Author Archives: akoss

Are Your Heat Sinks and Thermal Management Strategy for Your Target Seminconductors Optimized or Deadended?

By virtue of the fact that ATS is a provider of heat sinks and thermal management solutions to electronics, much of work is target at the junction temperature of semiconductors. We work with a lot of suppliers in this space, most recently Intel’s Sandybridge. Which leads me to the reason for addressing this topic.

Are Your Heat Sinks and Thermal Management Strategy for Your Target Seminconductors Optimized or Deadended?

Of all the semiconductor providers works with, ATS has done a great deal of work with Caviuim, TI and Freescale. It’s not that their processors are unusually hot, it’s that these firms recognize that ATS does a great job of optimizing a thermal design. Our case studies show a wide range of applications and successes in this optimization.

With Cavium, ATS is a thermal development partner. We’ve tackled a number of difficult designs with them and with Cavium customer’s whose design elements create very dense, high performance products but in some small and low air flow applications.

ATS has two off-the-shelf stocks solutions for Cavium that can be used as design starting points, The ATS-691-C2-R1 offers up a thermal resistance of .6 C/W at 200 LFM and the ATS-725-C1-R1 offers up a thermal resistance of 2 C/W at 200 LFM.

How ATS heat sinks helped two tier 1 telecommunications companies implement effective thermal management for their LTE and WiMAX equipment

Advanced Thermal Solutions, Inc (ATS), a leader in offering Innovations in Thermal Management, recently demonstrated that its maxiFLOW heat sink with superGRIP heat sink clip can cool semiconductor-dense and thermally-challenging LTE and WiMAX telecommunications network equipment. Two Tier 1 telecommunications equipment OEMs had faced significant thermal and mechanical challenges on their new designs.

Telecommunications

(Wikimedia Commons)

Deploying ATS thermal management technology allowed them both to ship their network equipment to customers in Japan and the United States, meeting schedules, and winning the confidence of their major customers, both wireless providers.

In example one, an ATS customer was faced with a real dilemma. Having used microTCA and other modular technologies to develop both their WiMAX and LTE telecommunications infrastructure equipment, they faced the challenge of dealing with high heat and restricted air flow in their system. After considering various options, they opted to test ATS’s solution.

The results were dramatic, reducing board temperature 15%. The temperature reduction made it possible for the systems to operate at the designed performance levels, and keep the manufacturer’s development costs in check since no architecture changes or fan additions were necessary. Their U.S. and Japanese wireless customers received their equipment and successfully trialed.

In example two, ATS’s customer was at the start of launching their new 4G LTE telecommunications platform. Early trials showed great promise but thermal issues dogged the design, making reliability a concern. This customer knew their design needed some additional thermal management technology to realize its design specification. They called in ATS to perform root cause analysis of the problem and provide a solution.

After performing both CFD and physical tests, the problem was identified. ATS’s maxiFLOW and superGRIP technologies were then deployed in the customer’s system. Resultant tests successfully improved reliability, while only adding single digit percentages to the product cost.

Both these examples show the advantage of ATS thermal management technology in telecommunications equipment.

Learn more about how your next or current telecommunications equipment project can be cooled so it can operate at its peak performance level, visit https://www.qats.com/Consulting/Custom-Cooling-Solutions.

How Heat Sink Anodization Improves Thermal Performance (part 1 of 2)

Radiation heat transfer can be as important as convection heat transfer in electronics cooling, especially in natural convection and low-airflow applications. In part 1 of this 2 part article, we’ll talk a bit about heat sink anodization, and how it affects radiation cooling in thermal management. In part 2 we’ll cover the heat sink anodization process and different types of anodization.

Depending on the type of surface treatment used, radiation heat transfer is enhanced in two distinct ways: by increasing the emissivity of the surface or by increasing the surface area. The effect of both these parameters is shown in the Stephen-Boltzmann Equation[1]:

Radiation Heat Transfer and Surface Area Treatment For a Heat Sink

Where, q is the amount of radiation energy that is exchanged between two bodies whose temperatures are TH and TC. FHC is the surface shape factor, ƒ is the Stephen-Boltzmann coefficient, and ε and A are the emissivity and area of the surface, respectively.

The Stephen-Boltzmann Equation indicates that the temperature difference between the hot and cold bodies is the driver for radiation heat transfer. However, in almost all electronics applications, neither of these temperatures is a controlled parameter. Therefore, radiation heat transfer can only be enhanced by increasing the emissivity and surface area.

The most common method of surface treatment in electronics cooling is surface anodizing. Anodizing can be an environmentally safe electrochemical process that thickens and toughens the naturally occurring protective oxide layer on the surface of metal parts. Surface anodizing changes the microscopic texture of a metal, making the surface durable, corrosion and weather resistant. In the process, the metal forms the anode (the positive electrode) of an electrolytic circuit. Through an acidic electrolytic solution, the electrical current releases hydrogen at the cathode (the negative electrode) and oxygen at the surface of the metal anode (the positive electrode), building up a deposit of metal oxide. The acid action is balanced with the oxidation rate to form a coating with microscopic pores, 10-150 nm in diameter. The thickness of the metal oxide depends on the anodizing method and is anywhere from 0.5 to 115 microns thick. It is controlled by electrolyte concentration, acidity, solution temperature, and the process electrical current and voltage [2].

A typical anodizing process will form an oxidized layer on a metal surface with a thickness ranging anywhere from 1.8 to 25 microns. However, some industrial applications require parts with exceptionally high wear resistance. The process used on such surfaces is termed hard anodizing and produces surfaces that are thick compared to standard anodizing. The coating of a hard anodized surface can be greater than 25 microns thick and is made under special conditions of high current density, very low temperature and the use of special electrolytes [3].

Various protective benefits and aesthetically pleasing colors have extended the use of anodization to many industrial and commercial applications. For electronics cooling, however, the advantages of surface anodizing are the dielectric isolation of the cooling components from their electronics environment, and the significant increase in their surface emissivity. The increase in the emissivity coefficient on the anodized surfaces of heat exchangers, electronics cabinets and enclosures, heat sinks, etc. is typically on the order of 0.83 to 0.86 [4]. When compared to the emissivity coefficient of bare aluminum, 0.04 to 0.06 [5], the importance and significance of enhancement of radiation heat transfer would become evident.

The pores created by acidic anodizing on aluminum can easily absorb dyes. Colored dyes are often used on heat sinks for cosmetic and marketing purposes. The color of anodization has no impact on radiation heat transfer. A clear anodized surface has the same emissive characteristics as a black anodized surface. To further protect the surface of dyed anodized heat sinks from corrosion, they are usually sealed by immersion in boiling hot de-ionized water or steam [2].

In part 2 we’ll cover the heat sinks anodization process and different types of anodization.  “How Heat Sink Anodization Improves Thermal Performance – Part 2”

push pin heat sinks

References:

  1. Radiation Heat Transfer and Surface Area Treatment, Qpedia Thermal eMagazine, June 2008.
  2. Edwards, J., Coating and Surface Treatment Systems for Metals, Finishing Publications Ltd. and ASM International, 1997.
  3. Aluminum Anodizer Council Web Forum.
  4. Gustavsen, A. and Berdahl, P. Spectral Emissivity Of Anodized Aluminum And Thermal Transmittance Of Aluminum Windows Frames, Nordic Jounnal Of Building Physics, Vol.3, 2003.
  5. Ozisik, N.,Heat Transfer: A Basic Approach, McGraw-Hill, 1984.
  6. Highly Emissive Ion Beam Textured Surfaces for Improved Cooling of Electronic Devices, Electronics Cooling Magazine, September 1997.
  7. Chi, T. , Ballinger, R., Olds, R., and Zecchino, M., Surface Texture Analysis Using Dektak Stylus Profilers, Veeco Instruments, Inc.

Thermocouples for Thermal Analysis: what they are and how they work (part 2 of 2)

In part 1, we covered the basics behind what thermocouples are and how they work. In part 2, we’ll cover how thermocouples can be made and know when to select the right thermocouple for your project.

Thermocouples can be made of any two dissimilar metal wires, and their emf voltage depends on the composition of the chosen metals. However, what makes thermocouples so popular is that the materials used to construct them are restricted and their output emf’s have been standardized. Certain materials and combinations are better than the others, and some have basically become the standard for given temperature ranges. Table 1 lists some of the available thermocouples in the U.S. market.

Thermocouple Type Material Composition Temperature Range Uncertainity Color Code
T Cu vs. Constantan -250 to 350°C Greater of 1°C or 0.75% Blue-Red
K Chromel vs. Alumel -200 to 1250°C Greater of 2.2°C or 0.75% Yellow-Red
J Iron vs Constantan 0 to 750°C Greater of 2.2°C or 0.75% White-Red
R Platinum vs. Platinum-13% Rodium 0 to 1450°C Greater of 1.5°C or 0.25% None Established
S Platinum vs. Platinum-10% Rodium 0 to 1450°C Greater of 1.5°C or 0.25% None Established
C Tungsten 5% Rhenium vs. Tungsten 26% Rhenium 0 to 2320°C Greater of 4.5 °C to 425°C, 1% to 2320°C None Established
E Chromel vs. Constantan -200 to 900°C Greater of 1.7°C or 0.5% Purple-Red

Table 1: Different types of thermocouples

Selecting the right type of thermocouple for an application depends on many factors. These include sensitivity, temperature range, corrosion resistance, linearity of output voltage, and cost. For example, types R and S are relatively expensive and are not sensitive. However, they perform well at high temperatures up to 1768°C and are resistant to a number of corrosives. Type C thermocouples are suitable for higher temperature applications, but they are relatively expensive and corrode easily in an oxidizing environment. A Type T thermocouple is inexpensive and very sensitive, but will corrode at temperatures above 400°C. Type K is very popular for general use, relatively inexpensive, reasonably corrosion-resistant, and can be used at high temperatures, up to 1372°C. K-type thermocouples also have provide relatively linear output as compared to the other types [2].

The actual magnitude of the thermocouple emf is very small, and is in the order of few millivolts. At a given temperature, Type E has the highest output emf among common types, but this voltage is still measured in millivolts. The sensitivity of thermocouples is also relatively low. For instance, the voltage change per degree Fahrenheit from 38 to 93°C is only 36 microvolts. As a result, thermocouples require accurate and sensitive measuring devices and cannot be used for temperature changes of less than about 0.1°C. Traditionally, expensive voltage balancing potentiometers were used to measure emf. Today, a high quality digital voltmeter is sufficient [3].

The National Institute of Standards and Technology (NIST) has developed standard calibration curves for determining temperature based on the measured emf voltage. These data represent the output emf of thermocouples when an ice cold junction is used, and are incorporated in the memory of most DAQ systems.  Unfortunately, the temperature-voltage relationship of thermocouples is nonlinear and curve-fitted using polynomial functions. Obviously, the higher the order of the polynomial function, the higher the accuracy of temperature reading. The polynomial function should only be used inside the temperature range of the thermocouple type and should not be extrapolated. To save computational time, a lower order polynomial fit can be used for a smaller temperature range.

Thermocouple wires come in variety of sizes. Usually, the higher the temperature, the heavier should be the wire. As the size increases, however, the time response to temperature change increases. Therefore, some compromise between response and life may be required.

Thermocouples can be connected electrically in series or in parallel. When connected in series, the combination is usually called a thermopile, (whereas there is no particular name for thermocouples connected in parallel). A wiring schematic of a thermopile combination is shown in Figure 3.

Thermocouples example diagram

Figure 3 – Series-connected thermocouples forming a thermopile

The total output from n thermocouples will be equal to sum of the individual emf’s. The main purpose of using a thermopile rather than a single thermocouple is to obtain a more sensitive element. Parallel connection of thermocouples is used for averaging.

 

References:

  1. Omega Temperature Handbook, Omega Engineering, Inc. 2nd edition.
  2. Wheeler, A. and Ganji, A., Introduction to Engineering Experimentation, Prentice Hall Inc., pp. 240-246, 1996.
  3. Beckwith, T., Marangoni, R., and Lienhard, J., Mechanical Measurements, Fifth Edition, Addison Wesley Longman, pp. 676-685, 1993.

How heat sink fin spacing plays a key role in natural convection cooling and how you can optimize it

We wrote a three part series, “How to Apply Natural Convection Cooling for the Thermal Management of Electronics” during the week of August 22nd. Many of you liked our technical post so we thought we’d follow that up with a little focus on fin spacing.

Fin spacing is also known as channel spacing, the channel being the width from one fin to the next in a heat sink as illustrated in this drawing:

straight fin aluminum heatsink

Here we see that the “B” dimension is the channel width or the fin spacing of this heat sink.

So what’s the big deal on fin spacing? Well, as usual in thermal engineering quite a bit more than meets the eye. The fin spacing of a heat sink, if not optimized for your application, can actually  reduce the thermal efficiency of your heat sink. If the fins are too narrowly place then the channel is too narrow and air has a harder time getting through!  Think of air as it really is: a fluid. Don’t forget that in physics, a fluid can be either liquid or a gas. That should help you to visualize what’s going on.  One case in particular was very interesting

The project we were working on was  for a rather large heat sink, (about the size of a hardcover dictionary if anyone remembers those!) for a wireless network remote radio head (RRH) application. The customer was another Tier 1 Telecommunications Equipment OEM. The customer actually had developed their own heat sink for natural convection cooling. It’s specifications were:

35 Fins
5mm base
Thermal Resistance of 1.39 C/W at 10LFM 55C ambient

 

While the design was basically on target, the thermal performance just wasn’t there to cool their RRH. ATS performed a series of experiments and, based on our data, developed a new heat sink that had these improved specifications:

17 fins
5mm base
Thermal Resistance of 1.05°C/W thermal resistance at 10LFM 55C ambient
17% fewer fins than a standard RRH HS
60% Lighter than a standard RRH HS
25% less expensive than similar solutions due to reduced material cost.

 

Here’s a comparison photo showing the two side by side; the fin spacing is clearly seen between the two:
aluminum heat sinkaluminum heat sink
The results are dramatic! And that’s what can happen when solid thermal analysis is applied to a natural convection problem.

How about some tools to help you in this?

There was a great article in “Power Electronics Technology” magazine by Chris Soule of Thermshield that covered this issue very nicely. You can get a copy of Chris’s article by clicking to Power Electronics at this link: “Optimize Fin Spacing, how close is too close?”

Intel has a nice article providing an example of how to do an optimized plate fin extruded thermal solution spacing calculation. Chun Howe Sim and Loh Jit Seng of Intel wrote the article and it’s a quick read. You can get your copy by clicking to EE Times here: Fanless Design for Embedded Applications

You should also review the ATS series, “How to Apply Natural Convection Cooling for the Thermal Management of Electronics” You can read our three part series here:  part 1, part 2, and part 3.

 

Finally, give us a call at 781-769-2800 or drop us an e-mail at [email protected] or submit your questions and project for natural convection cooling via our online project form on our main web site here.