Category Archives: Heat Sinks

ATS’s High Efficiency Pin Fin Heat Sinks are Value Price and Effective

High Efficiency Custom Pin Fin Heat Sink, ATS010010002-PF-1A Advanced Thermal Solutions High Efficiency Custom Pin Fin Heat Sink, ATS010010002-PF-1A , has the following features: * Length: 10mm * Width: 10mm * Height: 2mm * Thermal Resistance at 200LFM: 19.64 C/W Unducted Flow It’s a low cost, quick add to any moderate thermal management problem. You can learn more about ATS’s Pin Fin Heat Sink product line here ATS High Efficiency Pin Fin Heat Sink You may also contact us at 781-769-2800, email: [email protected] or visit qats.com

How to increase a heat sinks surface area without increasing its size using microscopic texturing (part 2 of 2)

In part 1 of our 2 part series, “How to increase a heat sinks surface area without increasing its size using microscopic texturing” we covered what this technology is, options to apply, and under what conditions it is effective. In part 2 we’ll cover accurate surface texture characterization.

Accurate surface texture characterization is often needed to control and fine tune the texturing process. Surface texture is not a measurable quantity but it is possible to measure some of its intrinsic characteristics and parameters. These parameters have been developed based on data obtained using a stylus-based instrument. This device, known as 3D Surface Profilers, uses a diamond-tipped stylus to detect minute surface variations and topology. The stylus is mechanically couples to an LVDT (Linear Variable Differential Transformer). The sample is precisely guided underneath the stylus while the stylus rides over the surface, detecting roughness variations as small as ten angstroms in height [7]. The LVDT produces an analog signal in response to the stylus movement. This signal is then sent to a computer data acquisition system where the signal is amplified, digitized and analyzed.

The main parameters of a texture surface are waviness and roughness. These parameters are repetitive and random irregularities from the normal surface that forms the three dimensional topography of the surface. The spacing of these irregularities is what differentiates waviness from roughness. Two or more spacings between irregularities will cause a wavy surface. However, as the space between them decreases excessively, the resulting surface would become flat but rough. A typical surface exhibits roughness superimposed over waviness [7]. A sophisticated Profiler implements advanced high and low pass filters in order to measure each parameter separately while filtering out the other.

The one parameter that is standardized all over the world and is specified and measured far more frequently than any other is the arithmetic average roughness height, or roughness average, designated by Ra. It is defined as the arithmetic mean of the departures of the profile from the mean line. An approximation of the average roughness, Ra is obtained by adding the Y values without regard to sign and dividing the sum by the number of the samples. Ra is used to detect general deviation in overall profile height but it is incapable of detecting differences in spacing and its distribution [7].

Advanced Thermal Solutions Roughness AverageRoughness Average, Ra Is Sum Total Of The Maximum Valley
And Maximum Peak Of Roughness [7].

Another parameter that is often used in analysis of a texture surface is the root-mean-square average of the departures of the roughness profile from the mean line. This is known as RMS and designated by Rq. RMS or Rq has statistical significance because it represents the standard deviation of the profile heights and it is used in the more complex analysis of skewness, the measure of symmetry of a profile about the mean line [7].

Advanced Thermal Solutions value of roughnessRMS Value of Roughness [7].

A well equipped Profiler system includes both the Ra and Rq standard analytical functions as well as other widely used parameters to analyze surface roughness and waviness. Contrary to general beliefs radiation heat transfer could be as important as convection heat transfer in electronics cooling, especially in natural convection and low-airflow applications. To further enhance radiation, surface treatments such as surface anodize and surface texturing is a viable option that could increase effective surface area and increases surface emissivity. Surface Anodize also has the advantage of corrosion and wear resistance and it also electrically isolates the cooling components from the electrically charged electronics.

References:

  1. Radiation Heat Transfer and Surface Area Treatment ,Qpedia Thermal eMagazine, June 2008.
  2. Edwards, J., Coating and Surface Treatment Systems for Metals, Finishing Publications Ltd. and ASM International, 1997.
  3. Aluminum Anodizer Council Web Forum, http://www.anodizing.org/index.html.
  4. Gustavsen, A., Berdahl, P. Spectral Emissivity Of Anodized Aluminum And Thermal Transmittance Of Aluminum Windows Frames, Nordic Jounnal Of Building Physics, Vol.3, 2003.
  5. Ozisik Necati, M., Heat Transfer A Basic Approach, McGraw Hill, 1985.
  6. Highly Emissive Ion Beam Textured Surfaces For Improved Cooling Of Electronic Devices, Electronics Cooling Magazine, September 1997.
  7. Chi, T. , Ballinger, R., Olds, R., Zecchino, M., Surface Texture analysis using Dektak Stylus Profilers, Veeco Instrument Inc.http://www.veeco.com/pdfs/appnotes/an525%20_dektak_surface_97.pdf

How to increase a heat sinks surface area without increasing its size using microscopic texturing (part 1 of 2)

Microscopic texturing is a method to increase the effective How to increase a heat sinks surface area without increasing the heat sink size. We’ll explore this compelling strategy for making heat sinks more efficient in this two part article series. Part 1 covers what this technology is, options to apply, and under what conditions it is effective.

Microscopic texturing not only increases the surface area, it also increases the emissivity of the surfaces at the same time. However, while this surface enhancement can be used for boiling heat transfer, it is of little importance for air cooling. This is due to the fact that radiation heat transfer is primarily a surface phenomenon and certain texturing processes that provide sufficient control over surface feature morphology could increase surface emissivity [6].

There are several surface texturing methods. A common one is chemical etching. Another is ion beam texturing where ion beam bombardment is used to selectively etch materials in applications from electronics substrate pattering to the creation of high surface-area pace maker electrode tips. It is based on a phenomenon known as sputtering, which is the process of removing material from a surface at the atomic level through collisions between energetic ions and substrate atoms. Because it is done on such a fine scale, this process provides a great degree of control over surface features. In principal, it is used to create almost any type of surface topography, whether smoother or rougher than the original surface [6]. Examples of ion beam texturing are shown in the following figure:

Ion Beam Textured Surface to enhance heat sink emmisivity

Ion beam textured surfaces typically absorb over 90% of the incident light across a wide range of wavelengths, implying that the surface is highly emissive. Such textured surfaces would be ideal for electronics cooling using liquids in boiling mode due to its significantly increased surface area. Increased surface area would enhance radiation as well as convection heat transfer provided that the texturing will provide excellent surface for pool boiling heat transfer often seen in cooling of high power electronics. Surface texturing will not be useful for applications using unducted low-speed airflow, since air cannot flow easily in the microstructures.

In part 2 we’ll cover accurate surface texture characterization.

References:

  1. Radiation Heat Transfer and Surface Area Treatment ,Qpedia Thermal eMagazine, June 2008.
  2. Edwards, J., Coating and Surface Treatment Systems for Metals, Finishing Publications Ltd. and ASM International, 1997.
  3. Aluminum Anodizer Council Web Forum, http://www.anodizing.org/index.html.
  4. Gustavsen, A., Berdahl, P. Spectral Emissivity Of Anodized Aluminum And Thermal Transmittance Of Aluminum Windows Frames, Nordic Jounnal Of Building Physics, Vol.3, 2003.
  5. Ozisik Necati, M., Heat Transfer A Basic Approach, McGraw Hill, 1985.
  6. Highly Emissive Ion Beam Textured Surfaces For Improved Cooling Of Electronic Devices, Electronics Cooling Magazine, September 1997.
  7. Chi, T. , Ballinger, R., Olds, R., Zecchino, M., Surface Texture analysis using Dektak Stylus Profilers, Veeco Instrument Inc.http://www.veeco.com/pdfs/appnotes/an525%20_dektak_surface_97.pdf

Advanced Thermal Solutions ATS-X53190P-C1-R0 Straight Fin Heat Sink with superGRIP heat sink clip has 24.3 C/W Thermal Resistance at 200LFM

ATS straight fin heat sink with superGRIP heat sink clip Advanced Thermal Solutions ATS-X53190P-C1-R0 Straight Fin Heat Sink with superGRIP attachment has 24.3 C/W Thermal Resistance at 200LFM. Probably one of the best things about this heat sink “system” is the fact that you can use phase change thermal interface material (TIM) with it. Phase change TIM, under the right amount of pressure, can improve your thermal performance from 10% to 20% in a given application.

Speaking of thermal interface material for heat sinks, Jeff McCutcheon, senior technical specialist at 3M, has written a very good article and resources on choosing TIM. You can get a copy at EP&T Magazine: Higher frequencies leading to rising power and EMI in traditionally low power electronic devices

To see a video demo of ATS’s heat sink clip, superGRIP, see below:
[youtube=http://www.youtube.com/watch?v=0MqyNReoo10]

For more information, talk to one of our application engineers or to purchase you may contact us at T: 781-769-2800, email us at [email protected] or visit our web site at http://www.qats.com

How to Apply Natural Convection Cooling for the Thermal Management of Electronics (part 3 of 3)

In part 1 of our 3 part series, we covered why and how natural convection works and how a heat sources geometry can affect natural convection.  Part 2, addressed board orientation and its impact on natural convection cooling and useful equations that can be used for calculating initial and simplistic results based on viable assumptions. In part 3, our final part in this series, we‘ll cover the calculations in generic plate fin heat sinks and wrap up our series.

For a generic plate fin heat sink, with a fin height of H, and spacing between fins of B, there is a relative fin spacing to fin length ratio which will provide optimal heat transfer within a given volume. Where spatial constraints prevent the use of a larger sized heat sink, optimizing its design for natural convection and increasing its efficiency can be the difference between normal operation and thermal failure.

straight fin aluminum heatsink

Figure 3. A Simple Plate Fin Heat Sink.

Because the heat sink has to include heat transfer from the base, an equivalent channel width needs to be determined. The equivalent channel width is solved similar to a hydraulic diameter, as seen below [2].

The equivalent channel width math formula

where:

H = fin height

B = distance between fin surfaces (fin pitch minus fin thickness)

The heat extracted from the heat sink can be found using this equivalent channel width and an assumed temperature difference between the ambient and heat sink surface.

.  Heat Dissipation of a Sink for Different Configurations of Fin Spacing and Fin Height Natural Convection

Figure 4. Heat Dissipation of a Sink for Different Configurations of Fin Spacing and Fin Height Natural Convection [2]

The results shown in Figure 4 highlight the effects of changing the fin height relative to fin to fin spacing. For low volumes, it may not be economical to extrude or machine a heat sink with the exact geometry to optimize heat transfer from a given control volume, but the results show that for a standard or off-the-shelf solution it is safer to pursue a design with a larger fin spacing to fin height ratio than otherwise.

In this article we have shown that many applications prevent the use of forced convective flow from fans or other sources, due to acoustics, cost or other reasons. But, optimizing heat transfer by using the natural buoyancy-induced movement of air can be effective in cooling electronics. Some techniques for optimizing airflow and heat transfer in natural convection situations involve a vertical channel. For heat-generating boards suspended in a vertical configuration, there is calculable board spacing which will lead to an optimal power density per volume. Heat sinks can also be optimized for natural convection, and while it may not be feasible to obtain a heat sink of the perfect fin height and fin pitch for a workable volume, the next best performer is a heat sink with larger fin spacing relative to fin height.

References

1. Hwang, P., Cheng, H., Fang, J. and Li, J., CFD-Based Thermal Characterization of Board-Level Microelectronic Devices under Natural Convection Cooling, Microsystems, Packaging, Assembly and Circuits Technology, 2007. IMPACT 2007.

2. Malhammar, A., Optimum Sized Air Channels for Natural Convection Cooling, Telecommunications Energy Conference, 1987.

3. Incropera, F., Liquid Cooling of Electronic Devices by Single Phase Convection. New York, Wiley. 1999.