Category Archives: thermal management

An Expert Speaks Out on CFD Modeling of Heat Sinks

Chris Aldham of Future Facilities has something to say about CFD modeling of heat sinks. And he should know after 30 years in the business. Chris will present a webinar for ATS on May 24, 2012 “CFD as a Tool to Perform Heat Sink and System Modeling,” that you can attend for free by registering on Qats.com.

https://www2.gotomeeting.com/register/467986842

We asked Chris to share upfront some general knowledge and opinions on the topic ….

What are some of the recent advances in CFD technology and how might they improve heat sink modeling?

The main advance I’ve seen is the increase in computer power and lowering of computer cost that has occurred over the past few years. It is now possible to solve larger (more grid cells) and more detailed (more objects and better geometrical representation) models and more of them very efficiently. So now representing the detailed geometry heat sinks in a CFD model is easy. Importing MCAD heat sink geometry and using that geometry directly in the software ensures an accurate representation of the heat sink.

The other advance is the automation possible in specialized tools such as 6SigmaET. The mesh necessary to represent the heat sink is determined automatically within the software it doesn’t rely on the user creating a good mesh.

These two trends seem set to continue so it will be possible to model increasingly complicated heat sink designs.

Meshing is very core to CFD modeling. What are the do’s and dont’s when it comes to meshing heat sink models?

I think there are two aspects to consider when meshing a heat sink. The solid geometry must be accurately captured to ensure the heat spreading and conduction through the base and up the fins is accurately represented. Then the airflow between the fins must be accurately captured. This invariably requires a fine mesh at least 3 cells between the fins and maybe more depending on the gap size.

What are some of the benefits from developing a high quality CFD model of a heat sink?

At first sight heat sinks seem quite simple in function but their interaction with the components they are cooling and the air flow around them is quite complex. The heat spreading of the heat sink base can subtly change the thermal resistance of the component. The increase in surface area the heat sink provides improves heat transfer but also represents an increased resistance (increased pressure drop) to the airflow. So a good heat sink design must balance heat spreading, heat transfer and pressure drop. As a detailed CFD model can represent all these aspects accurately in the situation in which it will be used it can be the only way to optimize them before the heat sink is manufactured and tested.

Can you cite any examples where your CFD tools led to improved heat sinks solutions?

We have published a couple of examples together with ATS Europe who have used 6SigmaET in a number of projects. One was an unusual heat sink design on an LED replacement for a traditional light bulb where a 14% improvement in lamp performance was produced (as well as a much nicer looking design in my opinion) by changing the heat sink design. This work also showed good agreement between 6SigmaET simulations and measurements performed on the real devices. See images below.

How long does it take a typical engineer to master CFD modeling? Are there any innovations in training?

I’ve been doing CFD for over 30years and I’m not sure I’ve mastered it yet. Fortunately engineers do not have master CFD modeling today as some CFD software products are focused on specific applications and these can really present CFD in a very usable form. Of course it helps if the engineers have some idea of the physics of fluid flow and heat transfer but much of the numerical work in CFD can be preset, automated and hidden away. This has been especially true in the field of electronics cooling where specialized software has been around for decades. These tools can be learned in a few days and users can be proficient in a few weeks.

How is Future Facilities different from its competitors?

Future Facilities is highly focused on a small number of related application areas. We produce software for design, operation and management of data centers which includes CFD modeling of the airflow and temperatures as well as other non-CFD analysis modules. We also use the software in our engineering consultancy group providing services that ensure the software development is focused on exactly what is needed and making it easy and efficient.

6SigmaET is a recent product focused on electronics cooling and integrated into our data center suite. Like the whole software suite it presents the user with a set of specialized intelligent objects which represent the real things encountered in electronics (pcbs, fans, heat sinks, power supply, components, etc.). As every object knows what it is, it knows how to behave and this can make creating a model very intuitive for the users. It also allows us to automate the meshing rules for each object so we can ensure a heat sink, for example, is meshed correctly.

I believe the many years of experience we have in using and developing CFD products alongside a strong focus on particular application areas and a desire to make complex technology available to engineers (expert and beginner, full-time or occasional users) makes us very different from other CFD companies.

Dr. Chris Aldham has worked in computational fluid dynamics (CFD) for over 30 years (starting with PHOENICS at CHAM with Prof. Brian Spalding) and for more than 20 years in the field of electronics cooling. After 16 years at Flomerics, Chris joined Future Facilities as a Product Manager responsible for 6SigmaET electronics cooling simulation software which is part of a suite of integrated software products that tackle head-on the challenges of data center lifecycle engineering (including equipment design analysis) through the Virtual Facility

Cooling High Power LEDs

Most LEDs are designed in SMT (surface mount technology) or COB (chip-on-board) packages. In the new 1~8W range of surface mount power LED packages, the heat flux at the devices thermal interface can range from 5 to 20 W/cm2. These AllnGaP and InGaN semiconductors have physical properties and limits similar to other transistors or ASICs (application specific integrated circuit). While the heat of filament lights can be removed by infrared radiation, LEDs rely on conductive heat transfer for effective cooling.

As higher powers are dissipated from LED leads and central thermal slugs, boards have changed to move this heat appropriately. Standard FR-4 technology boards can still be used for LEDs with up to 0.5 W of dissipation, but metallic substrates are required for higher levels. A metal core printed circuit board (MCPCB), also known as an insulated metal substrate (IMS) board, is often used underneath 1W and larger devices. These boards typically have a 1.6 mm (1/16 inch) base layer of aluminum with a dielectric layer attached. Copper traces and solder masks are added subsequently. The aluminum base allows the heat to move efficiently away from the LED to the system.

Increasing power density, a higher demand for light output, and space constraints are leading to more advanced cooling solutions. High-efficiency heat sinks, optimized for convection and radiation within a specific application, will become more and more important.

As with any semiconductor package, thermal resistance plays a significant role in the thermal management of LEDs. The highest thermal resistance in the heat transfer path is the junction-to-board thermal resistance (Rj-b) of the package [2]. Spreading resistance is also an important issue. Thermally enhanced spreader materials, such as metal core PCBs, cold plates, and vapor chambers for very high heat flux applications are viable systems to reduce spreading resistance. [3]

Linear heat sinks are available specifically for LED strips, such as OSRAM SYLVANIA’s DRAGONstick® linear LED strips, which are widely used in architectural lighting. For example,the maxiFLOW linear heat sink from Advanced Thermal Solutions, Inc., has a patented spread fin array that maximizes surface area for more effective convection (air) cooling, particularly when air flow is limited, such as inside display cases.

Round heat sinks are available specifically for round LED boards, which are used to replace halogen light bulbs, in applications such as spotlights and down lighting. A typical LED spotlight is shown in Figure 2 [5]. Here, a round QooLED© heat sink from Advanced Thermal Solutions is used for cooling three LEDs. The round heat sink has a special star-shaped profile fin design that maximizes surface area for more effective convection (air) and radiation cooling in the vertical mounting orientation, e.g., inside ceilings.

Active thermal management systems can be used for high-flux power LED applications. These include water cooling, two-phase cooling, and fans. Although active cooling methods may not be energy-justifiable for LEDs, reasons for using them include ensuring lumen output or maintenance-free operation, or to meet specific wavelength requirements.

New Hardcover Collection of Qpedia Electronics Thermal Management Articles Now Available from ATS

New Electronics Cooling Webinars are Open for Second Quarter of 2012

Each month during the second quarter of 2012, ATS will present a technical webinar covering different topics within the dynamic world of electronics cooling. Each of these one-hour, online tutorials will include detailed visuals, definitions, instructions, case studies and references. One or more ATS PhD-level thermal engineers will be presenting live. Viewers will be able to key in questions during and after the presentation.

Each Q2 webinar is planned for a Thursday afternoon (ET) late in the month. These are the second quarter topics for the ATS webinars:

April 26, 2012 at 2:00 p.m. ET

How to Perform and Understand Air Velocity Measurement within Electronics Systems

Participants will learn about the importance of measuring air velocity in a system, the instruments necessary for obtaining useful measurements and where these velocities should be recorded.

May 24, 2012 at 2:00 p.m. ET

CFD as a Tool to Perform Heat Sink and System Modeling

Computational Fluid Dynamics (CFD) tools have become indispensable simulation tools, enabling design engineers to confront electronics cooling challenges on demand. Some tips and tricks are invaluable in performing these analyses. Among them: the simplest methods of preparing a CFD model; the best techniques for meshing; and how to model a systems components, such as fans and perforated plates. Attendees will learn about common and not-so-common issues in CFD, and how to overcome them.

June 28, 2012 at 2:00 p.m. ET

Heat Sink Selection Made Easy

As heat dissipation needs for electronic devices rapidly grow, choosing the right heat sink the first time is essential. With so many application requirements and heat sink options, this can be a daunting task. In this webinar, attendees will learn about the importance of system airflow and its impact on heat sink design; attachment methods; and how to solve thermal design challenges.

Seats at each of these webinars are free, but limited. Registration is available online at http://www.qats.com, or by calling 1-781-949-2522.

This Fixed Cost Plan for Cooling Hot PCBs Saves Money, Simplifies Ordering

For one fixed cost, a QoolPCB plan includes the full set of ATS heat sinks,  attachment devices and all other parts required for the effective thermal management of a PCBs components. There are no additional costs for the thermal engineering, performance testing, procurement or shipping. The heat sinks and hardware are kitted and provided for the full volume of boards requiring cooling.

Pricing for a QoolPCB solutions is based on the number of heat sinks that a specific PCB requires for efficient thermal management. For example, if thermal analysis and testing show that a PCB needs 10 heat sinks to operate safely, the fixed price for the heat sinks and hardware for a production volume of that PCB would be just $50 per board. For larger boards, or those with many hot components, the unit cost per heat sink is reduced.

Whether the solutions are for off-the-shelf heat sinks, custom designed, or a combination of both, the QoolPCB program from ATS provides it at fixed cost. QoolPCB eliminates separate costs for design, tooling, samples, verification and supply chain management. The program offers multiple benefits for companies looking to reduce their product development costs, speed time-to-market and ensure thermal reliability.

To participate, PCB developers simply provide 3D CAD models of their board layout, along with the technical specifications, including power dissipation of all board components. ATS performs a full thermal analysis of the PCB and develops a comprehensive cooling solution for each component on the board. Where possible, ATS engineers will specify existing heat sinks from a portfolio of more than 3000 off-the-shelf and application-specific designs and with in-stock attachment systems.

If any custom heat sinks are required to bring certain components within their manufacturer-designated running temperatures, ATS assumes all tooling charges and sample production costs, including any customized heat sink attachment hardware. In addition, ATS will perform all physical testing at its Thermal Characterization Laboratory, which features advanced open loop and closed loop wind tunnels, temperature and velocity measurement sensors and other analysis instrumentation, to verify the cooling design. All designs and performance reports are provided to customers, who can perform their own thermal analyses and verification studies using the ATS characterization lab and samples of the actual heat sink solutions at no extra cost.

More information about the QoolPCB thermal management program from ATS is available at: http://www.qats.com/Services/QoolPCB—PCB-Cooling-At-Fixed-Cost/57.aspx