Tag Archives: ATS

An Expert Speaks Out on CFD Modeling of Heat Sinks

Chris Aldham of Future Facilities has something to say about CFD modeling of heat sinks. And he should know after 30 years in the business. Chris will present a webinar for ATS on May 24, 2012 “CFD as a Tool to Perform Heat Sink and System Modeling,” that you can attend for free by registering on Qats.com.

https://www2.gotomeeting.com/register/467986842

We asked Chris to share upfront some general knowledge and opinions on the topic ….

What are some of the recent advances in CFD technology and how might they improve heat sink modeling?

The main advance I’ve seen is the increase in computer power and lowering of computer cost that has occurred over the past few years. It is now possible to solve larger (more grid cells) and more detailed (more objects and better geometrical representation) models and more of them very efficiently. So now representing the detailed geometry heat sinks in a CFD model is easy. Importing MCAD heat sink geometry and using that geometry directly in the software ensures an accurate representation of the heat sink.

The other advance is the automation possible in specialized tools such as 6SigmaET. The mesh necessary to represent the heat sink is determined automatically within the software it doesn’t rely on the user creating a good mesh.

These two trends seem set to continue so it will be possible to model increasingly complicated heat sink designs.

Meshing is very core to CFD modeling. What are the do’s and dont’s when it comes to meshing heat sink models?

I think there are two aspects to consider when meshing a heat sink. The solid geometry must be accurately captured to ensure the heat spreading and conduction through the base and up the fins is accurately represented. Then the airflow between the fins must be accurately captured. This invariably requires a fine mesh at least 3 cells between the fins and maybe more depending on the gap size.

What are some of the benefits from developing a high quality CFD model of a heat sink?

At first sight heat sinks seem quite simple in function but their interaction with the components they are cooling and the air flow around them is quite complex. The heat spreading of the heat sink base can subtly change the thermal resistance of the component. The increase in surface area the heat sink provides improves heat transfer but also represents an increased resistance (increased pressure drop) to the airflow. So a good heat sink design must balance heat spreading, heat transfer and pressure drop. As a detailed CFD model can represent all these aspects accurately in the situation in which it will be used it can be the only way to optimize them before the heat sink is manufactured and tested.

Can you cite any examples where your CFD tools led to improved heat sinks solutions?

We have published a couple of examples together with ATS Europe who have used 6SigmaET in a number of projects. One was an unusual heat sink design on an LED replacement for a traditional light bulb where a 14% improvement in lamp performance was produced (as well as a much nicer looking design in my opinion) by changing the heat sink design. This work also showed good agreement between 6SigmaET simulations and measurements performed on the real devices. See images below.

How long does it take a typical engineer to master CFD modeling? Are there any innovations in training?

I’ve been doing CFD for over 30years and I’m not sure I’ve mastered it yet. Fortunately engineers do not have master CFD modeling today as some CFD software products are focused on specific applications and these can really present CFD in a very usable form. Of course it helps if the engineers have some idea of the physics of fluid flow and heat transfer but much of the numerical work in CFD can be preset, automated and hidden away. This has been especially true in the field of electronics cooling where specialized software has been around for decades. These tools can be learned in a few days and users can be proficient in a few weeks.

How is Future Facilities different from its competitors?

Future Facilities is highly focused on a small number of related application areas. We produce software for design, operation and management of data centers which includes CFD modeling of the airflow and temperatures as well as other non-CFD analysis modules. We also use the software in our engineering consultancy group providing services that ensure the software development is focused on exactly what is needed and making it easy and efficient.

6SigmaET is a recent product focused on electronics cooling and integrated into our data center suite. Like the whole software suite it presents the user with a set of specialized intelligent objects which represent the real things encountered in electronics (pcbs, fans, heat sinks, power supply, components, etc.). As every object knows what it is, it knows how to behave and this can make creating a model very intuitive for the users. It also allows us to automate the meshing rules for each object so we can ensure a heat sink, for example, is meshed correctly.

I believe the many years of experience we have in using and developing CFD products alongside a strong focus on particular application areas and a desire to make complex technology available to engineers (expert and beginner, full-time or occasional users) makes us very different from other CFD companies.

Dr. Chris Aldham has worked in computational fluid dynamics (CFD) for over 30 years (starting with PHOENICS at CHAM with Prof. Brian Spalding) and for more than 20 years in the field of electronics cooling. After 16 years at Flomerics, Chris joined Future Facilities as a Product Manager responsible for 6SigmaET electronics cooling simulation software which is part of a suite of integrated software products that tackle head-on the challenges of data center lifecycle engineering (including equipment design analysis) through the Virtual Facility

New maxiFLOW Heat Sinks for Cooling DC-DC Converters


ATS now provides maxiFLOW heat sinks specially designed to cool eighth, quarter, half and full brick size DC-DC converters. The patented maxiFLOW heat sink design reduces air pressure drop and provides more surface area for more effective convection (air) cooling. The same ATS maxiFLOW technology is used in heat sinks cooling millions of BGAs and other PCB components,

The brick DC-DC converter heat sinks offer a range of fin patterns, directions and profiles to match different height and weight restrictions and airflow patterns. All of these heat sinks are protected with a gold anodized finish.

Each heat sink is provided pre-assembled with a layer of Chomerics T766 Thermflow phase change thermal interface material to enhance heat transfer from brick to heat sink. All of these heat sinks also come with three sets of screws in lengths of 5, 6 and 8 mm for varied attachment situations. The heat sinks pre-drilled hole patterns fit all major DC-DC converter designs.

DC-DC converters are circuits which convert direct current (DC) from one voltage level to another. They are extensively used in electronic devices serving communications, computing, data storage, health care, industrial equipment, instrumentation and test and measurement. Heat sinks are typically required to keep the converters running within safe operating temperatures.

This Fixed Cost Plan for Cooling Hot PCBs Saves Money, Simplifies Ordering

For one fixed cost, a QoolPCB plan includes the full set of ATS heat sinks,  attachment devices and all other parts required for the effective thermal management of a PCBs components. There are no additional costs for the thermal engineering, performance testing, procurement or shipping. The heat sinks and hardware are kitted and provided for the full volume of boards requiring cooling.

Pricing for a QoolPCB solutions is based on the number of heat sinks that a specific PCB requires for efficient thermal management. For example, if thermal analysis and testing show that a PCB needs 10 heat sinks to operate safely, the fixed price for the heat sinks and hardware for a production volume of that PCB would be just $50 per board. For larger boards, or those with many hot components, the unit cost per heat sink is reduced.

Whether the solutions are for off-the-shelf heat sinks, custom designed, or a combination of both, the QoolPCB program from ATS provides it at fixed cost. QoolPCB eliminates separate costs for design, tooling, samples, verification and supply chain management. The program offers multiple benefits for companies looking to reduce their product development costs, speed time-to-market and ensure thermal reliability.

To participate, PCB developers simply provide 3D CAD models of their board layout, along with the technical specifications, including power dissipation of all board components. ATS performs a full thermal analysis of the PCB and develops a comprehensive cooling solution for each component on the board. Where possible, ATS engineers will specify existing heat sinks from a portfolio of more than 3000 off-the-shelf and application-specific designs and with in-stock attachment systems.

If any custom heat sinks are required to bring certain components within their manufacturer-designated running temperatures, ATS assumes all tooling charges and sample production costs, including any customized heat sink attachment hardware. In addition, ATS will perform all physical testing at its Thermal Characterization Laboratory, which features advanced open loop and closed loop wind tunnels, temperature and velocity measurement sensors and other analysis instrumentation, to verify the cooling design. All designs and performance reports are provided to customers, who can perform their own thermal analyses and verification studies using the ATS characterization lab and samples of the actual heat sink solutions at no extra cost.

More information about the QoolPCB thermal management program from ATS is available at: http://www.qats.com/Services/QoolPCB—PCB-Cooling-At-Fixed-Cost/57.aspx

 

Getting the Maximum Performance from Heat Sink Clips

As power levels for board components have risen, thermal engineers have been forced to design larger and more innovative heat sinks than ever before. Along with the thermal challenge has come the mechanical challenge of attaching these heat sinks to the components in a reliable fashion.

One of the most popular methods uses some form of clip. These are low in price and easily applied. Smart engineering has led to clip systems that provide strong, even pressure well beyond the working life of the component. They hold their heat sinks tight even when dropped or shocked, but they can be unclipped manually whenever it’s necessary.

Clips that attach directly to the component provide an advantage over other clip types, (e.g. z-clips) in that no holes are required in the PWB. The ATS maxiGRIP is an example of such an attachment. maxiGRIP uses a plastic frame clip that attaches directly to the component and provides a mounting platform for a custom spring clip (Figure 5).


The frame clip is installed, using a special tool which expands all four sides of the clip simultaneously, allowing the clip to be placed directly over the component package (A keep out area is usually required). Once released, tabs on each side engage and secure the clip to the component, creating a secure mounting platform for the spring clip. The spring clip, which is designed to provide a very precise load, is then installed to hold the heat sink in place, maintaining continuous pressure at the heat sink component interface. The maxiGRIP assembly has a big advantage over other heat sink attachment methods in that it allows for the use of high performance phase change interface materials.

Extensive FEA and shock and vibration testing of the maxiGRIP assembly have been done to provide a carefully engineered heat sink attachment solution with a high-level of reliability.

Check out the new and improved LED Cooling Resource Kit

ATS, Advanced Thermal Solutions, Inc, has compiled several expert technical resources for thermally managing LED lighting. The Expert Resource Kit for Better Thermal Management of LED Lighting is compendium of free downloadable information.

The Kit is specifically for thermal management professionals in the LED lighting industry and for engineers who are responsible for ensuring the proper performance of LED designs.

Included in the Resource Kit are:

  • LED Heat Transfer and Cooling Options: Lighting the Way for LED Development
  • Mentor Graphics Webinar (free registration required): Diagnosing and Solving Thermal Challenges in Next Generation LED
  • ATS Case Study: Feasibility Study of an LED-Based Lighting System Using Analytical Modeling
  • ATS Article: How to Cool High Power LEDs
  • Clemens Lasance Lecture on LED Thermal Management: Thermal Management for LED Applications: What is the Role of the PCB?
  • Clemens Lasance, Michael Gay, Norm Berry, Richard A. Wessel on MCPCBs for LED Applications:MCPCBs for LED Applications, Thermal Management Material Specifications
  • Dr. Kaveh Azar Video Interview: LED Heat Sink Types and Applications

The free LED Cooling Resource Kit can be accessed at: http://qats.com/cms/free-thermal-management-led-lighting-resource-kit/