Category Archives: Qpedia Thermal eMagazine

New Qpedia Thermal eMagazine Now Available for Download

Posted on December 9, 2013 by | 4 comments

Qpedia Thermal eMagazine, Volume 7, Issue 10, has just been released and can be downloaded at: http://www.qats.com/Qpedia-Thermal-eMagazine/Back-Issues

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Featured articles this month include:

The Impact of Orientation on a Heat Pipe’s Performance with Different Wick Structures

This article presents a review of experimental results obtained with heat pipes, in the shape of round cross sections, in different orientations. The results of the experimental study are very useful, showing how thermal performance can be dependent upon factors such as inclination angle, heat input and operating temperature. The findings are then compared with data published in the literature.

The Performance of a Heat Sink with Piezoelectric Fins

Some engineers have introduced piezoelectric fans and synthetic air jets into LED light cooling to enhance the convection heat transfer. Other researchers have proposed the use of heat sinks with piezoelectric fins. This paper discusses this novel concept of cooling LED heat sinks. This article shares experimental studies on the performance of piezoelectric fins with different fin heights, widths and pitches, and under different vibrating modes.

Industry Developments: Diamond-Based Thermal Management Systems

Adopting CVD diamond as a heat spreader for the semiconductor industry is still in its early stages. Demand for superior thermal management solutions for opto-electronics, power and RF devices will drive a broader adoption of this engineering material. When combined with the growth rates of these markets, the increased use of diamond should drive significant investments in synthetic diamond manufacturing capacity. These should in turn promote economies of scale which will enable diamond to operate in segments of the semiconductor market it previously could not compete in.

Technology Review: Techniques for Measuring the Thermal Performance of Heat Pipes, 2006 to 2012

In this issue our spotlight is on techniques for measuring the thermal performance of heat pipes. There is much discussion about this subject in the electronics industry, and these patents show some of the salient features that are the focus of different inventors.

Cooling News – Product News

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Not a Qpedia subscriber? Subscribe Now for free at: http://www.qats.com/Qpedia-Thermal-eMagazine/Subscribe-to-Qpedia and see why over 18,000 engineers read Qpedia.

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Qpedia, Official Media Sponsor of coolingZONE-13, Offers 30% Discount on Esteemed Book Series

Posted on September 16, 2013 by | Leave a comment

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Qpedia, the official media sponsor of coolingZONE-13, has just announced a special promotion offering a 30% discount on the widely read Qpedia Book Series. The promotion will take place at coolingZONE-13, the Thermal Management Industry International Summit in Boston, Massachusetts, October 21st -23rd, 2013. Additionally, the books will be available to purchase through coolingZONE’s online bookstore , with a 25% discount, until the conference ends on October 23. These books provide an expert resource for engineering professionals, students, educators and others who want to learn the latest theories and applications in the electronics cooling field.

The Qpedia Book series is a four volume set of highly technical articles, written and published by Advanced Thermal Solutions, Inc. The authors include Dr. Kaveh Azar, the company’s president and CEO; and Dr. Bahman Tavassoli, its chief technologist. Both Drs. Azar and Tavassoli are internationally recognized experts in the field of thermal management.

The four volume set contains over 250 in-depth articles filled with technical information, fundamental calculations and thoughtful analysis, printed in rich color in a hardbound book. They discuss the most critical areas of electronics cooling, covering a wide spectrum of topics in the telecom, aerospace and defense, embedded computing, medial, automotive, and semiconductor industries.

The articles, inspired by real-life scenarios, solve the thermal management challenges that today’s engineer is faced with. Drawn from personal experience, the veteran authors pass on knowledgeable examples of problem solving techniques that can be applied by all thermal and mechanical engineers. To order the complete book set, or individual volumes, please visit www.coolingzone.com/cart.

coolingZONE-13, the Thermal Management Industry International Summit, is a leading conference for all technical professionals in thermal management, electronics cooling, heat transfer and energy transport fields. The conference gathers recognized experts and technology companies in thermal management, providing solutions for the thermal engineering challenges of the future. Dr. Kaveh Azar, CEO of Advanced Thermal Solutions and Qpedia’s Editor-in-Chief, will be opening the conference with a keynote address on “The State of the Art in Thermal Management – From Vacuum Tubes to Super Computers”. Other keynote addresses include “Redefining Engineering as a Profession of Innovation” by Dr. Vincent Manno of Olin College and “Galinstan-Based Cooling of Microelectronics: Beyond Tuckerman and Pease?” by Dr. Marc Hodes of Tufts University. To learn more about coolingZONE-13, and to register for the conference, please visit: www.coolingzone.com

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Download the New Issue of Qpedia

Posted on September 5, 2013 by | Leave a comment

Qpedia_jul13_coverQpedia Thermal eMagazine, Volume 7, Issue 7, has just been released and can be downloaded at: http://www.qats.com/Qpedia-Thermal-eMagazine/Back-Issues.

This month’s featured articles include:

Thermal Performance of Heat Sinks with Heat Pipes or Vapor Chambers for Servers

Most blade servers for data and telecommunication systems use air to cool the high power chips inside. As the power level of these chips keeps increasing, the pressure is on thermal engineers to design ever higher performance air-cooled heat sinks. In recent years, advancements in manufacturing of thinner heat pipes and vapor chambers have enabled engineers to integrate the heat pipes and vapor chambers into blade server heat sinks. To illustrate their advantages, this paper includes a comparison of five different heat sinks either with embedded heat pipes or vapor chambers for their servers, all of which outperform copper heat sinks.

 

Designing Efficient Fans for Electronics Cooling Applications

In modern day equipment racks, the power consumed by the cooling fans represents a significant percentage of the overall system power budget. With the advent of data centers and their large energy costs, the issue of cooling power is exacerbated. It is, therefore, becoming crucial to design and implement methods for reducing data centers’ power consumption. This article presents a review of methods available for reducing energy consumption through increasing fan efficiency. Three main ways of improvement by optimization will be discussed: motor and electronic driver optimization, fan aerodynamic optimization and surrounding inlet/outlet equipment optimization.

 

Industry Developments: EV Battery Thermal Management

As electric vehicles and hybrid electric vehicles become more sophisticated, demands are growing for greater battery efficiency and life, and longer driving range. Achieving this must include improvements in thermal management. For car enthusiasts, this article offers some interesting battery technologies and perhaps some guidance on which models to consider for the future.

 

Technology Review: Fan Heat Sinks, 2007 – 2012

In this issue our spotlight is on fan heat sinks. There is much discussion about their deployment in the electronics industry, and these patents show some of the salient features that are the focus of different inventors.

 

& Cooling News featuring the latest product releases and buzz from around the electronics cooling industry.

 

EXCLUSIVE OFFER! Look inside for a discount code for coolingZONE-13, which will be held October 21-23, 2013 in Boston. Qpedia, coolingZONE’s official media sponsor is matching coolingZONE’s 15% discount with another 15% – saving you 30% off the registration price for the thermal management industry event of the year. Don’t miss out on this exclusive offer to Qpedia subscribers.

Download the issue now.

 

Not a Qpedia subscriber? Subscribe Now for free at: http://www.qats.com/Qpedia-Thermal-eMagazine/Subscribe-to-Qpedia and see why over 18,000 engineers read Qpedia.

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Latest Qpedia Now Available for Download

Posted on August 14, 2013 by | Leave a comment
Qpedia Thermal eMagazine June 2013

Qpedia Thermal eMagazine June 2013

Qpedia Thermal eMagazine, Volume 7, Issue 6, has just been released and can be downloaded at: http://www.qats.com/Qpedia-Thermal-eMagazine/Back-Issues.

This month’s featured articles include:

Enhancing Heat Sink Performance Using Thermoelectric Coolers

With the increase in the power dissipation of components and the parallel reduction of their size, engineers and researchers across the globe have been predicting that the era of air cooling might come to an end. Even though in some applications, with very high power dissipations such as IGBTs, air cooling may not be adequate and liquid cooling is a must; air cooling will continue to be the first choice for most electronic cooling applications for many years to come. Advances in air cooling continue to extend its use and the implementation of thermoelectric coolers (TECs) in heat sink applications is one such effort.

Immersion Liquid Cooling for Servers in Data Centers

Data center designers and operators have invented many ways to improve the data center’s thermal efficiency, such as optimizing the rack layout and air conditioner location, separating cold aisles and hot aisles, optimizing the configuration of pipes and cables in under-floor plenum, introducing liquid cooling to high-power severs. While the above methods can improve the data center heat load management, they cannot dramatically reduce the Power Usage Effectiveness (PUE). This article reviews two relatively new solutions: active single-phase immersion cooling technology proposed by Green Revolution Cooling (GRC) and a passive two-phase immersion cooling technology proposed by the 3M Company.

Industry Developments: Piezoelectric Cooling

Piezoelectric fans and jets must overcome various materials, thermal and mechanical challenges to become widely used in electronics cooling, but because they consume just 1/150 of the electricity of circular fans, run with little noise and have no parts that will wear out, they remain of great interest. In this article, a number of issues are addressed, including the inverse effect of the piezoelectric phenomena and dual piezoelectric cooling jets.

Technology Review: Innovative Cold Plate Designs, 2007 – 2012

In this issue our spotlight is on innovative cold plate designs. There is much discussion about its deployment in the electronics industry, and these patents show some of the salient features that are the focus of different inventors.

& Cooling News featuring the latest product releases and buzz from around the electronics cooling industry.

Download the issue now.

Not a Qpedia subscriber? Subscribe Now for free at: http://www.qats.com/Qpedia-Thermal-eMagazine/Subscribe-to-Qpedia and see why over 18,000 engineers read Qpedia.

Did you know Qpedia also publishes a book series? The five volume set contains 248 in-depth articles, researched and written by veteran engineers. They address the most critical areas of electronics cooling, with a wide spectrum of topics and thorough technical explanation. Order Now.

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Qpedia is Hot of the Press

Posted on July 30, 2013 by | Leave a comment

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Qpedia Thermal eMagazine, Volume 7, Issue 5, has just been released and can be downloaded at: http://www.qats.com/Qpedia-Thermal-eMagazine/Back-Issues.

Featured articles in this issue include:

Next Generation Processor Cooling and Power Trends

CMOS semiconductor technology has been faithfully following Moore’s Law for several decades now. This Law states that the number of transistors per unit area doubles about every year [1]. This trend is likely to continue in the foreseable future. In addition, two other technical trends will accompany the roadmap of future processors: manycore chip multiprocessors and 3D integration. This article presents a review of recent predictions for future 2D and 3D manycore processors architectures.

Thermal Performance of Thin Flat Heat Pipes

As the demands for faster, smaller and multifunctional mobile devices, such as cell phones, PDAs, and netbooks, keep increasing, both system and electronic engineers are trying to integrate more functional models into smaller and thinner devices. This has forced thermal engineers into looking for more innovative and effective passive methods to cool semiconductor devices with their increasing power density. Thin flat heat pipes, whose thickness is less than 1.5 mm, have found more applications on mobile devices and certainly drawn more attention from researchers.

Industry Developments: Smartphone Cooling Systems

With increasingly processor-intensive apps being used on mobile devices, the steadily powerful chipsets in smartphones are running hotter than ever. Many desktop computers and larger, powerful computing systems use water cooling to keep their CPUs from overheating. Now smaller versions of these cooling systems are being employed in warm smart phones. While NEC was the first major smartphone company to launch a liquid-embedded smartphone, other manufacturers, such as Apple, Samsung Electronics and HTC are likely to soon follow in 2013.

Technology Review: Air Delivery Systems Utilizing Piezofan or Standard Fans

In this issue our spotlight is on air delivery systems using piezo and standard fans. There is much discussion about this and these patents show some of the salient features that are the focus of different inventors.

Cooling News featuring the latest product releases and buzz from around the electronics cooling industry.

Download the issue now.

Not a Qpedia subscriber? Subscribe Now for free at: http://www.qats.com/Qpedia-Thermal-eMagazine/Subscribe-to-Qpedia and see why over 18,000 engineers read Qpedia.

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