Category Archives: Qpedia Thermal eMagazine

The New Qpedia Thermal eMagazine is Out

Posted on June 26, 2013 by | Leave a comment

Qpedia Thermal eMagazine, Volume 7, Issue 4, has just been released and can be downloaded at: http://www.qats.com/Qpedia-Thermal-eMagazine/Back-Issues.

Featured articles in this issue include:

Dropwise Condensation in Vapor Chambers
Considerable attention has been devoted in the past to the evaporation process taking place in a vapor chamber. However, increased heat fluxes at the condensation end have prompted efforts to improve the condensation performance of the vapor chambers. This article presents a review of a novel method for improving the thermal performance of a vapor chamber condensing section by using special surfaces promoting dropwise condensation.

 

Heat Sink Manufacturing Using Metal Injection Molding

Using Metal Injection Molding It is only in the last few years that metal injection molding (MIM) has gained a foothold in the thermal community and its salient advantages have become more evident. The MIM process allows intricate features to be added into the heat sink design to boost thermal performance and its production process is very scalable compared with machining. Injection molding enables complex parts to be formed as easily as simple geometries, thereby allowing increased design freedom.  This article explore the merits of copper material in the MIM process.

 

Industry Developments: Thermoelectric Modules and Coolers

Thermoelectric modules (TEMs) are rugged, reliable and quiet devices that serve as heat pumps. The real heat-moving components inside TEMs are thermoelectric coolers or TECs. These are solid-state heat pumps and are designed for applications where temperature stabilization, temperature cycling, or cooling below ambient, are required. Today, TEMs are used in electro-optics applications, such as the cooling and stabilizing of laser diodes, IR detectors, cameras (charge coupled device), microprocessors, blood analyzers and optical switches. This article explores some of the latest developments in these devices.

 

Technology Review: Reducing Thermal Spreading Resistance in Heat Sinks

In this issue our spotlight is on reducing spreading resistance in heat sinks. There is much discussion about how this phenomenon can be achieved, and these patents show some of the salient features that are the focus of different inventors.

 

Cooling News featuring the latest product releases and buzz from around the electronics cooling industry.

 

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New Qpedia Thermal eMagazine Released

Posted on June 13, 2013 by | Leave a comment

Qpedia Thermal eMagazine, Volume 7, Issue 3, has just been released and can be downloaded at: http://www.qats.com/Qpedia-Thermal-eMagazine/Back-Issues. Qpedia Thermal eMagazine March 2013Featured articles in this month’s issue include:

CFD Analysis of Synthetic Jets

In recent years, the synthetic jet has been studied widely and its characteristics have been compared to a continuous jet. The primary advantage of the synthetic jet is that it has no net mass flux, which eliminates the need for plumbing, and results in unique heat transfer effects on an impacting surface, not possible with steady or pulsed suction or blowing. However, the modeling of the formation and flow of a synthetic jet and heat transfer on an impinging surface present the greatest challenge for rapidly and accurately predicting performance of synthetic jet, and this subject is the focus of this article.

 

Cooling Solutions for 3D Stacked Chips

3D stacking of ICs has emerged as an extremely promising technology able to address the performance requirements of tomorrows high speed computing. This novel technology enables integration of logic, memory, RF and optoelectronic devices in a single chip [1]. Its advantages consist in reduced communication delays between functional modules, shorter interconnect lengths and reduced chip footprint and power dissipation. Nevertheless, even though it looks to be a very promising cooling approach, interlayer cooling using fluids should be regarded cautiously. Unless the heat flux to be removed is extremely high, alternative cheaper and safer methods should be used.

 

Industry Developments: Heat Sinks

Many types of electronics components have been engineered out over time, but not heat sinks. While devices continue to get smaller, faster and congested, managing heat is an ongoing necessity. Heat sinks continue to be the primary cooling solution in the electronics industry, and often the distinct solution in thousands of other applications. Heat sink designs have evolved, of course. Research and development continues, and some emerging heat sinks are now or soon-to-be available that offer new benefits for thermal engineers.

 

Technology Review: Manufacturing Heat Pipes, 1991 to 2008

In this issue our spotlight is on manufacturing heat pipes. There is much discussion about its deployment in the electronics industry, and these patents show some of the salient features that are the focus of different inventors.

 

Cooling News featuring the latest product releases and buzz from around the electronics cooling industry.

 

Download the issue now.

 

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Latest Qpedia Issue Marks New Milestone

Posted on February 25, 2013 by | Leave a comment

Qpedia Thermal eMagazine | Volume 6 | Issue 12The latest Qpedia Thermal eMagazine has just been released and can be downloaded at: http://www.qats.com/Qpedia-Thermal-eMagazine/Back-Issues.

This month’s featured articles are:

Pin-Fin Heat Sink Performance Under Air Jet Impingement

This paper summarizes the research on pin fin heat sinks under single confined jets, conducted by El-Sheikh and Garimella, and the study of pin fin heat sinks under single free jets, completed by Issa and Ortega Their experimental tests shows that the thermal performance of pin fin heat sinks behave similarly under some circumstances and act differently under some other configurations for confined jet impingement and free jet impingement. For engineers, this has implications for their use of jet impingement as a cooling method.

The Challenges of TIM Selection in Today’s Demanding Electronics Cooling Environment

With ever hotter running devices, users often rely quite heavily on thermal interface material (TIM) to provide an added factor in obtaining the margins that they require to meet product qualification. Thus, TIM continues to play a critical role in todays electronics environment, proving a viable heat conductive medium between the silicon heat source and the heat dissipating device, and serving to decrease the thermal resistance between chip and heat sink. This paper explores some of the test approaches undertaken by researchers with regard to TIM and why users must be particularly careful in selecting TIM.

Industry Developments: Cooling Automotive Electronic Control Units

As the numbers of ECUs increase, so do their design differences and the complexity of their software. And, as more operators and passengers rely on ECUs for a better driving experience, designers and OEMs must ensure that their performance lives up to expectations. In this piece, the writer explores the various thermal challenges facing ECUs.

Technology Review: Cold Plates 2010 to 2012

Qpedia continues its review of technologies developed for electronics cooling applications. We are presenting selected patents that were awarded to developers around the world to address cooling challenges. After reading the series, you will be more aware of both the historic developments and the latest breakthroughs in both product design and applications.

This release marks the final issue of Volume 6. Qpedia has now published 72 issues and 288 articles in 6 volumes and hardbound book sets. Thank you to the editors and guest contributors who have spent countless hours researching, writing, and sharing their technical expertise with the engineering community. We are proud to be the only monthly publication dedicated to the thermal management of electronics.

Want to be a Qpedia guest editor? Submit a study, white paper, patent release, or technical article at www.qats.com.

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New Qpedia Thermal eMagazine Published!

Posted on January 28, 2013 by | Leave a comment

Qpedia Thermal eMagazine, Volume 6, Issue 11, has just been released and can be downloaded at: http://www.qats.com/Qpedia-Thermal-eMagazine/Back-Issues. Featured articles in this month’s issue include:

Honeycomb Heat Sinks for LEDs

LEDs, or light-emitting diodes, are a form of solid-state lighting. An LED light is often made of a small piece of semiconductor, an integrated optical lens used to shape its radiation pattern, and a heat sink, used to dissipate heat and maintain the semiconductor at low operating temperature. LED lights present many advantages over incandescent light sources, including lower energy consumption, longer lifetime, improved physical robustness, smaller size and faster switching. This article examines Ma et al’s  findings with respect to the honeycomb heat sink design employed in LEDs, which has proven to be highly efficient.

Characteristics of Thermosyphons in Thermal Management

With the increase of heat fluxes and shrinking chip sizes in electronics applications, there is a need to spread the heat from the small chip to the larger heat sink or to transport the heat to a location where there is ample space to remove the heat. Heat pipes, vapor chambers and thermosyphons have been introduced to undertake this task and, in this article, we focus on some aspects of the design of thermosyphons. The advantage of thermosyphons is that they have no capillary limit and can transport large amounts of heat over long distances.

Industry Developments: Heat Pipes Providing High Performance

Heat pipes are increasing in type and use for the benefits they provide. Because of their lower total thermal resistance, heat pipes transfer heat more efficiently and evenly than solid aluminum or copper. Heat pipes contain a small quantity of working fluid (e.g. water, acetone, nitrogen, methanol, ammonia). Learn the conclusions of a recent study that focused on the best working fluid and another study of heat pipes in outer space.

Technology Review: Cold Plates, 2010 to 2012

Qpedia continues its review of technologies developed for electronics cooling applications. We are presenting selected patents that were awarded to developers around the world to address cooling challenges. After reading the series, you will be more aware of both the historic developments and the latest breakthroughs in both product design and applications.

Cooling News featuring the latest product releases and buzz from around the electronics cooling industry.

Download the issue now.

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Monthly Qpedia Issue Just Released!

Posted on December 26, 2012 by | Leave a comment

Qpedia_oct_coverThe October issue of Qpedia Thermal eMagazine has just been released and can be downloaded at: http://www.qats.com/Qpedia-Thermal-eMagazine/Back-Issues. Hot articles this month include:

Basic Finite Volume Concepts in CFD

Computational Fluid Dynamics (CFD) has become an essential tool in modern engineering analysis and thermal management, leading to faster solutions and an increase in productivity. It is also a very rich field that has benefitted from decades of work to improve its accuracy and speed. In this article, the author offers a high level overview of a special kind of numerical scheme in CFD. The intent is to familiarize readers with the very basics of CFD, so hopefully they can have a better appreciation of what is behind the commercial codes.

Micropumps – For Tomorrow’s Portable Electronics

Electronic devices such as tablets and ultrabooks have become more and more compact while maintaining high computing performance, and this has driven demand for innovative thermal management strategies. Active liquid cooling systems need be considered, even in these portable applications. These systems demand small pumps, often referred to as micropumps, which deliver the necessary pressure and flow with high reliability. This paper explores several common approaches to building micropumps.

Industry Developments: Thermoelectric Peltier Cooling

A Peltier cooler, heater or thermoelectric heat pump is a solid-state device which  transfers heat from one side to the other, with consumption of electrical energy, depending on the direction of the current. It can also be used as a temperature controller that either heats or cools. In this article, the writer provides an overview of thermo-electric cooling construction, component cooling, enclosure cooling and TEC Specs from IEC.

Heat Transfer Devices That Use Liquid As a Coolant, 2007 to 2009

Qpedia continues its review of technologies developed for electronics cooling applications. We are presenting selected patents that were awarded to developers around the world to address cooling challenges. After reading the series, you will be more aware of both the historic developments and the latest breakthroughs in both product design and applications.

 

Download the issue now.

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