Author Archives: Josh Perry

Power Brick: #GoldStandard Heat Sinks for DC/DC Converters

Power Brick

ATS Power Brick heat sinks are the #GoldStandard for cooling eighth, quarter, half, and full brick DC/DC power converters. (Advanced Thermal Solutions, Inc.)


Advanced Thermal Solutions, Inc. (ATS) has a line of Power Brick heat sinks (available through Digi-Key Electronics and Arrow) that are specially designed to cool eighth-, quarter-, half-, and full-sized DC to DC power converters and power modules. Power Brick heat sinks feature ATS’ patented maxiFLOW™ design, which reduces the air pressure drop and provides greater surface area for more effective convection cooling.

Power Brick heat sinks are a critical component for the optimal thermal management of electronic devices because DC/DC power converters are used in many applications and across a number of industries, including communications, health care, computing, and more.

DC/DC converters are electronic circuits that convert direct current (DC) from one voltage to another. Converters protect electronic devices from power sources that are too strong or step up the level of the system input power to ensure it runs properly. The process works by way of a switching element that turns the initial DC signal into a square wave, which is alternating current (AC), and then passes it through a second filter that converts it back to DC at the necessary voltage.

As explained in an article on MaximIntegrated.com, “Switching power supplies offer higher efficiency than traditional linear power supplies. They can step-up, step-down, and invert. Some designs can isolate output voltage from the input.”

When converting electrical input to the proper voltage, DC/DC converters operate at a specified efficiency level, with some energy lost to heat. ATS Power Brick heat sinks provide the necessary step of dissipating that heat away from the converter to lower the junction temperature. This will optimize the performance of the component and ensure the longevity of the converter.

Anodization boosts Power Brick heat transfer capability

The pleasing gold color that has made Power Brick one of the most popular lines of heat sinks for DC/DC converters stems from the anodization process that ATS uses for its heat sinks. Anodization, as noted in an earlier blog post on this site, “changes the microscopic texture of a metal, making the surface durable, corrosion- and weather-resistant.”

Surface anodization works by turning the metal into the anode (positive electrode) of an electrolytic circuit. By passing an electric current through an acidic electrolytic solution, hydrogen is released at the cathode (negative electrode) and oxygen is released at the anode. The oxygen on the surface of the metal anode forms a deposit of metal oxide of varying thickness – anywhere from 1.8-25 microns.

The previous article explained, “The advantages of surface anodizing are the dielectric isolation of the cooling components from their electronics environment, and the significant increase in their surface emissivity.”

The emissivity coefficient of an anodized surface is typically 0.83-0.86, which is a significant boost from the standard coefficient of aluminum (0.04-0.06). By increasing the emissivity of the metal, there is also a significant enhancement of the metal’s radiant heat transfer coefficient.

The eye-catching gold color of ATS Power Brick heat sinks is added during the anodization process.

maxiFLOW™ design gives Power Brick an edge

Anodization of heat sinks is a standard practice to ensure that the metal components can withstand the rigors of dissipating heat from high-powered components. The feature that gives an ATS Power Brick heat sink the significant edge on its competitors is its patented maxiFLOW™ fin geometry, which has higher thermal performance for the physical volume it occupies compared to other heat sink designs.

maxiFLOW™ design is a low-profile, spread-fin array, which offers greater surface area for convection cooling. While it offers more surface area, it does not require additional space within the electronics package. This is an important feature in today’s electronics devices, which have an ever-increasing component density and in which space is always at a premium. This is an especially important feature for designers that want to cool DC/DC converters but are limited in the amount of available room.

Independent testing at Northeastern University of various heat sink designs demonstrated that maxiFLOW™ had the lowest thermal resistance for natural and forced convection, particularly when air flow velocity was below two meters per second. For heat sinks with the same base dimensions and fin height, maxiFLOW™ performed the best.

Testing has demonstrated that maxiFLOW™ can produce 20 percent lower junction temperatures and 40 percent lower thermal resistance than other heat sink designs. Utilizing maxiFLOW™ allows ATS Power Brick heat sinks to meet the industry standard base plate temperature of 100°C.
For more information about maxiFLOW™, watch the video below:

Power Brick meets industry standards

In the DC/DC market, there are a number of standard footprints that manufacturers use to offer flexibility for designers in choosing a vendor and in laying out a PCB. ATS has addressed the industry standard footprints with its Power Brick heat sinks. This will facilitate the use of the heat sinks for thermal management.

By optimizing the thermal management and meeting industry standards, Power Brick heat sinks can provide cost savings and reduce MTBF. Rather than having to over-design a system or a layout, engineers can turn to Power Brick as a thermal solution.

It is not only the industry standard footprints that Power Brick heat sinks have matched but also the standard hole patterns, which meet the standards set by the Distributed-power Open Systems Alliance (DOSA) to make assembly easy. The three millimeter holes (and soon 3.5 mm) match up to sizes commonly used in power brick manufacturing to ensure the proper connection for the heat sink (to avoid increasing the thermal resistance) and also to avoid using additional space in the tight confines of a PCB.

For the above reasons, Power Brick heat sinks are the “gold standard” for cooling DC/DC converters. Learn more in the video below:

For more information about Advanced Thermal Solutions, Inc. thermal management consulting and design services, visit www.qats.com or contact ATS at 781.769.2800 or [email protected].

References

i http://uk.rs-online.com/web/generalDisplay.html?file=automation/dc-converters-overview&id=infozone
ii https://www.maximintegrated.com/en/app-notes/index.mvp/id/2031
iii https://www.qats.com/cms/2010/11/09/how-heat-sink-anondization-improves-thermal-performance-part-1-of-2/
iv https://www.qats.com/cms/wp-content/uploads/2013/09/Qpedia_Oct08_How-Air-Velocity-Affects-HS-Performance.pdf

Industry Tips for Placing DC/DC Converters on PCB

DC/DC Converters

This article outlines industry tips and suggestions about placing DC/DC power converters on a PCB with other components. (Advanced Thermal Solutions, Inc.)

The design of a printed circuit board (PCB) that includes isolated DC to DC power converters is an important consideration to ensure the optimal performance of a system. Engineers have to be concerned with parasitic impedance and capacitance, the effects of the electromagnetic field created by the power converter on nearby components, as well as voltage accuracy, environmental noise reduction, and limiting radiated electro-magnetic interference (EMI).

This electromagnetic effect can cause significant voltage drops and improper design of a PCB could force engineers to make potentially costly changes (in terms of design time and budget), such as additional circuitry or upgrades to external components like power switches and capacitors.(i)

There are many advantages to using DC/DC converters and engineers adding these power bricks to a PCB do not have to be experts on power supply design, since the Distributed-power Open Systems Alliance (DOSA) has defined the industry standards for footprints and pinouts. Engineers know ahead of time how much space to dedicate and how the converter will be connected to the board.(ii)

“The brick typically comprises all the components (apart from filter circuits) required for a switching power supply including MOSFET switches, energy storage components, and switching controller,” writes Steven Keeping of Electronic Products on DigiKey.com. “By selecting a brick, an engineer does not have to worry about the intricacies of switching power supply design. The supplier has done all the work to ensure the unit operates optimally.”

While much of the work has been done by the manufacturer of the DC/DC converter to ensure its proper function, the engineer designing the system still has to consider the converter’s placement on a board carefully.

Parasitic Resistance, Impedance, and Capacitance

The most prominent issue that DC/DC converters can cause on a PCB is parasitic resistance, capacitance, and impedance. The power module creates an electromagnetic field that could disrupt the performance of components within its boundaries. As noted above, this could cause an unwanted voltage drop for the system and force more external power to be pushed through the converter.

According to a report published by members of the Institute of Electrical and Electronics Engineers (IEEE) from Georgia Tech University, “Short and wide routing traces have lower parasitic resistances and inductances and therefore superimpose less ill-fated effects to the system. As a result, to reduce the parasitic resistance and inductance, the first rule in PCB layout is to place connected power components as close as possible and in a way that their interconnection lengths are minimal.”(iii)

An article on DigiKey.com adds, “The signal traces should not be routed underneath the module, unless they are sandwiched between ground planes, to avoid noise coupling. Similarly, to prevent any coupling, no component should be placed under the module.”(iv)

The IEEE report continued, “Ground planes are effectively close high-speed return paths for average forward signal paths, but arbitrarily increasing the ground plane may not necessarily reach critical nodes. In PCB technologies with more than two layers, middle layers are normally dedicated to ground planes, thereby decreasing their distance to high-current forward switching paths.”

It also recommended using parallel connections for the supply ground, load ground, and measurement instrument’s ground rather than series connectors that are potentially unreliable and that can add impedance between nodes. The report stated, “Undesired noise and high temperature gradients across the PCB usually result when problems with supply ground connections exist.”

DC/DC converters regulate the voltage supply to the system from external power supplies, which makes accuracy a critical component of its performance. In order to ensure the optimal accuracy, it is recommended that the feedback sense terminal is connected as close to the load as possible. It is this voltage that will be converted.

(Advanced Thermal Solutions, Inc.)

Radiated Electromagnetic Interference

Another major concern for placing a DC/DC converter on a PCB is the amount of radiated electromagnetic interference (EMI) is emitted from the module. This is limited by industry standards (CISPR in Europe and FCC in the U.S.) but, as converters work by converting input voltage to AC before converting it back to DC at the correct voltage, there is an electromagnetic field that is produced when the converter is in use.

To minimize the effects of this EMI, “High-frequency nodes should be as short as possible. The metal paths act as antennas and their frequency range is directly proportional to their length. High frequency signal-return paths should be as close as possible to their respective forward paths. The two traces will therefore generate equal but opposite magnetic fields, canceling each other and hence reducing radiated EMI.”(v)

Tim Hegarty, writing for EDN Network, said, “A passive shield layer is established by placing a ground plane as close as possible to the switching loop by using a minimum dielectric thickness. The horizontal current flow on the top layer sets up a vertical flux pattern. The resulting magnetic field induces a current, opposite in direction to the power loop, in the shield layer.

“By Lenz’s Law, the current in the shield layer generates a magnetic field to counteract the original power loop’s magnetic field. The result is an H-field self-cancellation that amounts to lower parasitic inductance, reduced switch-node voltage overshoot, and enhanced suppression of EMI. Having an uninterrupted, continuous shield plane on layer 2 underneath and at closest proximity to the power loop offers the best performance.”(vi)

On DigiKey.com, Steve Taranovich of Electronic Products Magazine wrote, “The input of a DC/DC power module is a constant power at low frequencies. As the voltage decreases, current increases. This will present negative impedance at the input source. The converter will oscillate when the combination of the input filter’s impedance and the power module impedance becomes negative, causing a mismatch to occur. One way to prevent this is to ensure that the output impedance of the filter is much smaller than the input impedance of the power module at all frequencies.”(vii)

Another issue related to electromagnetic field is ground bounce, which is produced by changing magnetic flux due to the fast-changing currents. One of the solutions to prevent this problem, which could cause noise in video and audio devices, is to ensure that “true ground” is at the low end of the load and that all the other points are part of the ground return. In a two-layer PCB, Jeff Barrow of Analog.com also suggests, “A well-planned cut in the ground plane will constrain the return current to a minimum loop area and greatly reduce the bounce. Any residual bounce voltage that is developed in the cut return line is isolated from the general ground plane.”(viii)

Conclusions

Industry standard DC/DC converters have made adding a power supply to a PCB easier for engineers in terms of known sizes and connections. The footprint of a power module is known, but engineers still have important considerations to make before deciding where it should be placed. Keeping in mind the effects of parasitic impedance, capacitance, and resistance and ensuring that the electromagnetic interference will not surpass industry standards or affect other components on the board will ensure optimal performance of the system as a whole.

Using the design tips that are listed here, engineers are well on their way to creating an effective PCB layout with a DC/DC converter. Using Advanced Thermal Solutions, Inc. (ATS) Power Brick heat sinks will ensure the proper thermal management of the converters and of the board.
Learn more about Power Brick heat sinks at https://www.qats.com/eShop.aspx?productGroup=0&subGroup=2&q=Power%20Brick.

For more information about Advanced Thermal Solutions, Inc. thermal management consulting and design services, visit www.qats.com or contact ATS at 781.769.2800 or [email protected].

References

i http://rincon-mora.gatech.edu/research/pcb.pdf
ii http://www.digikey.com/en/articles/techzone/2012/dec/an-introduction-to-board-mounted-dcdc-converter-bricks
iii http://rincon-mora.gatech.edu/research/pcb.pdf
iv http://www.digikey.com/en/articles/techzone/2012/jul/proper-pcb-layout-minimizes-noise-coupling-for-point-of-load-converter-modules
v http://rincon-mora.gatech.edu/research/pcb.pdf
vi http://www.edn.com/design/power-management/4439749/3/DC-DC-converter-PCB-layout–Part-2
vii http://www.digikey.com/en/articles/techzone/2011/dec/conducted-and-radiated-emissions-reduction-techniques-for-power-modules
viii https://pdfs.semanticscholar.org/e3bb/49a1403b2da7d3d77e7024f7be208ee3a732.pdf

Industry Developments: Cooling Electronics in Wind Turbines

By Norman Quesnel, Senior Member of Marketing Staff
Advanced Thermal Solutions, Inc.

(This article will be featured in an upcoming issue of Qpedia Thermal e-Magazine, an online publication dedicated to the thermal management of electronics. To get the current issue or to look through the archives, visit http://www.qats.com/Qpedia-Thermal-eMagazine. To read the preceding post on Cooling Solar Power Inverters, click https://www.qats.com/cms/2016/11/21/industry-developments-cooling-solar-power-inverters.)

Wind power systems capture natural air currents and convert them, first to mechanical energy and then electricity. Windmills have long harnessed natural, renewable wind currents to grind grains and pump water. Now those windmills have evolved into highly engineered wind turbines, with very long, highly-engineered blades spinning on steel towers some that are tens of meters high.

There are some relatively small wind turbines that power individual houses or businesses. They can generate around 100 kW of power. But most of today’s wind turbine industry is for utility-scale power generation. These are large, tall wind turbines, in fields of dozens or hundreds, delivering high levels of electricity to power grid systems that reach thousands of end users. More than a quarter million of such turbines are in use around the world.

Cooling Electronics in Wind Turbines

Fig. 1. The Alta Wind Energy Center in California has more than 600 wind turbines and can produce more than 1.5 GW of power. [1]

Most utility-scale wind turbines are built on open, naturally windy land or off-shore. Each turbine can produce 1.0-1.5 MW, enough energy to power hundreds of homes. The United States has about 75 GW of installed wind power capacity. And, despite some local resistance, the U.S. has begun to join other countries with off-shore installations. China has by far the most installed wind power capacity at about 150 GW. Globally, the combined power capacity from wind turbines is forecast to nearly double between 2016 and 2020 to 792 GW. This would be enough to power 220 million average homes in the U.S. [2, 3]

Mechanics of Wind Turbines

When natural wind blows past a turbine, its blades capture the energy and rotate. This rotation spins a shaft inside the rotor. The shaft is connected to a gearbox that can increase the speed of rotation. The gearbox connects to a generator that produces electricity. Most wind turbines consist of a steel tubular tower. On top of this is a nacelle structure, housing the turbine’s shaft, gearbox, generator and controls.

On the wind-facing end of the nacelle is a hub to which the turbine blades are attached. Together, the blades and the hub are called the rotor. The diameter of the rotor determines how much energy a turbine can generate. The larger the rotor, the more kinetic energy is harnessed. Furthermore, a larger rotor requires a taller tower, which exposes the rotor to faster winds. [4]

A wind turbine is equipped with wind assessment equipment, including weather vanes. These send data to a computer to automatically rotate the turbines into the face of the wind and to a pitch system that can angle the blades to further optimize energy capture. [5]

Cooling Electronics in Wind Turbines

Fig. 2. The major components of a wind turbine. [6]

Turbines and Fire

Hundreds of wind turbines catch fire each year. The most common cause is lightning strikes, but overheated equipment can also be responsible. Highly flammable materials such as hydraulic lubrication oil and plastics are in close proximity to machinery and electrical wires inside the nacelle. A fire can ignite from faulty wiring or overheating. The results are catastrophic. The rush of oxygen from high winds can quickly expand a fire inside a nacelle. Once a fire starts, it is not likely to be deliberately extinguished. Water hoses can’t reach a nacelle’s height and wind turbines like these are typically set in remote locations, far from emergency aid. [7]

Cooling Electronics in Wind Turbines

Fig. 3. A wind turbine’s blazing nacelle and hub at a wind farm in Germany. Lubricating oil is often the fuel when these fires occur. [8]

Electronic Devices in the Nacelle – and Heat

Most wind turbines don’t catch fire, of course. Yet, despite all the surrounding wind, the electronics in their nacelles still need significant thermal management to function continuously. The most important electronics are the generator and power converting devices.

The generator is the heart of a wind turbine. It converts the rotational energy of the wind-spun rotor into electrical energy. It generates the electric power that the wind turbine system feeds into the grid.

Generating electricity always entails the loss of heat, causing the generator’s copper windings to get hot. Larger capacity generators are even further challenged. The thermal losses will increase with the generator in proportion to the cube of its linear dimensions, resulting in a serious decline in generator efficiency.[9]

Excess generator heat must be dissipated to maintain efficiency and avoid damage. On most wind turbines this is accomplished by enclosing the generator in a duct, using a large fan for air cooling. Some manufacturers provide water-cooled generators that can be used in wind turbines. The water-cooled models require a radiator in the nacelle to void the heat from the liquid cooling matrix.

Wind turbines may be designed with either synchronous or asynchronous generators, and with various forms of direct or indirect connection to the power grid. Direct grid connection means that the generator is connected to the (usually 3-phase) alternating current grid.

Wind turbines with indirect grid connections typically use power converters. These can be AC-AC converters (sometimes called AC/DC-AC converters). They change the AC to direct current (DC) with a rectifier and then back to usable AC using an inverter. In this process, the current passes through a series of Insulated Gate Bipolar Transistor switches (IGBTs). These convert direct current into alternating current to supply to the grid by generating an artificial sine wave. The more frequently the switch is turned on and off, the closer to a true sine wave the current flow becomes, and the more sine-like the flow, the purer the power. The resulting AC is matched to the frequency and phase of the grid. [10]

However, the faster these switches actuate, the more heat they develop and given a wind turbine’s variable inputs, IGBTs for this application need to cycle very frequently. This generates large amounts of heat that will dramatically decrease overall efficiency unless properly cooled. [11]

Cooling Electronics in Wind Turbines

Fig. 4. An active air cooling system inside a wind turbine nacelle features an air-to-air heat exchanger for managing heat in the generator (Vensys). [12]

Even with efficiency improvements, a wind turbine’s power generation systems and subsystems must manage ever increasing heat within its limited nacelle space. In addition, even if incurred power losses are as little as 3-5 percent, thermal management systems would have to dissipate 200-300 kW and more of heat.

Air cooling has been used effectively in small-scale wind turbines, but it is not practical for removing the heat produced in MW-scale units. Its thermal capacity is so low that it is difficult to blow enough air across a motor or through the converter to maintain reliable operating temperatures. That is why water cooling is used more often than air for larger wind turbines.

Cooling Electronics in Wind Turbines

Fig. 5. Electronics in a medium voltage (Up to 12 MW) wind turbine converter. Cooling is provided by a closed-loop unit with a mix of deionized water and glycol (ABB).[13]

However, water cooled systems are relatively large, and their thermal efficiency limitations force the size and weight of power generation sub-systems to essentially track their power throughput. Due to the thermal performance limitations of water, the power-generation equipment for a 10 MW wind turbine is nearly twice the size and weight of a 5 MW model. This is largely because water cooling cannot adequately remove additional heat loads without spreading them out.

One supplier of liquid cooling systems for wind turbine electronics is Parker Hannifin. Its Vaporizable Dielectric Fluid (VDF) system provides heat transfer capability significantly greater than that of water. The VDF system requires less fluid and lower pump rates. The same dissipation rates provided by a 6 liter/minute water flow can be achieved by 1 liter/minute VDF flow, thus allowing for a smaller system.

The hermetically sealed VDF assembly is designed to be leak proof, but if a leak occurs the non-conductive fluid will not damage electronic components. The cooling system’s efficiencies and lack of thermal stack-up provide an additional advantage in that the system maintains a fairly tight temperature range. The lack of thermal cycling removes a strain on the turbine’s electronics, which extends their useful life. [14]

Cooling Electronics in Wind Turbines

Figure 6. Dual-phase liquid cooling method for converters has a circulating refrigerant in a closed-loop. Vaporizing coolant removes heat from devices and re-condenses to liquid in a heat exchange (Parker). [15]

Conclusion

Heat issues in wind turbine electronics mainly concern the generator and the power conversion electronics. The heat load of the generator comes from copper wire resistance and from iron loss from the rotation of the core. Further heat loss is mechanical due to friction. These energy losses become heat energy that is distributed into the wind turbine nacelle.

The excess heat from the nacelle-based power conversion systems is mainly due to impedance from electronic components such as capacitors and thyristors. Higher temperatures will reduce the system’s life and increase failure rate. Thermal management methods such as liquid cooling can be effectively adapted for nacelle electronics. [10]

References
1. https://en.wikipedia.org/wiki/Alta_Wind_Energy_Center
2. https://en.wikipedia.org/wiki/Wind_power_by_country
3. http://www.ozy.com/fast-forward/how-twinning-tech-will-power-our-future/71993
4. Layton, Julia, How Wind Power Works, HowStuffWorks.com.
5. http://www.awea.org/Resources/Content.aspx?ItemNumber=900&navItemNumber=587
6. https://www.linkedin.com/pulse/smart-grid-energy-harvesting-martin-ma-mba-med-gdm-scpm-pmp
7. http://www3.imperial.ac.uk/newsandeventspggrp/imperialcollege/newssummary/news_17-7-2014-8-56-10
8. https://www.youtube.com/watch?v=sYoQ6mS2gss
9. http://ele.aut.ac.ir/~wind/en/tour/wtrb/electric.htm
10. Jian, S., Xiaoqian, M., Shuying, C. and Huijing, G., Review of the Cooling Technology for High-power Wind Turbines, 5th Intl Conf on Advanced Design and Manufacturing Engineering, 2015.
11. http://www.windpowerengineering.com/design/mechanical/cooling-electronics-in-a-hot-nacelle/
12. http://www.vensys.de/energy-en/technologie/generatorkuehlung.php
13. https://library.e.abb.com/public/430f5f2493334e4ead2a56817512d78e/PCS6000%20Rev%20B_EN_lowres.pdf
14. http://www.windsystemsmag.com/article/detail/60/cool-system-hot-results
15. http://buyersguide.renewableenergyworld.com/parker-hannifin-renewable-energy-solutions/pressrelease/parker-to-launch-converter-cooling-systems-for-1mw-wind-turbines-at-husum-wind-energy-2012.html

For more information about Advanced Thermal Solutions, Inc., its products, or its thermal management consulting and design services, visit www.qats.com or contact ATS at 781.769.2800 or [email protected].

Case Study: PCB Cooling for Telecom Application

PCB Cooling for Telecom

ATS engineers designed a thermal solution for a telecom board, using ATS patented maxiFLOW heat sinks, which met the customer’s thermal requirements. (Advanced Thermal Solutions, Inc.)


Engineers at Advanced Thermal Solutions, Inc. (ATS) were brought into a project to assist a client with cooling a PCB that was going to be installed in telecommunications data center. The board currently had heat sinks embedded with heat pipes covering the two hottest components but the client wanted a more reliable and cost-effective solution.

ATS engineers used the company’s patented maxiFLOW™ heat sinks to replace the heat pipes and through analytical and CFD modeling determined that by switching to maxiFLOW™ the junction temperature and case temperature would be below the maximum allowed.

• Challenge: The client had a new PCB over which air could flow from either direction and two of the highest power dissipating components were on opposite sides.

• Chips/Components: WinPath 3 and Vector Processor

• Analysis: Analytical modeling and CFD simulations determined the junction temperature with air going from left-to-right and right-to-left and ensured it would be lower than the maximum allowable (100°C for one component and 105°C for the other).

• Test Data: With air flowing from left-to-right, CFD simulation determined that the junction temperatures would be 89.3°C and 101.4°C – below the maximum temperatures of 100°C and 105°C. With air flowing from right-to-left, the junction temperature of the most power-dissipating component was 100°C, which was right at the maximum, and the second was at 87°C, which was below it.

• Solution: The original heat sinks embedded with heat pipes were switched for maxiFLOW™ heat sinks, with their placement offset slightly to create a linear airflow, and the same levels of thermal performance were achieved.

PCB Cooling for Telecom

ATS engineers changed the embedded heat sinks for maxiFLOW™ heat sinks and received the same thermal performance with a more reliable and cost-effective solution. (Advanced Thermal Solutions, Inc.)

• Net Result: The client received the required level of cooling in the PCB, regardless of the direction of air flow, and with a more reliable and cost-effective solution than had been previously been in use.

For more information about Advanced Thermal Solutions, Inc. thermal management consulting and design services, visit www.qats.com or contact ATS at 781.769.2800 or [email protected].

Case Study: High-Powered Altera Stratix 10 FPGAs

Altera Stratix 10 FPGAs`

Advanced Thermal Solutions, Inc. engineers designed a solution to cool a board that contained high-powered Altera Stratix 10 FPGAs. (Advanced Thermal Solutions, Inc.)


Engineers at Advanced Thermal Solutions, Inc. were asked to test the layout of a PCB that was using Altera Stratix 10 FPGAs (field-programmable gate arrays) with fans on one side pulling air across the board. The client used ATS heat sinks on the original iteration of the PCB and wanted to ensure those heat sinks would provide the necessary cooling for this iteration as well.

Through a combination of analytical modeling and CFD simulations, ATS engineers determined that the heat sinks already being used would provide enough cooling for the more powerful components.

• Challenge: ATS conducted thermal analysis of a system with Altera Stratix 10 FPGA units when using ATS 1634-C2-R1 and ATS FPX06006025-C1-R0 heat sinks. Two of the FPGAs would be running at 90 watts and one at 40 watts and there were fans on one side of the PCB that would pull air across the board.

• Chip/Component: Altera Stratix 10 FPGAs

• Analysis: Analytical models and CFD simulations were run with ATS 1634-C2-R1 heat sinks and several other options, including copper and aluminum heat sinks with and without embedded heat pipes. CFD simulations also created fan curves for all six of the Mechtronics MD4028V fans being used.

• Test Data: The data showed that even with the additional power of the new chips that the original heat sinks would keep the case temperature below 80°C. The other heat sinks showed similar case temperatures mostly below 80°C as well. Fan curves showed that the fans were operating near the knee, which the client was notified about.

• Solution: ATS engineers recommended staying with the ATS 1634-C2-R1 heat sink because it was able to cool the high-powered FPGAs below the maximum case temperature. The ATS FPX06006025-C1-R0 was recommended for the lower power FPGA.

Altera Stratix 10 FPGAs

CFD simulation with the case temperatures of the three FPGA using the original ATS heat sinks.
(Advanced Thermal Solutions, Inc.)

• Net Result: The customer was able to continue using the same heat sinks that had worked on the prior iteration of the PCB.

For more information about Advanced Thermal Solutions, Inc. thermal management consulting and design services, visit www.qats.com or contact ATS at 781.769.2800 or [email protected].