Author Archives: Josh Perry

ATS Unveils Heat Exchanger Selection Tool

In 2017, Advanced Thermal Solutions, Inc. (ATS) added to its liquid cooling products with a new line of tube-to-fin, liquid-to-air heat exchangers with the industry’s highest density fins, which maximize heat transfer and provide greater cooling than other heat exchangers on the market.

Heat Exchanger Selection Tool

ATS released a line of tube-to-fin, liquid-to-air heat exchangers with the industry’s highest density fins to optimize heat transfer. (Advanced Thermal Solutions, Inc.)

ATS heat exchangers are available in seven different sizes and can be ordered with or without fans depending on your specific design requirements. Altogether, ATS offers 49 different heat exchanger options (not including the customized options to meet customer needs).

To make the selection process easier for engineers, ATS has recently unveiled a new Heat Exchanger Selection Tool that will point engineers to the exact option that will meet the inputted criteria.

Heat Exchanger Selection Tool

The tool asks five questions (measurement type in parentheses):

  • Air temperature from inlet to heat exchanger (Tai°C)
  • Heat need to be extracted by heat exchanger (QtotalW)
  • Water exit temperature from heat exchanger (Tfo°C)
  • Water flow rate (GPM)
  • Fan voltage (V)

Plug answers in to these questions and hit the “Optimum Heat Exchanger” button to see which of the ATS heat exchangers fits your specific liquid cooling system needs. Once you have the right part number, you can now purchase the right heat exchanger from Digi-Key Electronics.

In addition to heat exchangers, ATS has an array of liquid cooling products, including cold plates that provide 30 percent better thermal performance than comparable products on the market.

To learn more about the full line of liquid cooling options from ATS, visit https://www.qats.com/Products/Liquid-Cooling.

For more information about Advanced Thermal Solutions, Inc. (ATS) thermal management consulting and design services, visit https://www.qats.com/consulting or contact ATS at 781.769.2800 or [email protected].

ATS Showcasing Thermal Solutions for Power Electronics at APEC 2018

Advanced Thermal Solutions, Inc. (ATS), a leading-edge thermal engineering and manufacturing company focused on the thermal management of electronics, is pleased to announce that it will be showcasing its new line of liquid cold plates and other thermal solutions for power electronics in Booth No. 1738 at APEC 2018, the world’s premier event for applied power electronics, being held in the Henry B. Gonzalez Convention Center in San Antonio, Texas from March 4-8.

APEC 2018

ATS will have a video demonstration and samples of its newly-released liquid cold plates, which boast an innovative, internal fin array with an optimized aspect ratio that provides 30 percent better performance than other commercially-available cold plates currently on the market.

ATS cold plates are the perfect thermal solution for power electronics, such as IGBT, wide-bandgap, and more.

“Even as power supplies and power ICs increase in efficiency, challenging thermal issues remain,” said Steve Nolan, ATS Vice-President of Sales and Business Development. “There is a demand for more power across the industry and ATS is committed to supporting the electronics industry with the right solutions in the varied component and end-markets on the market today, whether its cooling for IBGT, emerging wide-bandgap, power bricks, CPUs, BGAs or more.”

He added, “APEC provides us the opportunity to share our solutions with these manufacturers, as well as discuss how we can help with any of their future needs.”

ATS cold plates are the perfect solution for cooling high-powered electronics, such as IGBT modules. (Advanced Thermal Solutions, Inc.)

Cold plates are part of an array of liquid cooling solutions that ATS has to offer, including heat exchangers with the industry’s highest density fins to optimize heat transfer and a line of chillers for precise control of coolant temperature.

In addition to its liquid cooling solutions for power electronics, ATS will also showcase its popular Power Brick heat sinks, which are based on the patented maxiFLOW™ design and specially designed for cooling 1/8, 1/4, 1/2, and full-brick DC/DC power converters. ATS has added a straight-fin option to its line of power brick heat sinks to give power engineers an option with a smaller footprint for crowded boards.

ATS has straight-fin heat sinks as part of its Power Brick line to give additional cooling options for power engineers. (Advanced Thermal Solutions, Inc.)

ATS will also display samples of its vast array of high-performance flat and round heat pipes that are perfect for spreading heat away from high-powered components, particularly in boards that have high component-density and little space for other cooling methods.

Visit ATS at Booth No. 1738 at APEC 2018 and join Steve Nolan and Product Engineering Manager Greg Wong to learn more about the numerous thermal solutions that ATS has designed for the power electronics industry.

Find more information about ATS liquid cold plates, Power Brick heat sinks, or ATS consulting and design services, at https://www.qats.com/ or contact [email protected].

ATS Provides LED Thermal Solution for Big Game

When the big game kicks off on Sunday night, the Patriots will not be the only team from New England shining bright at U.S. Bank Stadium in Minneapolis, Minn. Advanced Thermal Solutions, Inc. (ATS) will also be represented, although not on the gridiron, but rather helping to shine a spotlight on the action on the field.

LED Thermal Solution

Ephesus LED lighting solutions, with ATS thermal management design, will be used in the upcoming Super Bowl at U.S. Bank Stadium in Minneapolis.

In 2015, Ephesus Lighting (Syracuse, N.Y.) was chosen to provide LED lighting solutions for the Minnesota Vikings’ new stadium. The Ephesus system allows for greater control and adjustment, whether responding to the amount of sunlight in the stadium or the light’s color temperature (Ephesus recommends a medium color temperature for football), and does not require a 15-minute window for reaching full brightness like typical stadium lighting. It will also provide energy savings of as much as 75 percent.

“We take the light and purposefully model around obstacles that are on the field, players, the balls, so it’s like being in a portrait studio with lighting behind, lighting in front, and you look perfect,” Ephesus Chief Technology Officer Joe Casper said in a 2015 Vikings.com article. “We take great care of taking light from various aspects of the catwalk, and it’s being aimed to create light from 16 different directions so it gives you the appearance that you’re in a studio.”

To keep their patented LED solution cool, Ephesus partnered with ATS for a casted heat sink, which is large, rugged, and reliable. By providing the proper thermal management, ATS has helped Ephesus optimize the performance of its LED, which have now been used in two stadiums that have hosted the NFL’s championship game.

The first time LED were used was at University of Phoenix Stadium in Glendale, Ariz. when the Patriots beat the Seattle Seahawks.

For its assistance, ATS and other Ephesus partners received special thanks from the lighting company:

The casted heat sink design that ATS devised had several advantages, including a reduced part count, having the enclosure and heat sink in a single unit, and reducing the manufacturing complexity of the thermal solution. With ATS help, the lighting was able to be delivered and installed on time for the game, just as it was for the opening of the new stadium in Minneapolis.

For more information about the design that ATS delivered, read this case study with the engineers that worked on the project: https://www.qats.com/cms/2015/04/28/casting-a-light-on-led-cooling-with-die-cast-heat-sinks.

To learn more about the thermal challenges that LED present, read this article from Design World written by Dr. Kaveh Azar, founder and CEO of ATS: https://www.designworldonline.com/lighting-the-way-for-led-development/#_.

Thanks to the LED expertise of Ephesus and thermal management capabilities of ATS, fans will have a perfect view when the Patriots take the field in search of a sixth title.

For more information about Advanced Thermal Solutions, Inc. (ATS) thermal management consulting and design services, visit https://www.qats.com/consulting or contact ATS at 781.769.2800 or [email protected]. To learn more about ATS LED products and consulting, visit https://www.qats.com/Applications/LED-Applications.

Industry Developments: Advances in Thermal Interface Materials for Electronics Cooling

By Norman Quesnel
Senior Member of Marketing Staff
Advanced Thermal Solutions, Inc. (ATS)

For decades, thermal interface materials (TIMs) have been used as pathways allowing heat to flow from one location to another. TIMs are often part of cooling systems that remove heat from component dies by dissipating it into heat spreaders, such as heat sinks, and ultimately out of the dies’ surrounding enclosures.

As a product line, TIMs have continuously evolved, driven by market needs for higher thermal conductivity, lower thermal impedance, new applications and lower costs.

Thermal Interface Materials

Figure 1. Thermal Interface Materials are Used Both Inside and Outside Chip Packages. (Indium) [1]

From a broad view, most TIMs fall into three material categories. Some are made from elastomers or other polymers with a thermally-conductive filler added. Other TIMs are solder-based. Like elastomers, these solder-based TIMs are soft and conformable to mating surfaces, filling air gaps that compromise thermal transfer. Finally, newer carbon-based TIMs have emerged that demonstrate superior performance, though many of these are not yet commercialized.

Here is a brief look at recent developments within the major TIM categories:

A New TIM Filler

A new generation of polymer-based TIMs uses boron nitride nanosheet (BNNS) fillers to enhance thermal conductivity. BNNS is a two-dimensional crystalline form of hexagonal boron nitride (h-BN), also known as white graphene. BNNS ranges in thickness from just one to a few atomic layers. It has a similar geometry to its all-carbon analog graphene, but some very different properties. For example, graphene is highly electrically conductive while BN nanosheets are electrical insulators.

Figure 2. Edges of boron nitride nanosheets are atoms of all boron, all nitrogen, or alternating elements. (Wikimedia Commons)

Hexagonal boron nitride (h-BN) has other desirable properties, including a large surface area, high-thermal transport, and chemical inertness. The thermal conductivity of bulk h-BN can reach 400 W/mK at room temperature. [3]

A recent study from Rice University, which continues to expand on its original simulations of graphene’s effect on nanoscale heat transfer, demonstrated that an h-BN thin film composed layer-by-layer of laminated h-BN nanosheets can enhance lateral heat dissipation on a substrate, in this case glass. Thermal performance improved with the BN coating due to its anisotropic thermal conductivity. It had a high in-plane thermal conductivity of 140 W/mK for spreading and a low cross-plane thermal conductivity of 4 W/mK to avoid a hot spot beneath the tested device. [4]

Researchers have also created simulations showing that 3-D structures of h-BN planes connected by boron nitride nanotubes could transfer heat (move phonons) in all directions, whether in-plane or across planes. The number and length of the nanotubes connecting the h-BN layers have an effect on heat flow: more and/or shorter pillars slow conduction, while longer pillars speed heat transfer along.

Figure 3. 3-D structure of highly thermally conductive h-BN sheets connected by BN nanotubes. (Shahsavari Group/Rice University)

Solder-Based TIMs

With ever-increasing power and heat dissipation needs across the electronics industry, solder-based TIMs may be better suited to take the heat away from dies than thermal grease where electrical insulation isn’t required.

Issues with thermal grease include:

  • Grease has a low bulk thermal conductivity of 3-12 W/mK. Some solder-TIMs provide a high bulk thermal conductivity of 87 W/mK.
  • Over time, thermal grease tends to pump-out and migrate away from the center of the power die. It gets hotter and can fail prematurely. There is no pump-out with a solder-TIM.
  • Over time, grease tends to bake-out and dry (becomes powdery), thereby increasing thermal resistance and reducing heat-dissipation effectiveness. With solder-TIMs, there is no bake-out. [5]

Figure 4. SMA-TIMs conform to surface disparities over time to increasingly reduce thermal resistance. (Indium Corp.) [6]

Recent solder-based TIMs developed by Indium Corporation include a new SMA-TIM (soft metal alloy). This is made from an indium solder base and offers uniform thermal resistance at lower applied stresses in compressed interfaces. It is provided as a compressible metal foil that can be used as a TIM between a heat source and a heat sink, heat spreader, or heat pipe.

The malleability of the indium minimizes surface resistance and increases heat flow (conductance). Over time, the malleability of the solder helps fill the interface gaps even better. Thus, thermal interface resistance decreases over time as opposed to thermal grease where the thermal interface resistance increases over time. [7]

Another newer indium-containing material has been developed for use in the TIM 1 position, between the die top and its case. The material is part of a system, developed by Indium Corporation, called mdTIM. It provides a thermal conductivity of 87 W/mK.

While pure indium metal has a superb thermal transfer rate, air or gas pockets (voids) can degrade the performance of the material. These voids are created by entrapped air or gasses produced by flux component evaporation that fail to escape during reflow.

Indium’s mdTIM uses a patented system of materials and reflow technology does not use flux so there are no outgassing issues.

Carbon-Based TIMs

The very high thermal conductivity of pure carbon has long made it attractive for use in TIMs. Today’s carbon-based TIM fillers include diamond, carbon nanotubes (CNT), graphite and graphene. Often these fillers are dispersed in a spreadable (grease-like) polymer matrix.

In some cases, different forms of carbon fillers are being combined. For example, highly thermally conductive CNT have been mixed with less expensive carbon substrates like graphite and graphene to reduce costs but still deliver very high thermal conductivity.

Recent research has been made with graphite nanoplatelets (GNP) in thin thermal interface layers. These studies concerned the through-plane and in-plane alignment of GNP in a spreadable matrix. When dispersed, the GNP fillers take a naturally in-plane alignment, meaning the great majority of heat flow is in parallel to an interface. However, at the same time, the desired through-plane heat transfer from one surface to the other is much less. [8]

Figure 5. The top SEM images are graphite nanoplatelets with in-plane alignment. Bottom images show hybrid mix of GNP with a 45% volume of Al2O3 spheres. [8]

A solution was found by adding spherical microparticles. Spherical Al2O3 and Al filler particles were tested. The hybrid filler formulations resulted in enhanced through-plane thermal conductivity by disrupting the natural in-plane alignment of the GNP. This led to the disruption of the GNP in-plane alignment and the improvement of the through-plane thermal conductivity of the tested thermal greases.

Costs and other factors pose development challenges to TIMs with carbon-based heat transfer schemes. But given the high thermal conductivity and various configurations available from carbon-based materials, these will likely be at the heart of many upcoming performance advancements in TIMs.

References
1. Indium Corporation, http://www.indium.com/thermal-management/tim/
2. http://news.rice.edu/2015/07/15/white-graphene-structures-can-take-the-heat/
3. http://pubs.acs.org/doi/10.1021/acsami.5b03967
4. Nanoscale, http://pubs.rsc.org/en/content/articlelanding/2017/nr/c7nr07058f#!divAbstract
5. IEEE Xplore, http://ieeexplore.ieee.org/document/6142407/%5D
6. Engineering 360, http://www.globalspec.com/FeaturedProducts/Detail/Indium/Thermal_Interface_MaterialHeatSpring/256323/1
7. Indium Corporation, http://www.indium.com/thermal-interface-materials/heat-spring/
8. Nature, https://www.nature.com/articles/srep13108.pdf

For more information about Advanced Thermal Solutions, Inc. (ATS) thermal management consulting and design services, visit www.qats.com/consulting or contact ATS at 781.769.2800 or [email protected].

How to Achieve Localized Cooling with Cold Plates

Many applications in electronics cooling require a cold plate to remove heat from discrete components laid out on a board. In these circumstances, it is more efficient that the liquid does not completely fill the cold plate, but is only transferred to areas that need to be cooled.

With this kind of design, the required volumetric flow rate of the coolant will be significantly lower than if the entire cold plate was filled with liquid. The schematic for a typical example of this scenario is given in Figure 1. [1]

Localized Cooling With Cold Plates

Figure 1. Schematic of a Board with a Localized Area of Heat Dissipation . [1]

In Figure 1, areas A, B, C and D must be cooled for the components dissipating from 5 to 15 W/cm2. The other areas, designated as open, have components that interfere with the cold plate and must be avoided in the design. Two designs were considered for this case: a drilled hole and a press-fit tube. Figure 2 shows the drilled hole concept.

As can be seen, there are multiple small holes around the heat dissipating components under the cold plate surface. Large holes are machined to interconnect the smaller holes. A technique called gun drilling was used for machining the long holes. The entire cold plate was made from a copper block.

Cold Plates

Figure 2. Schematic of the Drilled Hole Cold Plate Design. [1]

Figure 3 shows the press-fit tube design. In this approach, a copper tube with high thermal conductivity is routed through the areas of heat transfer and either brazed or epoxied to the aluminum cold plate base. This design is considerably lighter and cheaper than the drilled hole design.

Cold Plates

Figure 3. Schematic of the Press-Fit Tube Cold Plate Design. [1]

To analyze the performance of this cold plate configuration, simple analytical tools can be used for a standard cold plate design. A brief summary of the equations is described here. To analyze the problem, we first have to calculate how much flow is going through the cold plate, and evaluate the pressure drop of the flowing fluid.

Pressure drop is calculated from:

Where
Um = bulk mean fluid velocity (m/s)
f = fanning friction factor
Awet = wetted surface area of the tube
Ac = cross section of the tube
K = loss coefficients related to turns, sudden expansion and contraction, etc.

The friction factor was obtained from the following equation which is in satisfactory agreements for the laminar, turbulent and transition regimes [2]

Where

Where ν is the kinematic viscosity of the fluid (m2/s) and P is the wetted perimeter of the tube.

For the heat transfer calculation, the Nusselt number can be calculated from standard correlations in the literature for fully developed flow. The Nusselt number is related to the heat transfer coefficient as:

Where
Kf = fluid conductivity

For thermally developing flow the following correlation can be used: [3]

Where
Num = mean Nusselt number
Nu∞ = fully developed Nusselt number
L = duct length

Then the convective resistance can be calculated as:

Where
hm = mean heat transfer coefficient

For the tube fitted design the overall thermal resistance is made of four components: convection, tube conduction resistance, epoxy conduction resistance and the cold plate. It is stated as:

Where
Rh = convection resistance
Rtube = conduction resistance of tube walls
Repoxy = conduction resistance of the epoxy
Rcoldplate = conduction resistance of the cold plate

For the drilled design the overall thermal resistance can be written as:

If the heat transfer coefficient is based on the local fluid temperature, then a caloric resistance must be added based on the fluid mass flow rate. The effective heat transfer coefficient is then:

Where
ṁ = mass flow rate (kg/s)
Cp = fluid heat capacitance (kJ/kg·K)

Figure 3 shows the pressure drop of the two designs as a function of water flow rate. It can be seen that with a water flow rate up to 1.89 l/min (0.5 GPM) the pressure drop between the two designs is almost the same, but at higher flow rates the drilled design’s pressure drop exceeds the tube design. The sharp 90-degree turn of the drilled holes, which lead to a higher loss coefficient, is the major contributor to the higher pressure drop.

Figure 4. Total Pressure Drop of the Drilled Design and the Tube Design as a Function of the Volumetric Flow Rate. [1]

Figures 5 and 6 show the effective heat transfer coefficient of the two designs as a function of flow rate. The bend and sharp increase of the curves around 0.95 l/min (0.25 GPM) is due to the flow transitioning from laminar to turbulent. The drilled hole design shows effective convection heat transfer between 7,000 and 27,000 W/m2K for the range of flow between 0 and 7.56 l/m (2.6 GPM). The press-fit tube design on the other hand shows a lower effective heat transfer coefficient of between 6,000 and 17,000 W/m2K.

This is mostly due to the interfacial resistance and tube wall conduction. In the drilled design example, these two resistances do not exist. In a real application, the pumping of fluid is constrained by the pump and its characteristic curve. Even though the drilled hole shows a higher heat transfer coefficient for the same flow rate, the extra pressure drop caused by the drilled design may have a lower flow rate hence lowering the heat transfer coefficient.

Figure 5. Effective Heat Transfer Coefficient of the Tube Design as a Function of Flow Rate for Different Regions on the Plate. [1]

Figure 6. Effective Heat Transfer Coefficient of the Drilled Hole Design as a Function of Flow Rate for Different Regions on the Plate. [1]

Figure 7 shows another cold plate design, this one by Lytron. [4] In this design, the extended-surface cold plate material and micro-channel aluminum extrusion are sandwiched between aluminum sheets. The entire assembly is welded using vacuum brazing. It is all aluminum, which makes it very light weight. The flexibility of this design allows the placement of cooling channels in different positions to enable localized cooling.

Figure 7. Lytron Vacuum Brazing of a Cold Plate for Localized Cooling. [4]

The above analytics show that the performance of a cold plate for localized cooling can be calculated using a simple analytical tool. The designer then has to consider such factors as weight, manufacturing, cost and thermal performance to decide the best option for his or her design. The characteristic of the pump has a paramount effect on the design and cannot be neglected.

References:

1. Seaho, S., Moran, K. and Rearick, D. (IBM Corporation) and Lee, S. (Aavid Engineering), Thermal Performance Modeling and Measurements of Localized Water Cooled Cold Plate, http://www.aavidthermalloy.com/technical/papers/pdfs/water.pdf
2. Churchill, S., Comprehensive Correlating Equations for Heat, Mass and Momentum Transfer in Fully Developed Flow in Smooth Tubes, Ind. Eng. Chem. Fundam., Vol.16, 1977.
3. Al-Arabi, M., Turbulent Heat Transfer in the Entrance Region of a Tube, Heat Transfer Eng., Vol. 3, 1982.
4. http://www.lytron.com

For more information about Advanced Thermal Solutions, Inc. (ATS) thermal management consulting and design services, visit www.qats.com/consulting or contact ATS at 781.769.2800 or [email protected].