Tag Archives: ATS

2013 Webinar Calendar Released

ATS will provide two free technical webinars each month in 2013. Presented by PhD-level thermal engineers, each event will focus on an important area of electronics thermal management. The tutorials will provide practical training and insights for all engineers, designers and program managers who want to learn more about electronics cooling.

Most of the ATS webinars are scheduled to run no longer than 15 minutes in respect to the time demands on todays engineers. But each quarter of 2013 will conclude with a one-hour event that presents deeper training on a crucial heat management topic.

Every webinar is free of charge. Attendees can submit questions during the live presentations. For later viewing, each webinar will be archived on the ATS website for free streaming at the engineers convenience. Questions and comments to the recorded webinars will be responded to by ATS engineers.

ATS Webinars

Here are the 2013 ATS webinar dates, run times and titles:

Jan 9: What is the Thermal Management of Electronics?

Jan 23: Thermal Interface Material Overview: Pros and Cons

Feb 13: Calculating Junction Temperature in Electronics Cooling

Feb 27: Important Factors When Doing Heat Sink Design

Mar 13: Analytical Modeling for Thermal Analysis

Mar 27: Heat Sink Materials: Choices and Tradeoffs

Apr 10: LED Cooling: Whats So Hot about LEDs?

Apr 24: LED Cooling: Analytical Thermal Analysis

May 8: LED Cooling: Computational Thermal Analysis

May 22: LED Cooling: Physical Thermal Analysis

Jun 12: Heat Sink Fin Spacing for Heat Transfer Optimization

Jun 26: Temperature Measurements Within Electronic Systems

Jul 10: Heat Sink Types: Pros and Cons

Jul 24: Heat Sink Manufacturing Processes

Aug 14: Thermal Conductivity: What It Is and Why You Should Care

Aug 28: How to Perform Pressure Drop Calculations

All webinars are on Wednesdays at 2pm. Please visit www.qats.com/training to view the entire list of webinars, on-demand webinars in the archive, and to register for the full hour, live tutorials.

Some Basic Principles of Wind Tunnel Design

Wind tunnels generate uniform air flows, with low turbulence intensity, for thermal and hydraulic testing. These devices have been around for more than a century, and are used in many industries, including aerospace, automotive, and defense. They also play a key role in electronics thermal management. Wind tunnels are made in different shapes and sizes, from just 30 cm long to large enough to contain a passenger airplane. But the basic idea behind all wind tunnels is universal.

There are two basic kinds of wind tunnels. One is the open type, which draws its air from the ambient and exits it back to the ambient. This kind of wind tunnel provides no temperature controls. The air follows the ambient temperature. The second type of wind tunnel is the closed loop wind tunnel, whose internal air circulates in a loop, separating it from outside ambient air. The temperature in a closed loop wind tunnel can be controlled using a combination of heaters and heat exchangers. Air temperatures can be varied from sub-ambient to over 100oC. Figure 1 shows a schematic of a closed loop wind tunnel.

In general, closed loop wind tunnels are made with the following sections:

1-Test section

2-Settling chamber

3-Contraction area

4-Diffuser

5-ÂBlower assembly

6-Heater/heat exchanger assembly

Figure 1. Schematic of an ATS Closed Loop Wind Tunnel.

A good quality wind tunnel will have a flow uniformity of 0.5-2% and turbulence intensity of 0.5-2%. It should provide temperature uniformity within 0.1-0.5oC at the inlet of the test section [1].

108K different push pin heat sink assembly configurations featuring 3 different pitch heat sink types, 3 different fin geometries, brass and plastic push pins

 

To achieve uniform, high quality flow in the test section, the settling chamber and the contraction area are used to smooth the flow. The role of the settling chamber, which is upstream of the contraction area, is to eliminate swirl and unsteadiness from the flow. The settling chamber includes a special honeycomb and a series of screens. As long as a flows yaw angles are not greater than about 10o, a honeycomb is the most efficient device for removing swirl and lateral velocity variations and to make the flow more parallel to the axial axis [2]. Large yaw angles will cause honeycomb cells to stall, which increases the pressure drop and causes non-uniformity in the flow. For large swirl angles, screen meshes should be placed before the honeycomb. For swirl angles of 40o, a screen with a loss factor of 1.45 will reduce yaw and swirl angles by a factor of 0.7. Several screens are needed upstream of the honeycomb to bring the swirl down to 10o.

Using a honeycomb will also suppress the lateral components of turbulence. Complete turbulence annihilation can be achieved in a length of 5-10 cell diameters [2]. Honeycombs are also known to remove the small scale turbulence caused by the instability of the shear layer in front of them. This instability is proportional to the shear layer thickness, which implies a short honeycomb has a better ratio of suppressed turbulence to that generated.

Screens break up large eddies into smaller ones which decay faster. They lower turbulence drastically when several screens are placed in a row. Screens also make flow more uniform by imposing a static pressure drop which is proportional to velocity squared. A screen with a pressure drop coefficient of 2 removes nearly all variations of longitudinal mean velocity. Low open area screens usually create instabilities. In general, screens should have openings larger than 57%, with wire diameters about 0.14 to 0.19 mm. Sufficient distance is needed between multiple screens to stabilize static pressure from perturbation. This distance is typically a percentage of the settling chamber diameter.

The contraction area is perhaps the most important part of a wind tunnel’s design. Its main purpose is to make the flow more uniform. It also increases the flow at the test section, which allows flow conditioning devices to be at lower flow section with less pressure drop. Batchelor used the rapid distortion theory and estimated the variation in mean velocity and turbulence intensity [3]

A considerable number of shapes have been investigated for contraction, including 2-D, 3-D and axisymmetric shapes with various side profiles.

The shape of the contraction can be found using potential flow analysis. Consider the axisymmetric contraction shown in Figure 2 [4]

Figure 2. Schematic of an Axisymmetric Contraction [4].

The design of a wind tunnel is a lengthy process and, as shown above, it requires extensive knowledge and experience in both theory and construction. A novice might attempt to construct a tunnel, but considering the time spent, it might not be justified economically. Wind tunnel design also depends on economic and space constraints. Larger wind tunnels allow more space to have all the conditioning elements in place. A space-constrained wind tunnel must compromise some features at the cost of reduced flow quality, but can still be acceptable for practical engineering purposes.

References

  1. Azar, K., Thermal Measurements in Electronics Cooling, Electronics Cooling Magazine, May 2003.
  2. Bell, J. and Mehta, R., Design and Calibration of the Mixing Layer and Wind Tunnel, Stanford University, Department of Aeronautics and Astronautics, May 1989.
  3. Batchelor, G., The Theory of Homogeneous Turbulence, Cambridge University Press, 1953.
  4. Edson, D. and Joao, B., Design and Construction of Small Axisymmetric Contractions, Faculdade de Engenharia de Ilha Solteira, Brazil, 1999.

Announcing our ATS Electronics Cooling Webinars for Third Quarter of 2012

ATS, Advanced Thermal Solutions, Inc. will present technical webinars on electronic cooling topics in July, August and September 2012. Each of these free events will provide engineering-level training in a key area of modern thermal management.

Here are the different webinar topics and presentation times:

Using Thermal Interface Materials to Improve Heat Sink Thermal Performance

July 26, 2012 at 2:00 p.m. ET

To cool hotter components, engineers are using larger fans and heat sinks, and increasing surface areas. These hardware enhancements can add significantly to design costs. In many cases, cooling performance can be improved by using a higher performance interface material between the case and the heat sink. Participants will learn the importance of lowering thermal resistance using thermal interface materials, or TIMs, and the different kinds of TIMs available from the market.

Air Jet Impingement Cooling

August 23, 2012 at 2:00 p.m. ET

Ongoing increases in power in devices such as processors and IGBTs mean that higher capacity cooling methods are needed to remove excess heat. One such method is the jet impingement of a liquid or gas onto a surface on a continuous basis. Lab experiments at ATS have shown up to a 40% improvement in cooling achieved using this method. This webinar will explore jet impingement cooling theory, implementation and best practices.

LED Thermal Management in Commercial and Consumer Lighting Applications

September 27, 2012 at 2:00 p.m. ET

Excess heat directly affects both short-term and long-term LED performance. The short-term effects are color shift and reduced light output, while the long-term effect is accelerated lumen depreciation and thus shortened useful life. Participants will learn how to diagnose and solve thermal issues in consumer and commercial LED applications.

Each of these one-hour online tutorials will include detailed visuals, real world examples, instructions, definitions and references. Audience questions will be answered by the presenters during and after the presentation. One or more ATS PhD-level thermal engineers will be presenting live.

There is no cost to attend these ATS webinars, but virtual seating is limited. Registration is available online at http://www.qats.com, or by calling 1-781-949-2522.

http://qats.com/Training/Webinars/7.aspx

 

Performance Differences between Fan Types Used for Electronics Cooling

Billions of fans are now in use for active cooling of PCBs and other hot electronic components. An article in Qpedia, the thermal e-magazine from Advanced Thermal Solutions, Inc., (ATS), explores the two most common types of fans used in electronics cooling: the radial (or centrifugal) fan and the axial fan.

The difference between the axial fan and radial fans can be divided into two parts, namely geometry and fluid dynamics.

An axial-flow fan has blades that force air to move in a parallel direction to the shaft around which the blades rotate. For a radial fan, the air flows in on a side of the fan housing, then turns 90 degrees and accelerates, due to centrifugal force as it exits the fan housing. These differences in air flow direction have design implications. For example, a radial fan can blow air across a PCB more efficiently, and use less space, than mounting an axial fan to blow air down onto a board.

The fluid flow rate through an electronics system, e.g., enclosure, is determined by the intercept between the fan and system curves that plot the air pressure drop over volumetric flow rate. A system’s air flow curve can be calculated using 1D fluid mechanics, or it may require the use of high performance CFD or experimental data. In general, for the same power and rotation speed, the radial fan can achieve a higher pressure head than an axial fan. However, an axial fan can achieve a higher maximum flow rate than a radial fan.

In theory, this same approach applies when using two fans in series or in parallel. When the fans are in series, the maximum flow rate should stay the same as for the single fan, but the maximum pressure head doubles. When using two fans in parallel, the maximum pressure head should remain the same as for the single fan, but the flow rate doubles. In real situations, though, the fans may interfere with each other, thus providing lower than expected results. Thus, actual experimentation is typically needed.

Download the Full ATS White Paper Performance Differences Between Fans and Blowers and Their Implementation

An Instrument for Measuring Air Velocity, Pressure and Temperature in Electronics Enclosures

For engineer-level thermal management studies, the iQ-200 instrument from Advanced Thermal Solutions, Inc, ATS, can simultaneously measure air velocity, air pressure and the temperature of components and surrounding air at multiple locations inside electronic systems. This enables users to obtain full and accurate profiles of components, heat sinks, PCBs and other electronics hardware to enable more effective thermal management.

Developed by Advanced Thermal Solutions, Inc., ATS, the iQ-200 system simultaneously captures data from up to 12 J-type thermocouples, 16 air/velocity sensors, and four pressure sensors.

The thermocouples provide surface area temperature measurements on heat spreaders, component packages, housing hardware, and elsewhere to track heat flow or detect hot spots. Temperature data is tracked from -40 to 750°C. The sensors (available separately) measure both air temperature and velocity at multiple points allowing a detailed analysis of airflow.

Candlestick Sensor from ATS

Thin, low profile ATS candlestick sensors can be easily positioned throughout a system under test and measure airflow from -10 to +6°C. Air velocity is measured from natural convection up to 6 m/s (1200 ft/min). The iQ-200 can be factory modified to measure airflow to 50 m/s (10,000 ft/min) and air temperature up to 85°C. Four differential transducers capture pressure drop data along circuit cards, assemblies and orifice plates. Standard pressure measurement capabilities range from 0- 1,034 Pa (0 – 0.15 psi).

The ATS iQ-200 system comes preloaded with user-friendly iSTAGE application software which effectively manages incoming data from the various sensor devices, and allows rich graphic presentation on monitors and captured on videos or documents. The iQ-200 connects via USB to any conventional PC for convenient data management, storage and sharing.

More information on the iQ-200 system from ATS can be found on Qats.com (http://www.qats.com/products/Temperature-and-Velocity-Measurement/Instruments/iQ-200/2632.aspx), or by calling 781-769-2800.