Category Archives: heat sink

Announcing our ATS Electronics Cooling Webinars for Third Quarter of 2012

ATS, Advanced Thermal Solutions, Inc. will present technical webinars on electronic cooling topics in July, August and September 2012. Each of these free events will provide engineering-level training in a key area of modern thermal management.

Here are the different webinar topics and presentation times:

Using Thermal Interface Materials to Improve Heat Sink Thermal Performance

July 26, 2012 at 2:00 p.m. ET

To cool hotter components, engineers are using larger fans and heat sinks, and increasing surface areas. These hardware enhancements can add significantly to design costs. In many cases, cooling performance can be improved by using a higher performance interface material between the case and the heat sink. Participants will learn the importance of lowering thermal resistance using thermal interface materials, or TIMs, and the different kinds of TIMs available from the market.

Air Jet Impingement Cooling

August 23, 2012 at 2:00 p.m. ET

Ongoing increases in power in devices such as processors and IGBTs mean that higher capacity cooling methods are needed to remove excess heat. One such method is the jet impingement of a liquid or gas onto a surface on a continuous basis. Lab experiments at ATS have shown up to a 40% improvement in cooling achieved using this method. This webinar will explore jet impingement cooling theory, implementation and best practices.

LED Thermal Management in Commercial and Consumer Lighting Applications

September 27, 2012 at 2:00 p.m. ET

Excess heat directly affects both short-term and long-term LED performance. The short-term effects are color shift and reduced light output, while the long-term effect is accelerated lumen depreciation and thus shortened useful life. Participants will learn how to diagnose and solve thermal issues in consumer and commercial LED applications.

Each of these one-hour online tutorials will include detailed visuals, real world examples, instructions, definitions and references. Audience questions will be answered by the presenters during and after the presentation. One or more ATS PhD-level thermal engineers will be presenting live.

There is no cost to attend these ATS webinars, but virtual seating is limited. Registration is available online at http://www.qats.com, or by calling 1-781-949-2522.

http://qats.com/Training/Webinars/7.aspx

 

An Expert Speaks Out on CFD Modeling of Heat Sinks

Chris Aldham of Future Facilities has something to say about CFD modeling of heat sinks. And he should know after 30 years in the business. Chris will present a webinar for ATS on May 24, 2012 “CFD as a Tool to Perform Heat Sink and System Modeling,” that you can attend for free by registering on Qats.com.

https://www2.gotomeeting.com/register/467986842

We asked Chris to share upfront some general knowledge and opinions on the topic ….

What are some of the recent advances in CFD technology and how might they improve heat sink modeling?

The main advance I’ve seen is the increase in computer power and lowering of computer cost that has occurred over the past few years. It is now possible to solve larger (more grid cells) and more detailed (more objects and better geometrical representation) models and more of them very efficiently. So now representing the detailed geometry heat sinks in a CFD model is easy. Importing MCAD heat sink geometry and using that geometry directly in the software ensures an accurate representation of the heat sink.

The other advance is the automation possible in specialized tools such as 6SigmaET. The mesh necessary to represent the heat sink is determined automatically within the software it doesn’t rely on the user creating a good mesh.

These two trends seem set to continue so it will be possible to model increasingly complicated heat sink designs.

Meshing is very core to CFD modeling. What are the do’s and dont’s when it comes to meshing heat sink models?

I think there are two aspects to consider when meshing a heat sink. The solid geometry must be accurately captured to ensure the heat spreading and conduction through the base and up the fins is accurately represented. Then the airflow between the fins must be accurately captured. This invariably requires a fine mesh at least 3 cells between the fins and maybe more depending on the gap size.

What are some of the benefits from developing a high quality CFD model of a heat sink?

At first sight heat sinks seem quite simple in function but their interaction with the components they are cooling and the air flow around them is quite complex. The heat spreading of the heat sink base can subtly change the thermal resistance of the component. The increase in surface area the heat sink provides improves heat transfer but also represents an increased resistance (increased pressure drop) to the airflow. So a good heat sink design must balance heat spreading, heat transfer and pressure drop. As a detailed CFD model can represent all these aspects accurately in the situation in which it will be used it can be the only way to optimize them before the heat sink is manufactured and tested.

Can you cite any examples where your CFD tools led to improved heat sinks solutions?

We have published a couple of examples together with ATS Europe who have used 6SigmaET in a number of projects. One was an unusual heat sink design on an LED replacement for a traditional light bulb where a 14% improvement in lamp performance was produced (as well as a much nicer looking design in my opinion) by changing the heat sink design. This work also showed good agreement between 6SigmaET simulations and measurements performed on the real devices. See images below.

How long does it take a typical engineer to master CFD modeling? Are there any innovations in training?

I’ve been doing CFD for over 30years and I’m not sure I’ve mastered it yet. Fortunately engineers do not have master CFD modeling today as some CFD software products are focused on specific applications and these can really present CFD in a very usable form. Of course it helps if the engineers have some idea of the physics of fluid flow and heat transfer but much of the numerical work in CFD can be preset, automated and hidden away. This has been especially true in the field of electronics cooling where specialized software has been around for decades. These tools can be learned in a few days and users can be proficient in a few weeks.

How is Future Facilities different from its competitors?

Future Facilities is highly focused on a small number of related application areas. We produce software for design, operation and management of data centers which includes CFD modeling of the airflow and temperatures as well as other non-CFD analysis modules. We also use the software in our engineering consultancy group providing services that ensure the software development is focused on exactly what is needed and making it easy and efficient.

6SigmaET is a recent product focused on electronics cooling and integrated into our data center suite. Like the whole software suite it presents the user with a set of specialized intelligent objects which represent the real things encountered in electronics (pcbs, fans, heat sinks, power supply, components, etc.). As every object knows what it is, it knows how to behave and this can make creating a model very intuitive for the users. It also allows us to automate the meshing rules for each object so we can ensure a heat sink, for example, is meshed correctly.

I believe the many years of experience we have in using and developing CFD products alongside a strong focus on particular application areas and a desire to make complex technology available to engineers (expert and beginner, full-time or occasional users) makes us very different from other CFD companies.

Dr. Chris Aldham has worked in computational fluid dynamics (CFD) for over 30 years (starting with PHOENICS at CHAM with Prof. Brian Spalding) and for more than 20 years in the field of electronics cooling. After 16 years at Flomerics, Chris joined Future Facilities as a Product Manager responsible for 6SigmaET electronics cooling simulation software which is part of a suite of integrated software products that tackle head-on the challenges of data center lifecycle engineering (including equipment design analysis) through the Virtual Facility

New maxiFLOW Heat Sinks for Cooling DC-DC Converters


ATS now provides maxiFLOW heat sinks specially designed to cool eighth, quarter, half and full brick size DC-DC converters. The patented maxiFLOW heat sink design reduces air pressure drop and provides more surface area for more effective convection (air) cooling. The same ATS maxiFLOW technology is used in heat sinks cooling millions of BGAs and other PCB components,

The brick DC-DC converter heat sinks offer a range of fin patterns, directions and profiles to match different height and weight restrictions and airflow patterns. All of these heat sinks are protected with a gold anodized finish.

Each heat sink is provided pre-assembled with a layer of Chomerics T766 Thermflow phase change thermal interface material to enhance heat transfer from brick to heat sink. All of these heat sinks also come with three sets of screws in lengths of 5, 6 and 8 mm for varied attachment situations. The heat sinks pre-drilled hole patterns fit all major DC-DC converter designs.

DC-DC converters are circuits which convert direct current (DC) from one voltage level to another. They are extensively used in electronic devices serving communications, computing, data storage, health care, industrial equipment, instrumentation and test and measurement. Heat sinks are typically required to keep the converters running within safe operating temperatures.

Cooling High Power LEDs

Most LEDs are designed in SMT (surface mount technology) or COB (chip-on-board) packages. In the new 1~8W range of surface mount power LED packages, the heat flux at the devices thermal interface can range from 5 to 20 W/cm2. These AllnGaP and InGaN semiconductors have physical properties and limits similar to other transistors or ASICs (application specific integrated circuit). While the heat of filament lights can be removed by infrared radiation, LEDs rely on conductive heat transfer for effective cooling.

As higher powers are dissipated from LED leads and central thermal slugs, boards have changed to move this heat appropriately. Standard FR-4 technology boards can still be used for LEDs with up to 0.5 W of dissipation, but metallic substrates are required for higher levels. A metal core printed circuit board (MCPCB), also known as an insulated metal substrate (IMS) board, is often used underneath 1W and larger devices. These boards typically have a 1.6 mm (1/16 inch) base layer of aluminum with a dielectric layer attached. Copper traces and solder masks are added subsequently. The aluminum base allows the heat to move efficiently away from the LED to the system.

Increasing power density, a higher demand for light output, and space constraints are leading to more advanced cooling solutions. High-efficiency heat sinks, optimized for convection and radiation within a specific application, will become more and more important.

As with any semiconductor package, thermal resistance plays a significant role in the thermal management of LEDs. The highest thermal resistance in the heat transfer path is the junction-to-board thermal resistance (Rj-b) of the package [2]. Spreading resistance is also an important issue. Thermally enhanced spreader materials, such as metal core PCBs, cold plates, and vapor chambers for very high heat flux applications are viable systems to reduce spreading resistance. [3]

Linear heat sinks are available specifically for LED strips, such as OSRAM SYLVANIA’s DRAGONstick® linear LED strips, which are widely used in architectural lighting. For example,the maxiFLOW linear heat sink from Advanced Thermal Solutions, Inc., has a patented spread fin array that maximizes surface area for more effective convection (air) cooling, particularly when air flow is limited, such as inside display cases.

Round heat sinks are available specifically for round LED boards, which are used to replace halogen light bulbs, in applications such as spotlights and down lighting. A typical LED spotlight is shown in Figure 2 [5]. Here, a round QooLED© heat sink from Advanced Thermal Solutions is used for cooling three LEDs. The round heat sink has a special star-shaped profile fin design that maximizes surface area for more effective convection (air) and radiation cooling in the vertical mounting orientation, e.g., inside ceilings.

Active thermal management systems can be used for high-flux power LED applications. These include water cooling, two-phase cooling, and fans. Although active cooling methods may not be energy-justifiable for LEDs, reasons for using them include ensuring lumen output or maintenance-free operation, or to meet specific wavelength requirements.

New Hardcover Collection of Qpedia Electronics Thermal Management Articles Now Available from ATS