooden tongue depressor and included a sample with five dents per square inch and a second with 15 per square inch. As was demonstrated in the wrinkle study, the dents smoothed out during the testing process and showed a minimal impact on thermal impedance. “Once again, the thermal impedance did not increase by more than 0.01°C-in2/W. For 50 W of power, through one square inch of material, that’s only 0.5°C change! The metal foil carrier is so conformable that the dents were almost unidentifiable after testing with 100 psi of pressure.”

The final test was performed on T766 that was folded. One sample was folded under on one edge and the second was folded to overlap down the center. The results indicated that small folds of up to 5% of the pad’s area does not significantly impact thermal impedance. A large fold, which tripled the thickness of the foil in the center of the sample, had a significant impact on the thermal impedance of the material.

The report concluded, “T766 will perform extremely well even when the pad is wrinkled or folded, or the foil is scratched or dented. The high conformability of the metal foil carrier will allow it to smooth out and erase almost any imperfection.”

References
1. https://www.parker.com/literature/Chomerics/Parker%20Chomerics%20
THERMFLOW%20Datasheet.pdf

2. http://www.parker.com/parkerimages/Parker.com/Divisions-2011/Chomerics%20Division/SupportAssets/Parker%20Chomerics%20THERMFLOW
%20T766%20Metal%20Foil%20Thermal%20Impedance%20Test%20Report_EN.pdf

For more information about Advanced Thermal Solutions, Inc. (ATS) thermal management consulting and design services, visit https://www.qats.com/consulting or contact ATS at 781.769.2800 or [email protected].