Category Archives: heat sink

New Electronics Cooling Webinars are Open for Second Quarter of 2012

Each month during the second quarter of 2012, ATS will present a technical webinar covering different topics within the dynamic world of electronics cooling. Each of these one-hour, online tutorials will include detailed visuals, definitions, instructions, case studies and references. One or more ATS PhD-level thermal engineers will be presenting live. Viewers will be able to key in questions during and after the presentation.

Each Q2 webinar is planned for a Thursday afternoon (ET) late in the month. These are the second quarter topics for the ATS webinars:

April 26, 2012 at 2:00 p.m. ET

How to Perform and Understand Air Velocity Measurement within Electronics Systems

Participants will learn about the importance of measuring air velocity in a system, the instruments necessary for obtaining useful measurements and where these velocities should be recorded.

May 24, 2012 at 2:00 p.m. ET

CFD as a Tool to Perform Heat Sink and System Modeling

Computational Fluid Dynamics (CFD) tools have become indispensable simulation tools, enabling design engineers to confront electronics cooling challenges on demand. Some tips and tricks are invaluable in performing these analyses. Among them: the simplest methods of preparing a CFD model; the best techniques for meshing; and how to model a systems components, such as fans and perforated plates. Attendees will learn about common and not-so-common issues in CFD, and how to overcome them.

June 28, 2012 at 2:00 p.m. ET

Heat Sink Selection Made Easy

As heat dissipation needs for electronic devices rapidly grow, choosing the right heat sink the first time is essential. With so many application requirements and heat sink options, this can be a daunting task. In this webinar, attendees will learn about the importance of system airflow and its impact on heat sink design; attachment methods; and how to solve thermal design challenges.

Seats at each of these webinars are free, but limited. Registration is available online at http://www.qats.com, or by calling 1-781-949-2522.

This Fixed Cost Plan for Cooling Hot PCBs Saves Money, Simplifies Ordering

For one fixed cost, a QoolPCB plan includes the full set of ATS heat sinks,  attachment devices and all other parts required for the effective thermal management of a PCBs components. There are no additional costs for the thermal engineering, performance testing, procurement or shipping. The heat sinks and hardware are kitted and provided for the full volume of boards requiring cooling.

Pricing for a QoolPCB solutions is based on the number of heat sinks that a specific PCB requires for efficient thermal management. For example, if thermal analysis and testing show that a PCB needs 10 heat sinks to operate safely, the fixed price for the heat sinks and hardware for a production volume of that PCB would be just $50 per board. For larger boards, or those with many hot components, the unit cost per heat sink is reduced.

Whether the solutions are for off-the-shelf heat sinks, custom designed, or a combination of both, the QoolPCB program from ATS provides it at fixed cost. QoolPCB eliminates separate costs for design, tooling, samples, verification and supply chain management. The program offers multiple benefits for companies looking to reduce their product development costs, speed time-to-market and ensure thermal reliability.

To participate, PCB developers simply provide 3D CAD models of their board layout, along with the technical specifications, including power dissipation of all board components. ATS performs a full thermal analysis of the PCB and develops a comprehensive cooling solution for each component on the board. Where possible, ATS engineers will specify existing heat sinks from a portfolio of more than 3000 off-the-shelf and application-specific designs and with in-stock attachment systems.

If any custom heat sinks are required to bring certain components within their manufacturer-designated running temperatures, ATS assumes all tooling charges and sample production costs, including any customized heat sink attachment hardware. In addition, ATS will perform all physical testing at its Thermal Characterization Laboratory, which features advanced open loop and closed loop wind tunnels, temperature and velocity measurement sensors and other analysis instrumentation, to verify the cooling design. All designs and performance reports are provided to customers, who can perform their own thermal analyses and verification studies using the ATS characterization lab and samples of the actual heat sink solutions at no extra cost.

More information about the QoolPCB thermal management program from ATS is available at: http://www.qats.com/Services/QoolPCB—PCB-Cooling-At-Fixed-Cost/57.aspx

 

Getting the Maximum Performance from Heat Sink Clips

As power levels for board components have risen, thermal engineers have been forced to design larger and more innovative heat sinks than ever before. Along with the thermal challenge has come the mechanical challenge of attaching these heat sinks to the components in a reliable fashion.

One of the most popular methods uses some form of clip. These are low in price and easily applied. Smart engineering has led to clip systems that provide strong, even pressure well beyond the working life of the component. They hold their heat sinks tight even when dropped or shocked, but they can be unclipped manually whenever it’s necessary.

Clips that attach directly to the component provide an advantage over other clip types, (e.g. z-clips) in that no holes are required in the PWB. The ATS maxiGRIP is an example of such an attachment. maxiGRIP uses a plastic frame clip that attaches directly to the component and provides a mounting platform for a custom spring clip (Figure 5).


The frame clip is installed, using a special tool which expands all four sides of the clip simultaneously, allowing the clip to be placed directly over the component package (A keep out area is usually required). Once released, tabs on each side engage and secure the clip to the component, creating a secure mounting platform for the spring clip. The spring clip, which is designed to provide a very precise load, is then installed to hold the heat sink in place, maintaining continuous pressure at the heat sink component interface. The maxiGRIP assembly has a big advantage over other heat sink attachment methods in that it allows for the use of high performance phase change interface materials.

Extensive FEA and shock and vibration testing of the maxiGRIP assembly have been done to provide a carefully engineered heat sink attachment solution with a high-level of reliability.

ATS Releases Mobile Heat Sink Design Tool for Android

We’ve just released our FIRST mobile application for Android! Our Heat Sink Design Tool is ready for you to download now from the Android Application store. The application will enable users to design a heat sink on their Android equipped mobile device for cooling of their electronic devices. After the design, the user can select to search available databases to see such a product exists. The app is 1.0M in size and requires Android 1.6 or higher. Get yours now for free by clicking to Heat Sink Design Tool on Android

Use cases include:

  • Consultants: Are you on premise with your client? Once you understand your needs for a heat sink, use our heat sink design tool to get a product fast.
  • Field Engineers: If your in the field, taking notes on what heat sink to use might be impractical. Use our heat sink design application to punch in the parameters for a heat sink and get it done right there.
  • Students: If your in the lab working on your next project, why not use our convenient application on your Android device to get our project that much quicker to completion

You say you use an iPhone? Well, we have an App for that too! Apple iPhone Heat Sink Design App

How to Select a Heat Sink: An ATS On-Demand Thermal Management Webinar

Our webinar “Heat Sink Selection Made Easy” is easily one of our most watched in our webinar archives. It a little over an hour, but, by the end, viewers will have a firm grasp of how to properly select a heat sink based on the fundamentals of thermal engineering. Its a must see for new engineers getting up to speed on thermal management of electronics and for experienced engineers looking to refresh their understanding.