Tag Archives: thermal engineering

The Monthly Qpedia is Out!

Qpedia_Aug13_coverThe monthly issue of Qpedia has just been released and can be downloaded at: http://www.qats.com/Qpedia-Thermal-eMagazine/Back-Issues.

This month’s featured articles include:

Application of TECs to Thermal Management of 3D ICs

From the thermal perspective, 3D stacked chips pose different challenges than what has been experienced in 2D packaging. For example, the heat dissipation of 3D ICs is highly non-uniform and multidirectional, due to the intrinsic chip architecture and the available real estate. When cooling at sub-ambient temperatures is necessary, the small footprint of a 3D chip becomes an impediment to deploying a cooling solution. Additionally, precision temperature control becomes difficult, since the surface to be controlled may be buried deep in the 3D stack. In response to cooling concerns about 3D ICs, this article presents a review of methods available for cooling 3D ICs to sub ambient temperatures using TECs.

Challenges in Testing Thermal Interface Materials

When choosing a thermal interface material (TIM), most of the time we look at the datasheet and find the thermal impedance if it is a solid material or the thermal conductivity if it is grease. Then, we calculate the thermal resistance and temperature rise with those numbers. But, how do we know that a TIM is performing as advertised? Can we really tell if one TIM will perform better than another, based on their specs? Additionally, the material presented in this article suggests that the data printed in TIM datasheets should be evaluated carefully to ensure that the testing procedures are similar to the actual application. Furthermore, even with the existing standards, many variables still exist.

Industry Developments: Portable Cooling Systems

Buildings and rooms constructed to house data centers are getting larger, more congested and warmer. Many of these structures have sophisticated thermal management systems featuring high-powered coolers or harnessing cold local water or air. For some needs, however, a portable cooling system can provide a much simpler and less costly solution. These systems can deliver direct cooling relief to equipment hot spots, and some can lower a room’s temperature when a central cooling system is inadequate or nonexistent.

Technology Review: Enhancing Heat Transfer on Surfaces

In this issue our spotlight is on enhancing heat transfer on surfaces. There is much discussion about its deployment in the electronics industry, and these patents show some of the salient features that are the focus of different inventors.

Cooling News featuring the latest product releases and buzz from around the electronics cooling industry.

Download the issue now and see why over 18,000 engineer’s subscribe to Qpedia. Click here to subscribe Subscribe to ATS

Don’t forget the Qpedia Book Series Promotion that coolingZONE is currently running! Save 25% off the hardcover books that are a must have in every engineer’s library!

Qpedia, Official Media Sponsor of coolingZONE-13, Offers 30% Discount on Esteemed Book Series

Qpedia_banner4

Qpedia, the official media sponsor of coolingZONE-13, has just announced a special promotion offering a 30% discount on the widely read Qpedia Book Series. The promotion will take place at coolingZONE-13, the Thermal Management Industry International Summit in Boston, Massachusetts, October 21st -23rd, 2013. Additionally, the books will be available to purchase through coolingZONE’s online bookstore , with a 25% discount, until the conference ends on October 23. These books provide an expert resource for engineering professionals, students, educators and others who want to learn the latest theories and applications in the electronics cooling field.

The Qpedia Book series is a four volume set of highly technical articles, written and published by Advanced Thermal Solutions, Inc. The authors include Dr. Kaveh Azar, the company’s president and CEO; and Dr. Bahman Tavassoli, its chief technologist. Both Drs. Azar and Tavassoli are internationally recognized experts in the field of thermal management.

The four volume set contains over 250 in-depth articles filled with technical information, fundamental calculations and thoughtful analysis, printed in rich color in a hardbound book. They discuss the most critical areas of electronics cooling, covering a wide spectrum of topics in the telecom, aerospace and defense, embedded computing, medial, automotive, and semiconductor industries.

The articles, inspired by real-life scenarios, solve the thermal management challenges that today’s engineer is faced with. Drawn from personal experience, the veteran authors pass on knowledgeable examples of problem solving techniques that can be applied by all thermal and mechanical engineers. To order the complete book set, or individual volumes, please visit www.coolingzone.com/cart.

coolingZONE-13, the Thermal Management Industry International Summit, is a leading conference for all technical professionals in thermal management, electronics cooling, heat transfer and energy transport fields. The conference gathers recognized experts and technology companies in thermal management, providing solutions for the thermal engineering challenges of the future. Dr. Kaveh Azar, CEO of Advanced Thermal Solutions and Qpedia’s Editor-in-Chief, will be opening the conference with a keynote address on “The State of the Art in Thermal Management – From Vacuum Tubes to Super Computers”. Other keynote addresses include “Redefining Engineering as a Profession of Innovation” by Dr. Vincent Manno of Olin College and “Galinstan-Based Cooling of Microelectronics: Beyond Tuckerman and Pease?” by Dr. Marc Hodes of Tufts University. To learn more about coolingZONE-13, and to register for the conference, please visit: www.coolingzone.com

Next Webinar Shows How to Properly Measure and Analyze Temperatures in Electronic Systems

ATS WebinarsThe upcoming webinar “How to Perform and Understand Temperature Measurement in Electronic Systems” will be held this Thursday, September 12, 2013 at 2pm ET. The free, prerecorded technical presentation will deepen attendees understanding of the importance of temperature measurement in electronic systems. Attendees will learn about each of the instruments needed for measuring temperature and interpreting temperature data. Key locations will be identified where thermal testing should be conducted in order to obtain the most accurate and actionable results.

The webinar will be taught by Dr. Kaveh Azar, CEO of Advanced Thermal Solutions, Inc. Since 1985, Dr. Azar has been an active participant in the electronics thermal community and has served as the organizer, general chair and the keynote speaker at national and international conferences sponsored by ASME, IEEE and AIAA. In addition, he has been the recipient of the IEEE SEMITHERM Significant Contributor Award in the thermal management of electronics systems.

Dr. Kaveh Azar

Dr. Kaveh Azar

Dr. Azar has been an invitee to national bodies such as NSF, NIST and NEMI for organizing government and industry research goals in electronics cooling. He has also been an adjunct professor at a number of universities, including Northeastern University, and lectures worldwide in analytical and experimental methods in electronics cooling.

He holds more than 36 national and international patents, and has published more than 75 articles, 3 book chapters and a book entitled Thermal Measurements in Electronics Cooling. Dr. Azar has also served as the editor in chief of Electronics Cooling Magazine, the premier resource for practitioners in the field of electronics thermal management, from the publications founding in 1995 to 2006.

REGISTER NOW

ATS’ Dr. Camil Ghiu to Present at coolingZONE-13

CZ13_speaker_camil

ATS’ own, Dr. Camil Ghiu, will be presenting “Driving Towards 0.1oC/W In Compact Air Cooled Heat Sinks: Advancements In Flow Management And Air Jet Impingement Cooling” at the Thermal Management Industry International Summit: coolingZONE-13. The Summit will be held in Boston, Massachusetts, October 21-23, 2013.

Considering the widespread use of compact systems, such as the 1U platform, and the drive to reduce costs from the system and deployment view points, air cooling continues to be sought for thermal management of such systems. The decrease in size of the new generation of electronic devices imposes a severe constraint on their incorporated thermal management devices. In this context, the development of low thermal resistance heat sinks (0.1 oC/W) for cooling compact electronics systems (1U form factor) continues to be a challenge for the thermal management community.

Dr. Ghiu’s presentation will present recent developments in designing compact heat sinks using advanced air flow management. Two main approaches will be presented, including heat sink design implementing jet impingement and sectional heat sinks. Both design approaches have been explored at ATS, and the experimental data and simulation results will be presented for further discussion.CZ13_HP

coolingZONE-13 is the premiere engineering conference for the thermal management industry. Leading experts from academia and the electronics cooling industry will present emerging technologies in the most crucial areas of thermal engineering. A wide range of topics will be discussed, including liquid cooling, advanced heat sink and heat pipe design, thermal interface materials, data center cooling and analysis, CFD, and vapor compression cooling. Keynote speakers this year are Dr. Vincent Manno of Olin College, Dr. Marc Hodes of Tufts University and Dr. Kaveh Azar, CEO of Advanced Thermal Solutions, Inc. Additional speakers and exhibitors from Laird, CD-Adapco, Aavid, Cradle-CFD, Schneider Electric, and Future Facilities will also be presenting at the conference.

Download the Brochure

Register Now

ATS Offers Arrow Customers a Half-Day of Free Access to its Thermal Characterization Lab

arrow_ats

As part of the new distribution agreement between Arrow Electronics and Advanced Thermal Solutions, Inc., ATS is offering a half-day of free, no-obligation use of its unique Thermal Characterization Laboratory to Arrow customers. The Thermal Characterization Lab, located at ATS headquarters in Norwood, MA, allows engineers to perform thermal testing on heat sinks, fans and fan trays, PCBs, blades, enclosures, or complete systems. Experienced engineers, board and system designers can perform the tests themselves, or consult with an ATS thermal engineer at no cost during their 4 hours of laboratory time.

ATS’ Thermal Characterization Lab features a full range of research-quality instruments, including open and closed loop wind tunnels, for ambient and elevated temperature testing, all with PC-driven controls and automated data collection. The lab is also outfitted with a full array of the company’s sensor systems and thermocouples, which can be used to characterize electronic products under variable airflow and temperature conditions.

Liquid Crystal Thermography

In addition, the lab also features a JEDEC approved component thermal testing facility for conducting multitude of device level testing per JEDEC standards. The facility also provides a complete liquid crystal and IR thermography systems for non-invasive temperature mapping to 0.1oC with one micron-level spatial resolution; and a liquid cooling facility for complete testing and characterization of cold-plates, cooling effect and proof of concept testing.

 

“Most of today’s electronics have thermal situations that can turn into big problems if left alone. The easiest, lowest cost way to manage this is to conduct an accurate thermal characterization of the problem at hand,” said Kaveh Azar, Ph.D., President and CEO of Advanced Thermal Solutions, Inc. “If you have the right facility and associated know-how, you can often complete your test in a half-day, then you can readily assess what is the best thermal solution for your application. For engineers short on time and resources, we believe this free use of ATS’ Thermal Characterization Lab could be very helpful.”

Download the Brochure

To contact ATS for more information on this opportunity, please call 781-769-2800, email ats-hq@qats.com or visit www.qats.com.