We’ve just released our new line of standard board level heat sinks. These stamped heat sinks are ideal for PCB application, especially where TO-220 packages are used. Available now through Digi-Key Electronics or at this link from ATS http://www.qats.com/eShop.aspx?produc…
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Posted in heat, heat sink, Heat Sink Attach, heat sink design, Heat Sink Material, Heat Sinks, Heat Spreaders, Manufacturing, materials, semiconductor, sink, Thermal Design, thermal engineering, thermal management, Uncategorized
Tagged Advanced Thermal Solutions, education, electronics, electronics cooling, engineering, heat sink, heat sink attach, heat sink design, mechanical engineer, thermal analysis, thermal characterization, thermal management, thermal research
Radiation heat transfer is often neglected in thermal design due to its complicated nature and misperceptions about its impact in electronics cooling. However, it turns out that heat radiation can have a significant positive effect on natural convection and especially in low air flow applications. Our new white paper explains how this works and how engineers can take advantage of it. Get the white paper for no cost and no registration at this link here on qats.com
Posted in Engineering, heat sink
This video shows a flame test of the ATS heat sink clips superGRIP and maxiGRIP. These are used in the ATS clipKIT. It shows that the clips do not ignite, a key requirement in Telecomm applications and for general safety.
For more on ATS’s clipKITS, visit http://www.qats.com/Heat-Sink/Attachments/clipKIT
Posted in heat sink, Heat Sink Attach, heat sink clip, Uncategorized
Advanced Thermal Solutions John O’Day and Len Alter showcase the patented heat sink attachments maxiGRIP and superGRIP. With its patented and discrete design, these heat sink attachments are well worth it for being your only choice for a cost-effective, high performing thermal solution.
Posted in Analysis, Engineering, Engineering & Science Chat, heat, heat sink, Heat Sink Attach, heat sink clip, heat sink design, Heat Sink Material, Heat Sinks, heat transfer, Manufacturing, materials, Thermal, Thermal Analysis, Thermal Design, thermal electronic coolers, thermal management, Thermal Research
maxiFLOW ~ simply better electronics cooling A study from Northeastern University shows why! http://www.qats.com/cms/wp-content/uploads/2013/09/Qpedia_Oct08_How-Air-Velocity-Affects-HS-Performance.pdf
Posted in heat sink