Tag Archives: CFD modeling

Case Study: Thermal Management in Harvard Medical School Tissue Analysis Instrumentation

Designers of today’s highly advanced medical diagnostic equipment must overcome many of the same thermal challenges common to telecommunications, industrial and information technology electronics.

In addition, medical diagnostic devices present unique design issues and boundary conditions that factor into thermal solutions. These include isothermal and cyclic temperature demands, precise test repeatability, and maintaining the patient’s safety and comfort.

These kinds of issues were presented by Harvard Medical School to the experts at Advanced Thermal Solutions, Inc. (ATS) when it needed a cooling solution for the diagnostic equipment it was relying on for the analysis and observation of human tissue samples in a controlled laboratory setting. This was the school’s Frozen Tissue Microarrayer System.

ATS engineers had to provide thermal solutions to meet a range of design goals:

• Provide long-term temperature control for tissue samples embedded in an optimum cutting temperature fluid.
• Create a cooling system to maintain tissue samples below -70°C for six hours.
• Ensure operator visibility of the samples.
• Eliminate humidity and frost within the system to prevent sample contamination.

ATS Cooling Solutions

ATS engineers developed highly effective thermal solutions to meet all the design requirements of the diagnostic equipment. A reservoir in the device holds the liquid cooling medium and tissue samples are loaded through an opening at the top. Through a duct, cool air is circulated over the top of the samples to maintain temperature and humidity requirements.

As seen in Fig. 1 (below), the diagnostic system consisted of:

• Frozen tissue coring machine (on the right in the photo)
• Tissue sample loading area at the top of the cooling system (seen on the left)
• Duct system (on both sides of system) to circulate cool air
• Ice/alcohol reservoir at the system’s bottom to contain the cooling medium

Harvard Case Study

Figure 1. Prototype system created by ATS engineers for Harvard Medical School laboratory. (Advanced Thermal Solutions, Inc.)

Conduction Cooling Design

In operation, tissue samples are loaded into removable aluminum cassettes that fit tightly into a metal receiver (top left, Figure 2). The receiver contacts the cassette on five sides which allows for cooling of the samples by conduction. The receiver is lowered into a reservoir containing a slurry of dry ice and ethyl alcohol. Here the receiver is maintained at a constant temperature until the dry ice evaporates. The reservoir is double-walled and insulated to extend the evaporation time of the dry ice.

The receiver also features integral fins that increase surface area for drawing heat downward from the base of the cassettes into the icy slurry (bottom left, Figure 2). These fins are based on the same ATS heat sink design principles used in the company’s high performance maxiFLOW™ heat sinks.

Using analytical modeling, ATS engineers determined that 10 fins were the optimal number for cooling the cassette receiver and its contents. CFD simulations also showed that the 10-fin concept resulted in an optimal design. The engineers validated their analytical and CFD results through empirical testing. It was determined that extending 10 fins into the slurry provided the cooling performance to maintain tissue sample temperatures below the -70°C threshold for 9.75 hours.

Further temperature testing using thermocouples showed only a 2.5°C difference between the coldest points at the bottom of the fins and the tissue samples in the cassette. This proved that the design overcame thermal conduction resistance and could effectively maintain the samples below their critical temperature.

Figure 2. Temperature testing with thermocouples demonstrated that the temperature difference between the bottom of the fins and the top of the cassette, through three intervening layers, was only 2.5°C. This proved that the thermal design was successful. (ATS)

Figure 2. Temperature testing with thermocouples demonstrated that the temperature difference between the bottom of the fins and the top of the cassette, through three intervening layers, was only 2.5°C. This proved that the thermal design was successful. (ATS)

Figure 3. Using a heat sink-specific thermal resistance network ATS determined that the optimal number of fins was 10. (ATS)

Figure 3. Using a heat sink-specific thermal resistance network ATS determined that the optimal number of fins was 10. (ATS)

Convection Cooling Design

The above conduction cooling design provided only part of the solution. There were additional needs to maintain the temperature at the top of the samples and to decrease the relative humidity of the cool air from the ambient air in the lab. ATS engineers designed a convection cooling system to fulfill these requirements.

A heat exchanger was installed with its fins in the dry ice/alcohol slurry and its other side extending into a duct to cool the air passing over it. This approach uses the same cooling medium for both convection and conduction to ensure there is no temperature differential throughout the sample and that the sample is as isothermal as possible.

Air is pushed by a counter-rotating fan through the duct and into the heat exchanger. The heat exchanger forms a thermal link between this air and the slurry mixture. The heat exchanger was designed with an optimum balance between its surface area and the resulting pressure drop to ensure the fan was operating with the most effectiveness.

Once the air passes the heat exchanger, it moves through the ducts and into a diffuser at the top of the system. The diffuser disperses the air over the sample creating a barrier between the tissue and the ambient environment of the lab so outside moisture and heat are not transferred in.

The ATS engineers tested this design using an array of thermocouples and ATS hotwire anemometer Candlestick Sensors connected to an ATS ATVS-2020, a temperature and air velocity scanner. They determined there was too much mixing between the air flowing over the samples and ambient air. The diffuser was redesigned with a new connection to the duct and an optimized outlet radius (see Figure 4).

In the ducts, a molecular sieve desiccant housed in a honeycomb structure was used to reduce the dew point of the air to -84.4°C, which was well below the -72°C air temperature in the duct.

Figure 4. Initial testing led to a redesign of the air diffuser to prevent ambient humidity from mixing with the air over the tissue samples. (ATS)

Figure 4. Initial testing led to a redesign of the air diffuser to prevent ambient humidity from mixing with the air over the tissue samples. (ATS)

Conclusions

ATS engineers performed a final series of tests of the Frozen Tissue Microarrayer System using Candlestick Sensors, thermocouples and the ATVS 2020 scanner. The tissue temperature stayed constant over the required six-hour period and well below the -70°C threshold. In fact, testing determined that the tissue temperature remained below the threshold for nearly eight hours before warming above a usable temperature (Figure 5). The multi-part cooling system was a success, meeting the original design objectives provided by Harvard Medical School.

Figure 5. Final testing showed that the ATS cooling design kept tissue temperature (shown in blue in the graph above) below the -70°C threshold for more than the required six hours. (ATS)

Figure 5. Final testing showed that the ATS cooling design kept tissue temperature (shown in blue in the graph above) below the -70°C threshold for more than the required six hours. (ATS)

The process of designing cooling solutions for the Frozen Tissue Microarrayer demonstrated that thermal design practices used throughout electronics cooling can be applied in the medical device industry. Fin efficiency, thermal resistance, and pressure drop calculations are standard regardless of the application. Thermal solutions should be considered early in the design process so they can be incorporated into the overall system as efficiently as possible.

The experts at ATS used traditional thermal calculations, CFD simulations, empirical testing, and its leading-edge heat sink technology to successfully design the thermal solution for this medical equipment application. The ATS design allowed Harvard Medical School to test tissue samples while meeting its strict requirements.

To learn more about the design, watch the video below:

Download a PDF of this case study at http://www.qats.com/cms/wp-content/uploads/Harvard-Medical-case-study.pdf.

Visit www.qats.com, call 781-769-2800 or email ats-hq@qats.com to learn more about ATS and its Thermal Management Analysis and Design Services.

What Cost Reduction Strategies Make New Product Introductions Faster?

Getting to markets faster and in the most cost-effective way is the primary goal of today’s product development process. Choosing a thermal design engineering partner that understands that goal makes a company’s product realization process simpler and faster. There are number of strategies a company’s project engineers can use to save time and money in the design of an electronics cooling solution. Two of the most efficient methods are Virtual Engineering Demos (VED) and Thermal Load Boards (TLB).

VEDs make it possible for project engineers to remotely see an instrument, how it operates, ask questions about how it works, and, if the project is included in the demo, get data in real time about a design. In this method, a live demo is setup at a thermal design engineering partner’s laboratory. Whether the project is a PCB, a system, or another product type, it can be included in the VED and be run through the lab set-up.

Greg Wong

ATS engineer Greg Wong gives a live, online demonstration from the ATS research lab to a potential customer. (John O’Day/Advanced Thermal Solutions, Inc.)

Candlestick Sensor

ATS engineer Greg Wong sets up to demonstrate the ATVS-2020, Candlestick Sensors and StageVIEW Data Acquisition Software (DAQ) for measuring and analyzing temperature for an electronics board in this VED. (Advanced Thermal Solutions, Inc.)

VED in Lab

Equipment setup and live camera feeds are all part of a VED setup. (Advanced Thermal Solutions, Inc.)

As the project is analyzed, data is shown on the engineering partner’s computer screen, which is in turn broadcast in real time to the project engineers via a live video feed. The video feed simultaneously shows the demo and the software’s operation, while allowing bi-directional conversation between the engineering partner and the project engineers in one or more locations.

stageVIEW_software

Screenshot showing data being recorded in stageVIEW. This information is available to the remote team. (Advanced Thermal Solutions, Inc.)

The advantages of this strategy to project engineers are:

• Quick evaluation of a design to determine if there is a need for new equipment in a project.
• No lag time in talking with a thermal design engineering partner about how to approach the thermal measurement of project
• Reducing the need to travel to a thermal design engineering partner’s lab.
• Faster response on lab testing, shortening the design cycle.

A Thermal Load Board (TLB) is another strategy for reducing the cost of a design, while getting a product to market faster. TLBs are created by a thermal engineering partner using a simple one- or two- layer non-populated PCB, heat sinks, thermally equivalent mock semiconductors and other mock components created with a 3-D printer.

TLB 3-D printing

Using these components a populated board is created that allows the testing of the heat sinks chosen for the project work and measurement of the airflow over the components and through the board. (Advanced Thermal Solutions, Inc.)

The thermal engineering partner is effectively creating a mock version of the functional board. The design of the TLB is based on the size and placement of the semiconductors and other components on the actual board, which is provided by the project engineers, and provides a cheaper and quicker means of producing a prototype for testing. The data from that testing will in turn expedite the design process and time to market.

This can be a very cost-effective method for doing heat sink characterization for the following reasons:

It reduces electronic system development cost.
o A system developer can focus on thermal issues very quickly instead of waiting for an expensive prototype to come out of the factory.
o Rather than using a potentially expensive project, testing on prototypes can determine design flaws without requiring a significant
cost.
o Because prototypes are less expensive, each iteration of a design can quickly go through an initial series of tests.
It reduces time to market.
o Valuable resources can be applied to engineering the best solution because a load board can generally be created in 1-2 weeks and at a
fraction of the cost of a full PCB.
It allows a physical testing very early in the design.
o Many times components on a PCB will obstruct air flow, requiring either costly design changes during NPI (new product introduction) or
requiring engineers to over-design a board and the thermal management solution, putting the product outside its cost objective.

After a thermal load board is created, the board is ready to be used:

Completed Load Board

A completed load board ready for testing. (Advanced Thermal Solutions, Inc.)

The heaters on the board can be powered up to dissipate the same level of power as the semiconductors they are meant to represent. Heat sinks can then be applied based on initial analysis done via integral modeling, mathematical modeling or through CFD (computational fluid dynamics). To test just air flow, heat sinks can even be created by 3-D printing.

Once populated with heat sinks, the board can be tested in a wind tunnel to see if the air flow will be sufficient. Wind tunnel testing methods include smoke flow visualization or water tunnel testing in order to examine air flow and ensure the most functional and cost-effective design is applied.

Getting to market faster and with the best possible design is very important in today’s product development process. Working with a thermal engineering partner, such as Advanced Thermal Solutions, Inc. (ATS), that offers Virtual Engineering Demos (VED) and Thermal Load Boards (TLB) will benefit a project’s bottom line and ensure a project’s successful completion. Project engineers will know that their design has proper thermal management early in the process, meaning that they will not have to over-design the project, which will save time and money in the long run.

Learn more about ATS and its capabilities as a thermal engineering partner for your next project by visiting www.qats.com or by calling 781-769-2800.

References:

Thermal Load Board Design Considerations


http://www.3dsystems.com/learning-center/case-studies/lowering-cost-and-reducing-production-time-projet-3d-printing-lets

Integral Modeling Is First Step for ATS Engineers

Integral Modeling

ATS engineers utilize integral or analytical modeling as a first step to solving thermal management issues in a design. [Advanced Thermal Solutions, Inc.]

In July, Future Facilities, a CAD software company, released the results of a survey it conducted of more than 350 electrical engineers (the link to the story is below) on how thermal management relates to reliability in electronics design. The survey coincided with the release of the company’s newest version of its thermal simulation software 6SigmaET.

Forty percent of the surveyed engineers believed thermal simulations for their projects to be too time-consuming or complex. Sixty-two percent of the engineers said that they would rather over-design a project than optimize thermal performance in the design process. In fact, 33 percent of the engineers called thermal issues an “irritation” and would prefer to not deal with them.

Tom Gregory, Product Manager at 6SigmaET, concluded, “It’s clear that a lot of engineers still don’t feel comfortable creating thermal simulations of their designs, a fact which is not being helped by the complex nature of most thermal simulation tools currently on the market.”

The engineers at Advanced Thermal Solutions, Inc. (ATS), a leading-edge engineering and manufacturing company focused on the thermal management of electronics, have long demonstrated that thermal solutions are a critical component to electronics design and that incorporating thermal management early in the design process will lead to a more cost-effective and reliable product.

By incorporating thermal management into the design process engineers optimize time between failure for individual components as well as the overall system. They actually reduce the cost of the system by limiting the need to overdesign it. Well thought out thermal solutions increase the likelihood that the final design will succeed and meet the specifications that were set out at the beginning of the project.

The survey results pointed to CFD analysis as the jumping off point for thermal solutions. But an easier and more efficient way to start the process is with an integral or analytical model, using pencil and paper or a spreadsheet.  In its 3-Core Design Process, ATS has utilized integral modeling as its first step to quickly and easily provide first order solutions and determine whether a design will succeed in meeting its thermal requirements.

Integral modeling, as Dr. Kaveh Azar, founder, President, and CEO of ATS, explained in a webinar (the link is below), utilizes standard equations based on the basic laws that govern thermal engineering: Conservation of Mass, Conservation of Momentum, Conservation of Energy, and Equation of State (i.e. the Ideal Gas Law).

Determining pressure, temperature, and air velocity differentials throughout a system and plugging those numbers into equations that most engineers will remember from undergraduate and graduate training will define the problem that will be faced in designing the system.

Dr. Azar said, “When I focus on integral modeling as I go through the process, you’ll see how easy it is and how broad-spectrumed the applications of these are and this is going to form the first foundation for any kind of analysis that we do in electronics cooling.”

Integral modeling is applicable to any domain and will give a substantiated, independent model to ensure the system is built within the proper parameters. Taking this early step saves time and money that may have been wasted on designing a system that ultimately would not work. Integral modeling also establishes parameters under which the system can be built to save costs after deployment.

Dr. Azar explained, “If we design it for the worst case scenario, we always have the adequate margins and as a result have lesser cost of deployment.”

It is a competitive market. Integral modeling is a quick first step to ensure thermal solutions are part of a design to save on component and system costs. A few quick calculations will have a major impact on the project’s bottom line.

The survey results from Future Facilities can be found at http://www.thermalnews.com/main/news/40-percent-of-electronics-engineers-find-thermal-simulation-too-complex-and-time-consuming.

For more information about the importance of integral modeling and practical applications, watch the webinar with Dr. Kaveh Azar of Advanced Thermal Solutions, Inc. below:

Does the process of thermal design for your next project seem daunting?  Contact us.  ATS offers a  free four-hour consultation in its lab.  Email ATS at ats-hq@qats.com.

An Expert Speaks Out on CFD Modeling of Heat Sinks

Chris Aldham of Future Facilities has something to say about CFD modeling of heat sinks. And he should know after 30 years in the business. Chris will present a webinar for ATS on May 24, 2012 “CFD as a Tool to Perform Heat Sink and System Modeling,” that you can attend for free by registering on Qats.com.

https://www2.gotomeeting.com/register/467986842

We asked Chris to share upfront some general knowledge and opinions on the topic ….

What are some of the recent advances in CFD technology and how might they improve heat sink modeling?

The main advance I’ve seen is the increase in computer power and lowering of computer cost that has occurred over the past few years. It is now possible to solve larger (more grid cells) and more detailed (more objects and better geometrical representation) models and more of them very efficiently. So now representing the detailed geometry heat sinks in a CFD model is easy. Importing MCAD heat sink geometry and using that geometry directly in the software ensures an accurate representation of the heat sink.

The other advance is the automation possible in specialized tools such as 6SigmaET. The mesh necessary to represent the heat sink is determined automatically within the software it doesn’t rely on the user creating a good mesh.

These two trends seem set to continue so it will be possible to model increasingly complicated heat sink designs.

Meshing is very core to CFD modeling. What are the do’s and dont’s when it comes to meshing heat sink models?

I think there are two aspects to consider when meshing a heat sink. The solid geometry must be accurately captured to ensure the heat spreading and conduction through the base and up the fins is accurately represented. Then the airflow between the fins must be accurately captured. This invariably requires a fine mesh at least 3 cells between the fins and maybe more depending on the gap size.

What are some of the benefits from developing a high quality CFD model of a heat sink?

At first sight heat sinks seem quite simple in function but their interaction with the components they are cooling and the air flow around them is quite complex. The heat spreading of the heat sink base can subtly change the thermal resistance of the component. The increase in surface area the heat sink provides improves heat transfer but also represents an increased resistance (increased pressure drop) to the airflow. So a good heat sink design must balance heat spreading, heat transfer and pressure drop. As a detailed CFD model can represent all these aspects accurately in the situation in which it will be used it can be the only way to optimize them before the heat sink is manufactured and tested.

Can you cite any examples where your CFD tools led to improved heat sinks solutions?

We have published a couple of examples together with ATS Europe who have used 6SigmaET in a number of projects. One was an unusual heat sink design on an LED replacement for a traditional light bulb where a 14% improvement in lamp performance was produced (as well as a much nicer looking design in my opinion) by changing the heat sink design. This work also showed good agreement between 6SigmaET simulations and measurements performed on the real devices. See images below.

How long does it take a typical engineer to master CFD modeling? Are there any innovations in training?

I’ve been doing CFD for over 30years and I’m not sure I’ve mastered it yet. Fortunately engineers do not have master CFD modeling today as some CFD software products are focused on specific applications and these can really present CFD in a very usable form. Of course it helps if the engineers have some idea of the physics of fluid flow and heat transfer but much of the numerical work in CFD can be preset, automated and hidden away. This has been especially true in the field of electronics cooling where specialized software has been around for decades. These tools can be learned in a few days and users can be proficient in a few weeks.

How is Future Facilities different from its competitors?

Future Facilities is highly focused on a small number of related application areas. We produce software for design, operation and management of data centers which includes CFD modeling of the airflow and temperatures as well as other non-CFD analysis modules. We also use the software in our engineering consultancy group providing services that ensure the software development is focused on exactly what is needed and making it easy and efficient.

6SigmaET is a recent product focused on electronics cooling and integrated into our data center suite. Like the whole software suite it presents the user with a set of specialized intelligent objects which represent the real things encountered in electronics (pcbs, fans, heat sinks, power supply, components, etc.). As every object knows what it is, it knows how to behave and this can make creating a model very intuitive for the users. It also allows us to automate the meshing rules for each object so we can ensure a heat sink, for example, is meshed correctly.

I believe the many years of experience we have in using and developing CFD products alongside a strong focus on particular application areas and a desire to make complex technology available to engineers (expert and beginner, full-time or occasional users) makes us very different from other CFD companies.

Dr. Chris Aldham has worked in computational fluid dynamics (CFD) for over 30 years (starting with PHOENICS at CHAM with Prof. Brian Spalding) and for more than 20 years in the field of electronics cooling. After 16 years at Flomerics, Chris joined Future Facilities as a Product Manager responsible for 6SigmaET electronics cooling simulation software which is part of a suite of integrated software products that tackle head-on the challenges of data center lifecycle engineering (including equipment design analysis) through the Virtual Facility