Category Archives: ATS News

ATS’ Dr. Camil Ghiu to Present at coolingZONE-13

Posted on September 9, 2013 by | Leave a comment

CZ13_speaker_camil

ATS’ own, Dr. Camil Ghiu, will be presenting “Driving Towards 0.1oC/W In Compact Air Cooled Heat Sinks: Advancements In Flow Management And Air Jet Impingement Cooling” at the Thermal Management Industry International Summit: coolingZONE-13. The Summit will be held in Boston, Massachusetts, October 21-23, 2013.

Considering the widespread use of compact systems, such as the 1U platform, and the drive to reduce costs from the system and deployment view points, air cooling continues to be sought for thermal management of such systems. The decrease in size of the new generation of electronic devices imposes a severe constraint on their incorporated thermal management devices. In this context, the development of low thermal resistance heat sinks (0.1 oC/W) for cooling compact electronics systems (1U form factor) continues to be a challenge for the thermal management community.

Dr. Ghiu’s presentation will present recent developments in designing compact heat sinks using advanced air flow management. Two main approaches will be presented, including heat sink design implementing jet impingement and sectional heat sinks. Both design approaches have been explored at ATS, and the experimental data and simulation results will be presented for further discussion.CZ13_HP

coolingZONE-13 is the premiere engineering conference for the thermal management industry. Leading experts from academia and the electronics cooling industry will present emerging technologies in the most crucial areas of thermal engineering. A wide range of topics will be discussed, including liquid cooling, advanced heat sink and heat pipe design, thermal interface materials, data center cooling and analysis, CFD, and vapor compression cooling. Keynote speakers this year are Dr. Vincent Manno of Olin College, Dr. Marc Hodes of Tufts University and Dr. Kaveh Azar, CEO of Advanced Thermal Solutions, Inc. Additional speakers and exhibitors from Laird, CD-Adapco, Aavid, Cradle-CFD, Schneider Electric, and Future Facilities will also be presenting at the conference.

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ATS Offers Arrow Customers a Half-Day of Free Access to its Thermal Characterization Lab

Posted on August 30, 2013 by | Leave a comment

arrow_ats

As part of the new distribution agreement between Arrow Electronics and Advanced Thermal Solutions, Inc., ATS is offering a half-day of free, no-obligation use of its unique Thermal Characterization Laboratory to Arrow customers. The Thermal Characterization Lab, located at ATS headquarters in Norwood, MA, allows engineers to perform thermal testing on heat sinks, fans and fan trays, PCBs, blades, enclosures, or complete systems. Experienced engineers, board and system designers can perform the tests themselves, or consult with an ATS thermal engineer at no cost during their 4 hours of laboratory time.

ATS’ Thermal Characterization Lab features a full range of research-quality instruments, including open and closed loop wind tunnels, for ambient and elevated temperature testing, all with PC-driven controls and automated data collection. The lab is also outfitted with a full array of the company’s sensor systems and thermocouples, which can be used to characterize electronic products under variable airflow and temperature conditions.

Liquid Crystal Thermography

In addition, the lab also features a JEDEC approved component thermal testing facility for conducting multitude of device level testing per JEDEC standards. The facility also provides a complete liquid crystal and IR thermography systems for non-invasive temperature mapping to 0.1oC with one micron-level spatial resolution; and a liquid cooling facility for complete testing and characterization of cold-plates, cooling effect and proof of concept testing.

 

“Most of today’s electronics have thermal situations that can turn into big problems if left alone. The easiest, lowest cost way to manage this is to conduct an accurate thermal characterization of the problem at hand,” said Kaveh Azar, Ph.D., President and CEO of Advanced Thermal Solutions, Inc. “If you have the right facility and associated know-how, you can often complete your test in a half-day, then you can readily assess what is the best thermal solution for your application. For engineers short on time and resources, we believe this free use of ATS’ Thermal Characterization Lab could be very helpful.”

Download the Brochure

To contact ATS for more information on this opportunity, please call 781-769-2800, email [email protected] or visit www.qats.com.

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“Heat Sink Selection Made Easy” Free Technical Webinar on June 13

Posted on May 30, 2013 by | Leave a comment

PCB from Tellabs- smaller sige

 

Advanced Thermal Solutions, Inc. (ATS) will present Heat Sink Selection Made Easy, a free technical webinar for engineers involved in the thermal management of electronic components. The hour-long webinar begins at 2:00 ET on Thursday, June 13.

The heat dissipation needs of todays components are more challenging than ever. Choosing the right heat sink the first time is essential. With so many application requirements and heat sink options, this can be a daunting task, but it is made easier by having an informed approach.

In this webinar, attendees will learn the importance of system airflow and its impact on heat sink design; attachment methods and how to solve thermal and mechanical design challenges; and how to make the right off-the-shelf or custom heat sink choice for your application and budget.

Presenting Heat Sink Selection Made Easy is Dr. Kaveh Azar, president, CEO and founder of Advanced Thermal Solutions. Dr. Azar is an active participant in the electronics thermal community and has served as the organizer, general chair and the keynote speaker at national and international conferences sponsored by ASME, IEEE and AIAA.

How to View the June 13th Webinar:

  • The webinar starts at 2PM ET and will be available for 24 hours, until 2PM ET Friday the 14th.
  • ATS felt that this approach would help engineers in other time zones to be able to watch the webinar.

How to Ask Questions?

  • Today’s webinar speaker, Dr. Kaveh Azar, is happy to take your questions via email.
  • Please send email to [email protected] and write in the email’s subject, “Heat Sink Selection Webinar Question”

 

 

 

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Mouser and Advanced Thermal Solutions, Inc. (ATS) Sign Global Distribution Agreement

Posted on May 23, 2013 by | Leave a comment

Mouser

 

 

 

May 23, 2013  Advanced Thermal Solutions, Inc. (ATS) today announced a new global agreement with Mouser Electronics, Inc. to distribute high performance heat sinks and cooling solutions.

The agreement with ATS means Mouser Electronics customers will have access to a wide range of high performance heat sinks available in thousands of shapes and sizes. ATS heat sinks are designed for use in many applications including telecom, datacom, LED, automotive, medical, and aerospace. Their maxiFLOW heat sinks feature a low profile spread fin array that maximizes surface area, yielding the highest thermal performance of any heat sink on the market. ATS maxiFLOW heat sinks are available with thermal tape, push pin or its patented maxiGRIP attachment methodology. ATS maxiGRIP assemblies permit secure attachment of heat sinks to BGAs, flip chips and other hot components on a PCB with steady, even pressure and without any need to drill holes in the board. Both the spring and frame clip in the maxiGRIP assembly can be easily removed, allowing the heat sink to be detached and re-attached without damaging the device, surrounding components or PCB. All ATS maxiGRIP heat sinks are fabricated with high-performance, phase-changing thermal interface material to further maximize performance. Mouser Electronics stocks an extensive line-up of the ATS LED heat sinks, including both the linear style and the round/star shape in a wide variety of sizes; fansinks using maxiGRIP attachment, and a full line of maxiFLOW heat sinks for brick DC/DC converters.

We are very pleased to present to our customers the world-renowned ATS line of heat sinks,” says Keith Privett, Mouser Electronics Vice President of Electromechanical, Power, and Test. Our broad product offering will provide customers with cooling solutions for LEDs, BGAs, power supplies, and specific devices such as flip-chip processors.”

Amongst many air and liquid high capacity cooling solutions, ATS provides the widest range of high performance heat sinks for cooling todays hot-running electronic devices,”says Sharon Koss, VP of Operations and Business Development of ATS. “We look forward to providing thermal solutions to Mouser’s customers around the world.” To view these and other products by ATS, visit http://www.mouser.com/Advanced-Thermal-Solutions/.

With its broad product line and unsurpassed customer service, Mouser caters to design engineers and buyers by delivering whats next in advanced technologies. Mouser offers customers 19 global support locations and stocks the worlds widest selection of the latest semiconductors and electronic components for the newest design projects.

Mouser Electronics website is updated daily and searches more than 10 million products to locate over 3 million orderable part numbers available for easy online purchase. Mouser.com also houses an industry-first interactive catalog, data sheets, supplier-specific reference designs, application notes, technical design information, and engineering tools.

About Mouser Electronics

Mouser Electronics, a subsidiary of TTI, Inc., is part of Warren Buffett’s Berkshire Hathaway family of companies. Mouser is an award-winning, authorized semiconductor and electronic component distributor, focused on the rapid introduction of new products and technologies to electronic design engineers and buyers. Mouser.com features more than 3 million products online from more than 500 manufacturers. Mouser publishes multiple catalogs per year providing designers with up-to-date data on the components now available for the next generation of electronic devices. Mouser ships globally to over 375,000 customers in 170 countries from its 492,000 sq. ft. state-of-the-art facility south of Dallas, Texas. For more information, visit http://www.mouser.com.

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Join ATS at the Real-Time Embedded Computing Conference

Posted on May 2, 2013 by | 1 comment

ATS will be among fellow industry leaders, at the Real-Time Embedded Computing Conference this May 7th and May 9th, 2012. Attendees will learn whats on the cutting-edge in the Embedded Computing industry and talk with fellow industry leaders about emerging technology, products, and services available in the market.
To get excited for the conference, we are giving away a white paper, originally published in Qpedia Thermal eMagazine, titled “Device Thermal Coupling on a PCB”. Download your copy for free.
Learn More about the Real-Time Embedded Computing Conference:
May 7 in Nashua, NH
Luncheon Keynote:
“Ten Technology Trends That Revamp the ‘System’ Definition”
presented by Jeff Child, Editor in Chief, COTS Journal

Embedding computing and electronics technology has reached a new era where the definition of “system” is changing. Technology integration has shifted the level of functionally on the chip, board and box-level. And interconnects between those new “system” blocks constantly have to keep up. Today’s new levels of compute density, functionality and networking available is opening up new options for defense, industrial control, medical systems and many other applications. Highly integrated FPGAs, comprehensive software development tools, high-speed fabric interconnects and turn-key box level systems are just a few of players in this story of the embedded system evolution. In this keynote, Jeff Child, Editor-in-Chief of COTS Journal, explores the top 10 trends that underlie this changing definition of what a “system” is.

May 9 in Boston, MA
“Sustainable Business in Unsustainable Times …”
presented by James B. Doyle, President and CEO of ECM RF,
and former Congressional Affairs Liaison
This talk will explore some of the changes occurring today that will impact business models for the future, not just changes in the global economy or government policy, but how the environment and disruptive technology is a game changer to the way we used to do business. There is tremendous opportunity for business in the next decade and beyond if you understand and can appreciate the speed of changes that are occurring in the environments around you. Technology coupled with knowledge holds the key to sustainable business success.
“The Evolving Role of M2M in Intelligent Systems and the Internet of Things: A Multi-perspective Panel Discussion”

When the topic of machine-to-machine (M2M) first began, it was narrower than it is today and spanned just a few markets. We’re no longer talking about connecting just a few systems on a factory floor for work-flow optimization. Rather, today it is a matter of connecting devices and people across the globe and across many functions and even the consumers. This means that how M2M is implemented has had to evolve and has to have built in flexibility to be able to enable the yet-to-come connectivity demands. Each of the panelists for this discussion brings knowledge about where M2M has been and where it has yet to go to keep pace with the growing scope of the Internet of Things (IoT).

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