Altera’s Cyclone® V FPGAs provide the industry’s lowest system cost and power, along with performance levels that make the device family ideal for differentiating your high-volume applications. You’ll get up to 40 percent lower total power compared with the previous generation, efficient logic integration capabilities, integrated transceiver variants, and SoC FPGA variants with an ARM®-based hard processor system (HPS).
ATS has over 1,800 heat sinks that meet the specific application requirements of Altera. For example, the Altera Cyclone® V component part number 5CGXFC7D7F27C8NES has 17 cooling solutions, including ATS maxiFLOWTM high performance bga heat sink. maxiFLOWTM unique design provides thermal performance that is 30- 200% better than the conventional heat sinks. By combining maxiFLOWTM heat sinks with the Cyclone® V FPGAs, you can get the power, cost, and performance levels you need for high-volume applications including protocol bridging, motor control drives, broadcast video converter and capture cards, and handheld devices.
For mounting the heat sink to the pcb, these heat sinks are available with pre-assembled thermal interface materials and with the maxiGRIPTM heat sink attachment. maxiGRIPTM provides a steady, even pressure from the heat sink to the Cyclone® V with easy instillation and removal, eliminating the need to drill holes in the pcb.
Test out the new Heat Sink Selection Tool to view the full list of heat sinks specific to Altera components, along with the full list of component manufacturers that are compatible with ATS cooling solutions.