Category Archives: Thermal Design

Electric Car Batteries Are Topic of Presentation by ATS CEO Dr. Kaveh Azar

Electric Car Batteries

ATS CEO Dr. Kaveh Azar will deliver a presentation on the thermal management of electric vehicle batteries on Thursday, Sept. 22. (Photo courtesy of Wikimedia Commons)

On Thursday, Sept. 22, Advanced Thermal Solutions, Inc. (ATS), a leading-edge engineering and manufacturing company focused on the thermal management of electronics, will host the New England Section of Society of Automotive Engineers International (SAE NE) for a tour of its Norwood campus and a presentation by ATS founder, President, and CEO Dr. Kaveh Azar.

Dr. Azar’s discussion is entitled, “Battery Thermal Management – The Gateway to the Successful Operation of Electric Vehicles.” He will review the role of temperature in the longevity and performance of nickel metal hydride (NiMH) and lithium-ion electric vehicle batteries; drawing analogies between battery temperature and the junction temperature of modern electronics. As Dr. Azar notes, “Both play an identical role in successful operation of their respective systems.”

There will be a discussion of the analytical methods and design criterion for predicting battery temperature and establishing safe temperature limits. Dr. Azar will present high-level possibilities for thermal management in the electric vehicle sphere as well as cooling options that are deployed for battery thermal management. Current cooling designs can be active or passive. There are forced air, liquid cooling, natural convection and conduction systems used by manufacturers.

Several thermal solutions that engineers have incorporated include increasing the thermal density of the battery, using phase-change material to store transient heat loads and graphite-impregnated paraffin waxes as gap fillers. It is also important for the designs to control temperature distribution across the battery to avoid degradation of cells.

Thermal management is crucial in the design of electric vehicle batteries because temperature has a direct correlation on battery life and performance. It will affect the battery’s ability to store and deliver a charge, weaken polymer- or fiber-based cell dividers, and could potentially lead to thermal runaway.

“The engineers who will design the next hybrid vehicle battery packs will need to be cognizant of the growing need for thermal management,” read a recent article on coolingZONE. “The increased need for thermal protection, due to safety considerations; the reduced thermal capacity, due to lesser mass; and the reduced workable volume are among the challenges to be faced. The hybrid vehicle we may soon drive must have reliable and intelligent cooling systems to cool down their high-density battery packs.”

Why is this topic of particular relevance now?

Electric vehicle sales worldwide have jumped 57 percent from 2015 to 2016, according to data reported by Bloomberg New Energy Finance. The article referenced a Bloomberg report stating that electric vehicle sales could be as much as 47 percent of the automotive market by 2040 (dependent on factors such as oil prices). In the U.S., manufacturers have been urged by President Barack Obama’s EV Everywhere challenge to make electric cars as affordable and convenient as gas-powered vehicles by 2022.

Like cell phone technology in the past two decades, electric vehicles have the potential for widespread usage and to wide-ranging effects inside and outside of the automotive industry. The “digitization of the transport system” will effect, among others, oil companies, car dealerships, maintenance services, and utility suppliers.

“If it is hard to predict when phase change in complex systems begins, it is even harder to predict where it ends,” said Michael Leibreich and Angus McCrone, the authors of the Bloomberg article. “No list of potential impacts of the ‘Transformation of Transportation’ can be complete. However, one thing is for sure: if our predictions for the uptake of electric vehicles are anything like correct, there is no part of the global economy which will not, in some way, be affected.”

Currently, electric vehicles cost an average of $30,000 and travel 100 miles or less on a single charge. Tesla (Model 3) and Chevrolet (Bolt EV) have both promised electric vehicles that will travel 200 miles on a charge within the year. Other car makers, such as Volkswagen and BMW, have announced plans to turn a large portion of their production to electric vehicles in the next few years as well.

While the changes in infrastructure and the length of time that most car owners keep a vehicle (11 years on average) have limited electric vehicle sales to this point, according to Christopher Mims of the Wall Street Journal, the next vehicle that most consumers purchase is likely to be electric.

Mims explained, “It is the nature of disruptive technological shifts that it seems like nothing is changing—until it seems as if everything is changing at once. Electric vehicles have been a long time coming, but they now represent such a clear and present threat to the gasoline engine that Mr. Fox, of the service-station association, now recommends that members signing long-term contracts for fuel include an option to renegotiate if more than 10 percent of a state’s fleet goes electric.”

Electric vehicles offer a smooth drive with better acceleration, less moving parts requiring less maintenance, better air quality, and a better platform for autonomous driving, said Bloomberg. Electric vehicles are the future and that means designing better, longer-lasting, higher-performing batteries will be the future as well.

Cooling those batteries will be critical. As Dr. Azar will explain, without proper thermal management the electric vehicle battery will be inefficient and unable to provide the performance that consumers demand.

The Sept. 22 event is free for SAE NE members and $5 for non-members. It runs from 6-9:15 p.m. with tours of the ATS campus from 7-8:00 p.m. and Dr. Azar’s presentation at 8:00. Register online at http://www.sae.org/servlets/sectionEvent?PAGE=getSectionEvents&OBJECT_TYPE=SectionEventAdmin&HEIR_CODE=MS045#249128&saetkn=w1aFMMls8Y or contact SAE member Jeff Mobed at [email protected] or 508-367-6565.

ATS’ Standard Board Level Heat Sinks for PCB

We’ve just released our new line of standard board level heat sinks. These stamped heat sinks are ideal for PCB application, especially where TO-220 packages are used. Available now through Digi-Key Electronics​ or at this link from ATS http://www.qats.com/eShop.aspx?produc…

 

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ATS maxiGRIP and superGRIP Heat Sink Attachments

Advanced Thermal Solutions John O’Day and Len Alter showcase the patented heat sink attachments maxiGRIP and superGRIP. With its patented and discrete design, these heat sink attachments are well worth it for being your only choice for a cost-effective, high performing thermal solution.

Thermal Resistance and Component Temperature

To maintain operation, the heat must flow out of a semiconductor as such a rate as to ensure acceptable junction temperatures. This heat flow encounters resistance as it moves from the junction throughout the device package, much like electrons face resistance when flowing through a wire. In thermodynamic terms, this resistance is known as conduction resistance and consists of several parts. From the junction, heat can flow toward the case of the component, where a heat sink may be located. This is referred to as ÎJC, or junction to case thermal resistance. Heat can also flow away from the top surface of the component and into the board. This is known as junction to board resistance, or ΘJB.

Source: JESD51-2, Integrated Circuits Thermal Test Method – Natural Convection, JEDEC, March 1999.

ΘJB is defined as the temperature difference between the junction and the board divided by the power when the heat path is from junction to board only. To measure ΘJB, the top of the device is insulated and a cold plate is attached to the board edge (Figure 1). This is the true thermal resistance, which is the characteristic of the device. The only problem is that, in a real application one does not know how much power is being transmitted from different paths.

Due to the multiple heat transfer paths within a component, a single resistance cannot be used to accurately calculate the junction temperature. The thermal resistance from junction to ambient must be broken down further into a network of resistances to improve the accuracy of junction temperature prediction. A simplified resistor network is shown in Figure 2.

As board layouts become denser, there is a need to design optimized thermal solutions that use the least amount of space possible. Simply put, there is no margin to allow for over-designed heat sinks with tight component spacing. Accounting for the effect of board coupling is an important part of this optimization. The possibility for using an oversized heat sink exists only if the junction to case heat transfer path is considered.

To ensure a 105°C junction temperature at 55°C ambient a typical component (see Table 1) needs a heat sink resistance of 2.05°C/W (if we ignore board conduction). When board conduction is taken into account, the actual junction temperature could be as low as 74°C, assuming the board temperature is the same as the air temperature. This indicates a heat sink that is larger than necessary.

From this example, it is clear that all heat transfer paths from the component junction must be considered. Using just the ΘJC and ΘCA values can lead to a larger than optimal heat sink and may not accurately predict operating junction temperatures. Using the proposed correlation can also predict junction temperature when the board temperature is known from experimentation, as shown in Figure 3.

 

 

How to Calculate Heat Loads for Liquid Cooling Systems

A series of calculations can be used to find the thermal loads in common liquid cooling systems. Calculations of this nature are needed to predict the performance of liquid cooling systems, which are effective but complex thermal management solutions. Several equations must be calculated to fully understand the behavior of a liquid cooled system, and ATS is providing these to engineers via personal instruction and in a paper available free from the company’s website, Qats.com.

IIn the paper, which appears in the company’s e-magazine, ATS considers a liquid cooling system as a closed loop system with three major components: cold plate, heat exchanger and pump. The cold plate is typically made from aluminum or copper, and is attached to the device being cooled. The plate usually has internal fins which transfer heat to the coolant flowing through them. This fluid moves from the cold plate to a heat exchanger where its heat is transferred to the ambient air via forced convection. The final part of the cooling loop is the pump, which drives the fluid through the loop.

A series of equations is provided to predict the final temperature of the device being cooled. The first of these equates the surface temperature of this device with the product of the power dissipated by the device times the thermal resistance of the cold plate (and its thermal interface material), added to the temperature of the water entering the cold plate.

The sequence of calculations factors in specifications from the cold plate, heat exchanger and pump. The result is a solution for the device temperature as a function of cold plate resistance. In the example cited by ATS, a cold plate thermal resistance of less than 18 degrees C/W is required to cool an Intel Xeon 5492 processor in a 25C temperature environment.

Liquid cooling is an important and expanding practice in the electronics industry. It is important to understand the impact on performance of all three major parts of liquid cooling loops (cold plate, heat exchanger and pump) to ensure an acceptable level of performance at the lowest cost.

Instructions for calculating load for liquid cooling systems are available on Qats.com in the pages of Qpedia, the thermal management emagazine from ATS. More information is also available by calling 1-781-949-2522.