Category Archives: thermal management

In PCB Design for filled vias, should you use conductive or non-conductive thermal epoxy?

PCB Solutions, a provider of high quality circuit boards, has a great post on if conductive or non-conductive thermal epoxy should be used for PCB’s needing filled vias.   We’ve expounded on the benefits of including your PCB design and layout as part of your overall thermal management approach here at our blog.  It’s important to do so as including thermal management into those designs might even remove the need for  you to have heatsinks at all.

We’d highly recommend reading PCB Solution’s post, “Conductive vs. Non-Conductive Via Fill“.

Aluminum heatsink design uses passive cooling for high end graphics but don’t forget about your chassis fan strategy

At ATS we’ve long been proponents of pushing the limits of thermal management using air. Why? No one wants truly wants to use liquid cooling in their computers be they workstations, servers, telecommunication servers or any other compute engines. Plumbing is something most engineers want to avoid. So our team applauded the release of Sapphire’s passive heatsink cooled graphics card, their HD5670.

The key thing to note on this card thermally is the unique geometry of the aluminum heatsink, aluminum heatpipe and fins. Thin and compressed to their graphics card, the PCI card’s silhouette requires only one X16 lane graphics slot. Sapphire doesn’t mention recommended air flow but they do suggest for best cooling performance, a chassis installed with at least one 120mm or 90mm fan is required.

Our team thought this design was well done, and a great application for passive heatsink cooling. Some thoughts we had included:

First, the required air flow amount and air flow velocity are key for a proper thermal management solution. These will be a function of what else you have in your chassis of course, CPU, memory, disk drives etc. A key critical point is do not block the air flow to known hot components and boards in your chassis. This is a common mistake we see at ATS be it computing or telecommunications. We’ve done a write up on how to choose a fan for your computer chassis on our blog, you can read it by visiting, “Five Basic Steps When Designing for a Cooling Fan Thermal Management”

Second, whether your fans are at the air inlet or outlet makes a difference and that needs to be considered. Always mount your cooling fans on the inlet side of your electronics chassis. This allows you to direct the highest velocity airflow to the areas of greatest need. In our example here, the Sapphire graphics card and your CPU (many thanks to Tony Koryban for his wisdom on fan placement)

With creative designs like Sapphires and the correct choice and placement of fans, air cooling continues to be an excellent choice for many thermal management problems. If you need help designing such a passive heatsink approach, drop some mail to us at [email protected]

New ATS Thermal Management White Paper: Understanding and Optimizing Thermal Via

Working with challenging design constraints is an ever present problem for board designers. Increasing bandwidths and high clock speeds require that devices be placed closely together for signal integrity. Efforts to avoid signal degradation can have an adverse effect on thermal performance, as high powered devices become more tightly coupled together. In the past, when the power density was significantly less, it was possible to cool devices with a standard PCB. But, as new design and components evolve, the need for high performance heat sinks is accompanied by the need for more intelligent PCB design. A better-designed PCB will enhance heat transfer from a device to ambient through the board. To maintain acceptable junction temperatures, along with reducing the junction-to-ambient resistance through the component case, it is often necessary to dissipate some of the device power through the board. A standard PCB is often designed with electrical performance in mind; however, using thermal vias to improve thermal performance should not be overlooked.  In our new white paper, our engineers discuss just how to do that.   Download your copy here: “Understanding and Optimizing Thermal Via” .

Thermal Management of High Power Components through Pool Boiling

Boiling and condensation are increasingly employed thermal management methods for high heat flux electronic devices. These heat transfer mechanisms are applied in thermosyphons, heat pipes, vapor chambers and two-phase minichannel and microchannel heat sinks. The fundamental physics behind these devices includes pool boiling, vapor condensation and convection heat transfer. Boiling and condensation processes are affected by device geometry, surface roughness, wall superheat, saturation pressure and fluid properties. Understanding the fundamentals of pool boiling and condensation, and the parameters that affect them, will improve the design of thermal management devices.   To learn more on this topic, ATS has published a white paper that readers can have for free by clicking to qats.com at this link, “Use of Pool Boiling to Thermally Manage High Power Components“

PICMG AdvancedMC architecture gives COTS System Designers Flexible Board Options but Thermal Management Challenges Exist

PICMG AdvancedMC (Advanced Mezzanine Card) standard gives COTS system designers tremendous flexibility to create custom systems. Designers can choose from a rich ecosystem of standard AdvancedMC boards or use the standard to design their own even.

As these modular systems grow in power due to faster computing and network switching rates needs, the thermal management challenges involving these advanced mezzanine cards are becoming more difficult. The enclosed and small form factors of these systems, coupled with the high power consumption of many designs, call for increased attention to their cooling methods. This includes the right choice of air cooled heat sink, fans, fan trays and board placement within a system.

While the PMC (PCI Mezzanine Card) is rated for only 7.5W of power, and the PrPMC (Processor PCI Mezzanine Card) is rated to 12W, a single-slot wide AMC card is specified to a 30W thermal envelope. The connector itself is standardized to 60W per modular unit, in anticipation of lower resistance thermal techniques in the future. The possibility for high power within a small form factor is apparent for AMC modular systems.

ATS’s white paper on meeting the challenges of cooling AdvancedMC’s will equip you to best meet these thermal management challenges for system design success. You can get your copy at this link at qats.com, “AdvancedMCs: Thermal Problems and Cooling Limitations“