Category Archives: heat sink

“Heat Sink Selection Made Easy” Free Technical Webinar on June 13

PCB from Tellabs- smaller sige

 

Advanced Thermal Solutions, Inc. (ATS) will present Heat Sink Selection Made Easy, a free technical webinar for engineers involved in the thermal management of electronic components. The hour-long webinar begins at 2:00 ET on Thursday, June 13.

The heat dissipation needs of todays components are more challenging than ever. Choosing the right heat sink the first time is essential. With so many application requirements and heat sink options, this can be a daunting task, but it is made easier by having an informed approach.

In this webinar, attendees will learn the importance of system airflow and its impact on heat sink design; attachment methods and how to solve thermal and mechanical design challenges; and how to make the right off-the-shelf or custom heat sink choice for your application and budget.

Presenting Heat Sink Selection Made Easy is Dr. Kaveh Azar, president, CEO and founder of Advanced Thermal Solutions. Dr. Azar is an active participant in the electronics thermal community and has served as the organizer, general chair and the keynote speaker at national and international conferences sponsored by ASME, IEEE and AIAA.

How to View the June 13th Webinar:

  • The webinar starts at 2PM ET and will be available for 24 hours, until 2PM ET Friday the 14th.
  • ATS felt that this approach would help engineers in other time zones to be able to watch the webinar.

How to Ask Questions?

  • Today’s webinar speaker, Dr. Kaveh Azar, is happy to take your questions via email.
  • Please send email to [email protected] and write in the email’s subject, “Heat Sink Selection Webinar Question”

 

 

 

Mouser and Advanced Thermal Solutions, Inc. (ATS) Sign Global Distribution Agreement

Mouser

 

 

 

May 23, 2013  Advanced Thermal Solutions, Inc. (ATS) today announced a new global agreement with Mouser Electronics, Inc. to distribute high performance heat sinks and cooling solutions.

The agreement with ATS means Mouser Electronics customers will have access to a wide range of high performance heat sinks available in thousands of shapes and sizes. ATS heat sinks are designed for use in many applications including telecom, datacom, LED, automotive, medical, and aerospace. Their maxiFLOW heat sinks feature a low profile spread fin array that maximizes surface area, yielding the highest thermal performance of any heat sink on the market. ATS maxiFLOW heat sinks are available with thermal tape, push pin or its patented maxiGRIP attachment methodology. ATS maxiGRIP assemblies permit secure attachment of heat sinks to BGAs, flip chips and other hot components on a PCB with steady, even pressure and without any need to drill holes in the board. Both the spring and frame clip in the maxiGRIP assembly can be easily removed, allowing the heat sink to be detached and re-attached without damaging the device, surrounding components or PCB. All ATS maxiGRIP heat sinks are fabricated with high-performance, phase-changing thermal interface material to further maximize performance. Mouser Electronics stocks an extensive line-up of the ATS LED heat sinks, including both the linear style and the round/star shape in a wide variety of sizes; fansinks using maxiGRIP attachment, and a full line of maxiFLOW heat sinks for brick DC/DC converters.

We are very pleased to present to our customers the world-renowned ATS line of heat sinks,” says Keith Privett, Mouser Electronics Vice President of Electromechanical, Power, and Test. Our broad product offering will provide customers with cooling solutions for LEDs, BGAs, power supplies, and specific devices such as flip-chip processors.”

Amongst many air and liquid high capacity cooling solutions, ATS provides the widest range of high performance heat sinks for cooling todays hot-running electronic devices,”says Sharon Koss, VP of Operations and Business Development of ATS. “We look forward to providing thermal solutions to Mouser’s customers around the world.” To view these and other products by ATS, visit http://www.mouser.com/Advanced-Thermal-Solutions/.

With its broad product line and unsurpassed customer service, Mouser caters to design engineers and buyers by delivering whats next in advanced technologies. Mouser offers customers 19 global support locations and stocks the worlds widest selection of the latest semiconductors and electronic components for the newest design projects.

Mouser Electronics website is updated daily and searches more than 10 million products to locate over 3 million orderable part numbers available for easy online purchase. Mouser.com also houses an industry-first interactive catalog, data sheets, supplier-specific reference designs, application notes, technical design information, and engineering tools.

About Mouser Electronics

Mouser Electronics, a subsidiary of TTI, Inc., is part of Warren Buffett’s Berkshire Hathaway family of companies. Mouser is an award-winning, authorized semiconductor and electronic component distributor, focused on the rapid introduction of new products and technologies to electronic design engineers and buyers. Mouser.com features more than 3 million products online from more than 500 manufacturers. Mouser publishes multiple catalogs per year providing designers with up-to-date data on the components now available for the next generation of electronic devices. Mouser ships globally to over 375,000 customers in 170 countries from its 492,000 sq. ft. state-of-the-art facility south of Dallas, Texas. For more information, visit http://www.mouser.com.

Increased Performance from High Aspect Ratio Heat Sinks

High Aspect Ratio Heat Sinks from ATSA heat sink’s aspect ratio is basically the comparison of its fin height to the distance between its fins. In typical heat sinks the aspect ratio is between 3:1 and 5:1. A high aspect ratio heat sink has taller fins with a smaller distance between them for a ratio that can be 8:1 to 16:1 or greater.

Thus, a high aspect ratio heat sink provides greater density of fins in a given footprint than a more common sink, and/or stands taller than its conventional counterpart. The great benefit from a high aspect ratio heat sink is the increased amount of heat dissipating surfaces it provides due to its additional fins. Further, these heat sinks do not occupy any more length or width. The result is a more efficient heat sink with higher performance per gram in the same footprint.

Many common heat sinks are unable to serve the needs of high volume applications, due to the fact that their cooling capacity – measured in part by the aspect ratio – is simply not great enough. By nearly doubling a heat sink’s aspect ratio the cooling performance is optimized and heat issues resolved without the need for more complex solutions.

Because high aspect ratio heat sinks are manufactured in similar fashion as conventional heat sinks, their cost is not significantly higher. They can be extruded or bonded. Fins can be straight or folded. For omnidirectional purposes a high density of pins can be used as heat spreaders in place of fins.

High aspect ratio heat sinks are often ideal thermal solutions for workstation CPUs, high performance power supplies and converters, and high-end amplifiers.

Of critical importance when using high aspect ratio heat sinks is providing sufficient airflow to carry away the radiating heat. Passive cooling, e.g. conduction and radiation may be inadequate. Convective heat transfer removes essentially all of the energy from a heat sink under forced air cooling. Particularly with dense fin fields, an improperly directed fan may create stagnation points and high pressure loss. Thermal modeling is recommended when determining the needed active cooling resources.

ARM Microprocessors and ATS superGRIP: Attached at the Clip

Advanced Thermal Solutions, Inc., (ATS), has introduced a line of heat sinks compatible with the Sitara ARM Microprocessor family from Texas Instruments.

AM1707 from Texas Instruments

AM1707 from Texas Instruments

The Sitara ARM Microprocessors feature ARM Cortex-8 and ARM9 MPUs, which are used in a wide variety of Industrial, Medical, and Consumer Electronics applications.

The AM17x family consists of low-power ARM microprocessors that enable OEMs and ODMs to maximize product offerings by providing high processing performance life, advanced operating systems and rich user interfaces. Compatible operating systems include Neutrino, Integrity, Windows, Embedded CE, Linux, VXWorks and Android.

ATS patented maxiFLOW heat sinks with superGRIP clip attachment ensure long-term product reliability and maximum performance from the Sitara ARM Microprocessors. maxiFLOW high performance BGA heat sinks feature a low profile, spread fin array that maximizes surface area for more effective convection air cooling. The unique maxiFLOWTM design provides thermal performance that is 30-200% better than conventional heat sinks.

ATS' maxiFLOW Heat Sink with superGRIP Attachment

ATS’ maxiFLOW Heat Sink with superGRIP Attachment

maxiFLOW is available with pre-assembled phase change material, maxiGRIP clip attachments, and superGRIP clip attachments. The superGRIP attachment system features a plastic frame clip that fastens securely around the perimeter of a component and a metal spring clip that slips through a heat sinks fin field and locks securely to both ends of the plastic frame. The resulting superGRIP assembly applies steady even pressure to the component throughout the product lifecycle, improving thermal performance and long-term reliability. The ATS superGRIP heat sink attachment system permits the use of high performance phase changing thermal interface materials that improves heat transfer by as much as 20 times more than typical double-sided adhesive thermal tapes. It also allows for the heat sink to be detached and reattached without damaging the component or the PCB, an important feature for applications where PCB rework and ease of assembly and disassembly are important. The full range of ATS products compatible with Texas Instruments products can be viewed in the new heat sink selection tool on http://qats.com/Distributor/AE-Dist.php

To learn more about maxiFLOW heat sinks and the superGRIP clip attachment, please visit www.qats.com, email [email protected], or call 781-769-2800.

ATS’ maxiFLOW Heat Sinks a Great Match with Altera’s Cyclone V

ATS’ new Heat Sink Selection Tool on www.qats.com allow engineers to match existing ATS heat sinks with specific applications from the top component manufacturers in the market.

Altera’s Cyclone® V FPGAs provide the industry’s lowest system cost and power, along with performance levels that make the device family ideal for differentiating your high-volume applications. You’ll get up to 40 percent lower total power compared with the previous generation, efficient logic integration capabilities, integrated transceiver variants, and SoC FPGA variants with an ARM®-based hard processor system (HPS).

Cyclone V (courtesy of Altera, http://www.altera.com/devices/fpga/cyclone-v-fpgas/cyv-index.jsp)

ATS has over 1,800 heat sinks that meet the specific application requirements of Altera. For example, the Altera Cyclone® V component part number 5CGXFC7D7F27C8NES has 17 cooling solutions, including ATS maxiFLOWTM high performance bga heat sink. maxiFLOWTM unique design provides thermal performance that is 30- 200% better than the conventional heat sinks. By combining maxiFLOWTM heat sinks with the Cyclone® V FPGAs, you can get the power, cost, and performance levels you need for high-volume applications including protocol bridging, motor control drives, broadcast video converter and capture cards, and handheld devices.

maxiFLOW heat sink results from the new Heat Sink Selection Tool

For mounting the heat sink to the pcb, these heat sinks are available with pre-assembled thermal interface materials and with the maxiGRIPTM heat sink attachment. maxiGRIPTM provides a steady, even pressure from the heat sink to the Cyclone® V with easy instillation and removal, eliminating the need to drill holes in the pcb.

Test out the new Heat Sink Selection Tool to view the full list of heat sinks specific to Altera components, along with the full list of component manufacturers that are compatible with ATS cooling solutions.