Author Archives: Josh Perry

CFD With Analytical Modeling Gives ATS Edge

In January, Advanced Thermal Solutions, Inc. (ATS) and engineering simulation software leader Future Facilities announced that ATS had purchased multiple seats of 6SigmaET, an electronics thermal simulation software, adding to its CFD (computational fluid dynamics) capabilities.

CFD

ATS engineers are now using 6SigmaET to perform CFD on electronics cooling applications to find optimized thermal solutions for customers. (Advanced Thermal Solutions, Inc.)

In a joint press release from the two companies, ATS founder and CEO Dr. Kaveh Azar said, “We have decades of experience with a broad base of commercially available CFD tools. For the electronics thermal management analyses, 6SigmaET showed excellent agreement with our empirical and analytical modelling.

He added, “We were equally impressed with its ease of use and a short learning curve. Our engineering team was able to apply the tool to different levels of simulation extending from component to system level modelling. The speed of convergence and ease of use of 6SigmaET, have made it the first CFD software to use.”

6SigmaET becomes the lead thermal simulation software for ATS engineers dealing with standard electronics cooling challenges. ATS engineers will be able to quickly and efficiently simulate junction and ambient temperatures across boards and components or define airflow to find fan operating points or get a better understanding of pressure drop in a system.

Dr. Azar continued, “We always want to be working with the best breed of tools to deliver the innovative, high-quality and cost-effective thermal management and packaging solutions our customers expect. As a result, this addition is good news for our customers. The rich features of the 6SigmaET thermal simulation package not only enable us to do more when it comes to simulation, but also allows us to further deliver the solution to our clients in a shorter time interval. It is my highest compliment to 6SigmaET development team for putting together such a robust and effective software.”

Adding 6SigmaET to ATS CFD capabilities, which also includes FloTHERM from Mentor and Autodesk CFD (formerly CFdesign), enables engineers to save customers time in the design phase and makes it easier for ATS engineers to devise optimal thermal solutions.

ATS engineer Anatoly Pikovsky said, “Visual is definitely a great thing to have. If you look at this temperature map, for instance, you can look at the defined map and say right away, okay I have a very high temperature right in the middle.”

Pikovsky, who was working on Autodesk CFD to design a customized cold plate for a customer, demonstrated how the software allows for him to analyze the pattern of fluid flow through complex geometries that were imported from SolidWorks drawings. He used the software to show hot spots and fluid velocity and how small changes, such as the number of fins within the cold plate, could alter the results.

Field Application Engineer Vineet Barot explained that he used 6SigmaET on a board in which there was pressure drop coming from vents at the end of the board. In simulations, he was able to add fins to the heat sink without altering the fan operating point and quickly provide a thermal solution that was presented to a customer. He said, “If you had a standard 1-U chassis you can build it from scratch and run it in half an hour.”

While CFD continues to evolve to handle more complex problems, while also becoming easier to use for engineers, simulations are only part of the solution.

ATS engineers also perform analytical modeling, literally putting pen to paper with basic thermodynamic equations, to define the problem and provide a reference point for simulations. Coupling analytical and computer modeling is what sets ATS apart from its competitors because it ensures that thermal solutions provided by CFD are correct.

“CFD will give you a solution, whether it’s right or wrong, it will give you a solution,” Pikovsky said. “That’s the way it’s designed. Analytical coupled with CFD gives you a good reference point to know whether you’re in the ballpark.”

Analytical modeling also speeds up the process of finding an optimized solution. Rather than spending days or weeks plugging in different fin numbers and heights or trying numerous heat sink geometries, ATS engineers can define a small range of iterations, limiting the variables for CFD, to avoid countless simulations, each of which could take hours to run.

Pikovsky said, “Maybe you’ve designed a heat sink for certain airflow and you want to determine the number of fins. You can do it with CFD, but you start varying fins and it’s going to take you days. Analytical is great because you can determine the optimal number of fins and start CFD with that.”

CFD is a critical component of ATS thermal consulting and design services. 6SigmaET has quickly been adopted by ATS engineers as the lead software and been used in the design of thermal solutions for a number of customers in the past few months.

But, it is the combination of CFD with ATS engineers’ emphasis on analytical modeling that has made ATS a leader in the thermal management of electronics.

For more information about Advanced Thermal Solutions, Inc. (ATS) thermal management consulting and design services, visit https://www.qats.com/consulting or contact ATS at 781.769.2800 or [email protected].

ATS Power Solutions on Display at APEC 2018

Advanced Thermal Solutions, Inc. (ATS) recently attended APEC 2018 in San Antonio to showcase the company’s thermal solutions for power electronics, meet with industry representatives, and learn the latest trends in the power industry.

ATS has been a member of the PSMA (Power Sources Manufacturers Association), which is the sponsoring organization for APEC, for the past three years because ATS has a strong connection to the power industry and extensive expertise in keeping the industry cool.

ATS Power Solutions

Product Engineering Manager is interviewed about ATS cold plates by Alix Paultre, the Power Editor at Aspencore, in the ATS booth at APEC 2018 in San Antonio. (Advanced Thermal Solutions, Inc.)

Vice-President of Sales and Business Development Steve Nolan and Product Engineering Manager Greg Wong manned the ATS booth during the show and took visits from sales representatives, distributors, and engineers from across the industry, some were familiar faces and some were learning about ATS expertise in thermal management of power electronics for the first time.

The highlighted products were ATS liquid cold plates, which boast 30% better thermal performance than comparable products on the market and are easily customizable to meet a variety of applications, and the line of ATS high-performance round and flat heat pipes, which is expanding by the end of 2018 to give ATS the broadest offering of off-the-shelf heat pipes on the market.

“When people start having thermal issues, it’s because they’re dissipating a lot of power and then you start to need things like heat pipes and liquid cold plates,” said Wong. “In most of these applications, people are talking about custom designs, which is where we have a lot of strength working with the customer and designing these custom applications.”

ATS cold plates were also featured in the Texas Instruments (TI) booth as part of a “98.5% efficiency, 6.6-kW Totem-Pole PFC Reference Design for HEV/EV Onboard Charger.” The base of the design was silicon carbide (SiC) MOSFETs with a C2000 microcontroller with SiC-isolated gate drivers, according to information presented by TI.

Underneath the prototype that was on display at the TI booth was a custom ATS cold plate to meet the charger’s thermal requirements.

ATS cold plates were on display at the TI booth, as a thermal solution for a new TI design. (Advanced Thermal Solutions, Inc.)

“It’s a great example of how we can customize our cold plates to meet a particular application,” Wong added. “A lot of people were taking pictures of that piece at the TI booth and a lot of people were talking with TI about it. The booth was mobbed every time I went over there.” 

ATS participation in the TI booth at APEC 2018 is a continuation of the strong working relationship between the two companies. ATS has also been a key reference design supplier of heat sink solutions for TI’s audio evaluation module.

Wong and Nolan also learned a lot about the future of power electronics, including the prevalence of SiC and gallium nitride (GaN) components in the industry and the increasing popularity of liquid cooling, to keep ATS current on industry trends and ensure that the innovative thermal solutions that ATS provides can meet ever-rising power demands.

While there is a lot that is new in the industry, IGBT designs continue to be popular and the standard IGBT footprint matches perfectly with ATS off-the-shelf cold plates to make an easy fit for engineers designing liquid cooling solutions.

“If people are still making devices in that IGBT footprint then it will bolt directly to the cold plate, which is good news because that package is very popular, so it’s good to have those standard products,” Wong explained.

Watch the video below as Greg Wong of ATS was interviewed by Alix Paultre of Power Electronics News at APEC 2018 about ATS heat pipes and cold plates.

ATS has the expertise, products, and resources to provide off-the-shelf and customized thermal solutions for the power electronics industry. Learn more about the full line of products at https://www.qats.com or contact ATS at [email protected].

Thermal Solutions Designed for 400G Ethernet

As noted in a recent article from Electronic Design, the IEEE 802.3bs Ethernet Working Group published its standards for 400 Gigabit Ethernet in December and at the DesignCon conference in Santa Clara, Calif. at the end of January many of the connector companies, including industry leaders such as Molex and TE Connectivity, were already rushing to create hardware to meet the new standards.

400G Ethernet

“The 8-lane, Quad Small Form-factor Pluggable Double Density (QSFP-DD) form factor is one of four connectors that will target 400G Ethernet connections,” Technology Editor William Wong explained. “The others include OSFP, CFP8, and COBO. These new form factors are needed to handle the 25-Gb/s NRZ, 56-Gb/s PAM-4, or potentially 112-Gb/s PAM-4 signaling needed for 400G and beyond.”

Hardware specifications were also defined by the Quad Small Form-Factor Pluggable Double Density (QSFP-DD) Multi-Source Agreement (MSA) group in Sept. 2017. In addition to Molex and TE Connectivity, the 62 companies that were part of the QSFP-DD MSA included Broadcom, Cisco, Finisar, Juniper Networks, and more leaders in the communications and broadcast industries.

The report said, “QSFP-DD supports up to 400 Gb/s in aggregate over an 8 x 50 Gb/s electrical interface. The cage and connector designs provide backwards compatibility to QSFP28 modules which can be inserted into a QSFP-DD port and connected to 4 of the 8 electrical channels.” From a thermal standpoint, the group defined the operating case temperatures as 0-70°C for standard class, -5°C to 85°C for extended class and -40°C to 85°C for industrial class.

“For all power classes,” the report continued, “all module case and handle surfaces outside of the cage must comply with applicable Touch Temperature requirements.”

At DesignCon, Wong wrote, one of the biggest challenges that companies faced was how to optimize thermal management for these optical systems. This is nothing new for designers of optical transceivers, as increased density means increased heat, which can lead to performance and reliability issues.

As a recent article from Advanced Thermal Solutions, Inc. (ATS) exploring industry developments in cooling QSFP transceivers explained, “The performance and longevity of the transceiver lasers depend on the ambient temperature they operate in and the thermal characteristics of the packaging of these devices. The typical thermal management approach combines heat dissipating fins, e.g. heat sinks, and directed airflow.”

It added, “Designers can reduce thermal spreading losses by keeping the heat sources close to the thermal interface area and by increasing the thermal conductivity of the case materials.”

ATS engineers have been working with QSFP manufacturers to meet thermal needs. In a recent project, ATS engineers designed a new solution for cooling optical transceivers using a series of heat sinks in an optimized layout that took into consideration individual QSFP junction temperatures as well as the effect of airflow pushing heat onto downstream transceivers.

400G Ethernet

Test set-up of different heat sink designs on QSFP28 connector cages. Through testing, analytical modeling and computer simulations, ATS engineers optimized a design for cooling a series of QSFP. (Advanced Thermal Solutions, Inc.)

Analytical modeling and computer simulations “showed that having heat sinks with fewer fins upstream and heat sinks with more fins downstream provided a near isothermal relationship between the first and last QSFP, an important consideration for QSFP arrangements.” Overall, the innovative design showed a 30 percent improvement over QSFP heat sinks currently on the market. Using this design, there was less than a degree difference between the first QSFP in the series and the last.

“Minimizing the upstream QSFP heat sinks, which in turn minimizes the amount of preheat to the downstream QSFP and allows as much airflow to enter downstream QSFP,” the engineers remarked. “At the same time ensuring the upstream QSFP temperatures are equal to or just lower than the downstream QSFP. This keeps the downstream QSFP temperatures at a minimum, while also keeping the transceiver stack close to isothermal.”

In addition to junction temperature, ATS engineers factored in contact resistance, since QSFP transceivers require that no thermal interface material (TIM) is used. As the engineers explained, “The QSFP isn’t fixed in the cage; it can be hot swapped. After a few insertions and removals, it will gunk up the TIM.” Also, to increase the surface area, the heat sinks were extended beyond the edge of the cage and the base had to be thicker than originally planned to account for spreading resistance.

As 400G Ethernet technology continues to expand, more power is required, and transceiver-density is increasing, ATS is ready with thermal solutions to meet next-generation challenges for the QSFP market.

For more information about Advanced Thermal Solutions, Inc. (ATS) thermal management consulting and design services, visit https://www.qats.com/consulting or contact ATS at 781.769.2800 or [email protected].

Thermal Questions? ATS Has Your Answers

If you have any questions about Advanced Thermal Solutions, Inc. (ATS) liquid or air cooling products, next-generation thermal instruments, or expert thermal consulting and design services, contact ATS today by email at [email protected].

Electronics Cooling with Thermoelectric Assemblies

By Norman Quesnel
Senior Member of Marketing Staff
Advanced Thermal Solutions, Inc. (ATS)

Thermoelectric assemblies (TEA) efficiently control temperature in many applications across a variety of industries. For example, TEA are used for cooling laser diode packages in optics, lasers in medical and industrial instrumentation, and bio-sample storage units for medical diagnostics. They are also used to cool analytical instruments and batteries in automotive and telecom applications.

Thermoelectric Assemblies

Fig. 1. This Air-to-Air TEA has a max cooling power of 83 Watts and a temperature range of -10°C to 70°C. (Advanced Thermal Solutions, Inc.) [1]

Depending on the model, TEA provide cooling capacity from approximately 10-400 Watts and can cool by removing heat from control sources through convection, conduction, or liquid means. [2]

Thermoelectric assemblies work according to the Peltier effect, which was initially discovered by scientists in 1834. The Peltier effect describes the temperature differential that is created across two electrical junctions when an electrical current is applied. As the current flows, heat is removed from one junction and deposited on the other. This means that TEA could be used for cooling or heating depending on the particular needs of the application. [3]

TEA offer several advantages over other cooling technologies. TEA are capable of cooling to well below ambient, while protecting electronics inside enclosures from outside contaminants and moisture because they do not require an air exchange with the outside environment, unlike, for instance, conventional fan trays. TEA also offer precise temperature control; many can provide a temperature accuracy of within 0.01˚C under steady-state conditions.

Compared to conventional compressor-based cooling systems, TEA are compact in size and lighter in weight. Their solid-state operation allows mounting in any orientation, without noise or vibration. They do not use refrigerants or CFCs, are Restriction of Hazardous Substances (RoHS) compliant, and their simple design does not require field servicing. [4]

The basic configurations of TEA are:

Air-to-Air Thermoelectric Assemblies

Air-to-air TEA are compact devices that will cool a local environment through convection. Heat is absorbed and pumped from one side of the thermoelectric assembly (i.e. cold side) by thermoelectric modules and dissipated from the other side of the assembly (i.e. hot side) to the environment by heat sinks and highly-efficient DC fans. Air-to-air TEA are often used when it is better to circulate cooled air rather than use direct contact with a cold plate.

Typical applications include regulating temperature in small electronic cabinets or enclosures. They provide quiet and precisely-controllable cooling for smaller capacities typically from 20 up to around 200 W.

Fig. 2. Air-to-Air TEA can provide up to 200 W of cooling. (Kryotherm) [5]

Many air-to-air TEA are designed with a modular approach so, if needed, multiple coolers can be employed to achieve the cooling requirement. Several OEM can also develop customized air-to-air TEA designed for a system’s specific boundary conditions. [6]

Air-to-Plate Thermoelectric Assemblies

Air-to-plate thermoelectric assemblies are heat exchangers for removing heat from a plate attached to its cold side. Also called direct-to-air devices, the objects to be cooled down are mounted on a metallic plate on the cold side of the assembly. Heat is pumped through TEC modules and dissipated to the environment through heat sinks and DC fans on the hot side of the assembly.

Fig. 3. The plate on Air-to-Plate TEA is a mounting surface for components, boards or test specimens. (Adcol Electronics) [7]

Typical applications for air-to-plate TEA include cooling laser diode modules and temperature controlling bioreagents. Laser diodes need precise temperature stabilization at room temperature and higher heat loads. Bioreagents and process fluids often need to be temperature controlled at different stages over a wide temperature range.

Air-to-Liquid Thermoelectric Assemblies

Air-to-liquid thermoelectric assemblies offer dependable, compact performance. Heat is absorbed through a liquid heat exchanger, pumped through a series of thermoelectric modules and dissipated to the air through high-density heat sinks with integral fans. The heat exchanger is designed to be part of a liquid recirculating system and requires a pump.

Fig. 4. A Liquid-to-Air TEA where the heat is absorbed by a heat exchanger and is pumped by thermoelectric modules to cooling heat sinks and fans. (Advanced Thermal Solutions, Inc.) [8]

The liquid circuit typically uses a recirculator to remove the heat into the ambient air. An air-to-liquid TEA system allows for precise temperature control of the fluid and has been the solution for many devices including those used for cooling lasers and medical applications such as blood preservation, patient rehabilitation pads and blankets. To improve heat transfer, turbulators can be inserted into the liquid channels of the heat exchanger.

Common TEA Applications

Some of the most common areas where TEA provide cooling are in laser systems, biomedical devices, telecommunications, automotive, battery cooling, and the food and beverage industry.

In medical applications, thermoelectric assemblies provide immunoassay reagent cooling (to detect or measure specific substances in the reagents), temperature control for in vitro diagnostic specimens, and cooling of genome sequencing reagents. Some air-to-air TEA help maintain specimen receptacles and reagents at very specific temperatures to ensure diagnostic test reliability and accuracy. TEA keep temperatures cool in bio-units for storing and transporting insulin, tissue and human organs.

Some liquid-to-air TEA are also used for cooling tissues and other body areas during laser or microwave thermo therapy. [9]

In telecommunications applications, a common use of TEA is to help cool small form-factor (SFP) transceivers. These optical transceivers transmit data over long distances in outdoor applications. An SFP unit contains a temperature sensitive laser diode that can transmit data a kilometer away, but only if the diode is kept below 70°C. Many other kinds of lasers also feature TEA for cooling. TEA help prevent wavelength drift in laser transmission (DWDM), pumped laser (EDFA), avalanche photodiode (APD) and CATV laser systems. [10]

Figure 5. Thermoelectric cooling and heating is used in this automobile cup holder. [11]

In the automotive industry, TEA and thermoelectric modules are used in the individual cooling and heating of car seats. The seats in the front and rear cabin can be heated or cooled per the passengers’ preferences. An emerging application in the automotive industry is the temperature-controlled cup holder. Based on a switch setting, thermoelectric devices will preserve the warmth or chill of a beverage by temperature regulation of the cup holder. [12]

New hybrid and electric vehicles rely on costly battery-operated systems that often require maintenance or repair when exposed to temperatures outside a narrow, stringent operating range. Recently developed devices utilize thermoelectric modules to stabilize the temperature of a vehicle battery to achieve maximum performance in all environments. This increases battery efficiency and extends battery life.

Perhaps the most well-known applications for TEA are small refrigerators, beer chillers and wine cellars. TEA adjust the temperature inside beverage dispensing and vending machines, helping ensure freshness and the desired taste. Other applications are in the food catering industry, keeping food temperatures under control in mobile and open-air conditions. These include service and transport carts, serving trays, temperature-controlled preparation surfaces and cold plates. [13]

A report released by Transparency Market Research in 2015 said that the market for thermoelectric modules, which are components of TEA, would grow to as much as $763.5 million by 2022 driven by growth in the Asia Pacific market and manufacturers focusing on quick and cost-effective modules to meet specific customer needs. It also indicated that while bulk thermoelectric modules had 71 percent of the market share in 2014, the expectation was for micro modules to grow at a faster rate during the analysis period. [14]

The report called telecommunications, medical, aerospace, and industrial applications the key market segment for bulk modules, but micro modules would target growing consumer electronics, medical and laboratories, automotive, detectors and sensors, and energy harvesting industries.

A 2012 IDTechex report added that the market for thermoelectric generators could be as high as $750 million by 2022 with wireless sensors and wireless networks, waste heat recovery systems in vehicles, consumer applications from mobile phones to cooking sensors to sensory apparel, and military and aerospace leading this growth. [15]

For more information about thermoelectric assemblies or modules from ATS, visit https://www.qats.com/Products/TEC.

References
1. https://www.qats.com/Products/TEC/TEC-Assembly/ATS-WFF-150W-12-C
2. https://www.electronics-cooling.com/2016/10/thermoelectric-assembly-cooling-for-temperature-control-in-co2-incubators/#
3. https://www.marlow.com/how-do-thermoelectric-coolers-tecs-work
4. https://www.lairdtech.com/sites/default/files/public/solutions/Laird-ETS-Thermoelectric-Assemblies-Handbook.pdf
5. http://kryothermtec.com/catalog-of-thermoelectric-cooling-assemblies-of-air-to-air-type.html
6. http://www.amstechnologies.com/products/thermal-management/thermoelectric-technologies/thermoelectric-assemblies/air-to-air-thermoelectric-assemblies/
7. http://www.peltier-thermoelectriccooler.com/sale-9776416-thermoelectric-cooling-plate-peltier-cooling-assembly-direct-voltage.html
8. https://www.qats.com/Products/TEC/TEC-Assembly/ATS-FW-72W-12-C
9. Thermoelectric Solutions, http://www.supercool.se/, Sweden
10. https://www.lairdtech.com/sites/default/files/public/solutions/Laird-ETS-Active-Cooling-of-Optical-Transceivers-Application-Note.pdf
11. http://www.amstechnologies.com/solutions/solution-single-news/article/energy-balance-of-automotive-thermoelectric-cup-holder/
12. https://www.marlow.com/industries/automotive
13. https://www.lairdtech.com/solutions/thermal-management/consumer/beverage-thermal-management-solutions
14. https://globenewswire.com/news-release/2015/07/28/755640/10143440/en/Thermoelectric-Modules-Market-Expected-to-Reach-US-763-5-Mn-by-2022-Globally-Transparency-Market-Research.html
15. https://www.idtechex.com/research/articles/thermoelectric-generators-a-750-million-market-by-2022-00004631.asp

For more information about Advanced Thermal Solutions, Inc. (ATS) thermal management consulting and design services, visit https://www.qats.com/Consulting/Custom-Cooling-Solutions or contact ATS at 781.769.2800 or [email protected].