Author Archives: Josh Perry

Tubed and Submerged-Fin Cold Plates in Electronics Thermal Management

By Norman Quesnel
Senior Member of Marketing Staff
Advanced Thermal Solutions, Inc. (ATS)

Many of today’s electronic devices need the performance of liquid cooling to meet the thermal demands of certain hot components. Liquid cold plates are common cooling systems in high power lasers, fuel cells, battery coolers, motor drives, medical equipment, avionics and other high-power, high-heat flux applications.

Cold Plates
Figure 1. A Custom liquid cold plate design by D6 Industries. [1]

Cold plates provide localized cooling by transferring heat from a device to a liquid that flows to a remote heat exchanger and dissipates into either the ambient or to another liquid in a secondary cooling system. Component heat flows by conduction through a thermal interface material and the metal plate to the metal tubing. Then it flows by convection from the internal surface of the fluid path material into the flowing coolant.

A cold plate in electronics cooling is often an aluminum block with an embedded, coolant-filled metal tube. Another common cold plate type is made with metal shells that are brazed or friction-welded together and filled with a liquid coolant.  On the inside, the metal shells have integral cooling fins that are submerged in the coolant.

Tubed Cold Plates

Embedded tube designs are the simplest version of cold plate cooling devices. They feature a continuous tube set into grooves in a metal plate, and are often bonded in place with thermal epoxy. The flowing coolant moves heat from the component away from the cold plate to a heat exchanger, where it is cooled before being pumped back into the plate. 

A common example of a tubed cold plate features an aluminum plate with an exposed copper tube. The tubes can be routed in different pathways to optimize the thermal performance.

The tubing can be continuous or constructed from straight tubes connected by soldered joints, though joints may increase the potential for leakage.

Figure 2. A Tubed cold plate consists of copper or stainless-steel tubing pressed into a metal plate. [2]

This design can provide a cost-effective thermal solution for component cooling where the heat load is low-to-moderate. Tubed cold plates ensure minimum thermal resistance between the power device and the cold plate by placing the coolant tube in direct contact with the power device’s base. Direct contact reduces the number of thermal interfaces between device and fluid, thus increasing performance for the application.

A variant of this design features a thermal epoxy completely applied over the pressed in tubing and flush with the metal plate surface. These are sometimes called buried tube liquid cold plates. This provides a gap-free thermal interface between the tube and the plate. The epoxy layer protects from any leakage from the metal tube. Another key feature is that that fully buried tube is not exposed to the outside environment.

Figure 3. A buried tube cold plate’s metal tube is covered with a conductive epoxy layer. [3]

The choice of liquid coolant affects thermal performance as well. Choosing the right coolant depends to a great extent on the tube material. Copper tubes are compatible with water and most other common coolants, while stainless steel tubes can be used with deionized water or corrosive fluids.

One cold plate OEM offers a proprietary technology with a tube locking system and pressing techniques that ensure the tube is flush with the plate surface, providing good thermal contact with the component being cooled. This manufacturing method eliminates the need for thermal epoxy between the tube and plate which improves thermal performance. [4]

Submerged Fin Cold Plates

Another type of cold plate is an all-metal construction with brazed or friction welded internal fin field.

Figure 4. Standard, liquid coolant-containing metal cold plate [5]

The integral, internal fins increase the surface area that contacts the fluid and enhances heat transfer. Fin shape and fin density affect the performance of heat exchangers and cold plates. By their geometry, the fins also create turbulence, which minimizes the fluid boundary layer and further reduces thermal resistance.

One high-performance version features tightly packed aluminum pin fins that create turbulence with low flow rate values, resulting in high thermal performance with low pressure drop. In this design, the high density of the internal fins increases the heat transfer area without adding bulk to the cold plate assembly. [6]

Figure 5. Close-spaced pin fins with complex geometry create turbulence with low flow rate values inside submerged fin cold plates. [6]

In most high-performance applications, fins are made of copper or aluminum. Aluminum fins are preferred in aircraft electronic liquid cooling applications due to their lighter weight. Copper fins are mostly used in applications where weight is not an important factor, but compatibility with other cooling loop materials is.

For submerged-fin cold plates, many different fin geometries can be tested to find the best improvement in performance. Some of the most commonly used are louvered, lanced offset, straight, and wavy fins.

Figure 6. Fin designs for submerged-fin cold plates. Clockwise from top: louvered, lanced offset, wavy, and straight fins. [7]

With cooling requirements increasing in many areas of electronics, engineers are turning to liquid cooling to replace air cooling. Lower cost, safer liquid cooling systems have also spurred the trend to liquid cooling.

The prime example is the cold plate – relatively simple in design, affordable, available in alternative versions, and extremely customizable. Cold plates should be considered wherever thermal performance above air cooling is needed.

References:

  1. https://d6industries.com/portfolio/custom-designs-liquid-cold-plate-hydroblock/
  2. https://www.lytron.com/Cold-Plates
  3. http://www.wakefield-vette.com/products/liquid-cooling/liquid-cold-plates/standard-liquid-cold-plates.aspx
  4. https://www.lytron.com/Tools-and-Technical-Reference/Application-Notes/Assessing-the-Quality-of-a-Tubed-Cold-Plate
  5. https://www.qats.com/Products/Liquid-Cooling/Cold-Plates
  6. http://www.cooltech.it/products/liquid-cold-plates/
  7. https://www.lytron.com/Tools-and-Technical-Reference/Application-Notes/Fins-for-Cooling-Success

For more information about Advanced Thermal Solutions, Inc. (ATS) thermal management consulting and design services, visit https://www.qats.com/consulting or contact ATS at 781.769.2800 or ats-hq@qats.com. To register for Qpedia and to get access to its archives, visit https://www.qats.com/Qpedia-Thermal-eMagazine.


Cooling News: New Thermal Products Showcase

In this article, Qpedia will explore some innovative thermal management products that have recently hit the market. These new thermal products encompass a variety of thermal management applications from CPU coolers to thermal interface materials (TIM) to sensors and test instruments to advanced materials and concepts.

One Part, Silver Conductive Epoxy


Silver filled epoxy adhesive system Master Bond EP3HTSDA-2 was developed for crucial thermal management applications. As a one component system, it is not premixed and frozen and has a very long working life at room temperature. This compound possesses a high thermal conductivity of 45-49 BTU•in/ft2•hr•°F [6.5-7.0 W/(m•K)].

It can be applied in ultra-thin bond lines and contains particles with an average size of 2-3 microns. EP3HTSDA-2 exhibits very low thermal resistance of 2-3 x 10 -6 K•m2/W. It also has outstanding electrical conductivity with a volume resistivity less than 0.001 ohm-cm. EP3HTSDA-2 meets NASA low outgassing specifications and is serviceable from -80°F to +450°F [-62°C to +232°C].

This product adheres well to similar/dissimilar substrates such as aluminum, ceramic, copper, fiberglass, polyimide and silicone die. This formulation is designed to cure in 20-30 minutes at 250°F or 5-10 minutes at 300°F. Die shear strength has a 20-20 Kg-f value at 75°F measured for a die size of 2×2 mm [80×80 mil].  EP3HTSDA-2 is packaged in syringes or glass jars. Common sizes range from 20 grams, 50 grams, 100 grams to one and multiple pound units.

For storage simple refrigeration is recommended. Shelf life is a minimum of 3 months in original unopened syringes or jars.

Portable AC Keeps Computer Systems Cool

Tripp Lite’s SRCOOL12K is a new-generation air conditioner designed for supplemental area cooling, emergency cooling and off-hour cooling applications. Efficient, compact, self-contained and portable, the 120V, 60 Hz SRCOOL12K is ideal for use in data centers, server and wiring closets, IT environments, home and small business offices, conference rooms, warehouses, entertainment centers or other venues with heat-sensitive equipment, particularly in areas that facility air conditioning can’t reach.

The SRCOOL12K not only adjusts ambient room temperatures, but can also dehumidify and filter the air, providing better air quality for enhanced equipment performance with minimal noise and power consumption. The SRCOOL12K uses environmentally friendly R410a Freon, which complies with EPA standards for 2010 and beyond, and is accepted worldwide. Designed for quick, simple installation, the SRCOOL12K plugs into a standard 5-15R outlet with no adapter required.

Both a standard louvered vent (for general room cooling) and a directional ducted cooling vent (to direct cold air where most needed) are provided. A directional exhaust duct safely removes hot air from the room. The built-in dehumidifier expels condensed water through the exhaust duct, with no need for a drain tube, drain pan or water collection tank. The SRCOOL12K meets the needs of the most demanding applications with 12,000 BTU of cooling power.

A built-in timer enables the unit to be programmed for unattended startup and shutdown. Controls and displays are conveniently mounted on the top panel. An included window/drop ceiling kit provides multiple installation options.

Technology Enables Thin, Safe, Heated Garments

DuPont Advanced Materials (DuPont) today announced the newest offering from DuPont™ Intexar – a powered smart clothing technology for on-body heating. Intexar Heat is a thin lightweight and durable heating solution for outdoor clothing that is designed to be easily integrated into garments. Intexar Heat is a revolutionary stretchable ink and film that when powered, creates a comfortable warmth.

The heater that feels like fabric, doesn’t rely on cables, thick wires or big batteries, and can stand up to very cold environments. From outdoor enthusiasts to industrial workers, Intexar Heat can help conquer the elements in comfort, increasing focus and improving performance. Intexar materials also can enable biometric monitoring in smart clothing.

Pulse rate, respiratory rate, muscle activity and form awareness are all measurable using sensors and conductive pathways built from Intexar.

Heat Shield Technology Protects EV Batteries

Freudenberg-NOK Sealing Technologies has produced a light weight, low volume silicone rubber heat shield for lithium battery systems. The product was developed in response to trends with original equipment manufacturers for battery systems that will increase the driving range for electric vehicles. OEMs have found ways to increase the energy density inside battery cells, packing more chemical energy in the same cell volume. Individual cells also are stored tightly together to maximize the energy density of the system.

Today’s battery systems need to support ultra-fast charging, with OEMs looking for a complete system charge within 10-15 minutes. This pushes a high amount of energy into the system, creating a safety issue with thermal management.  Placing heat shields between the cells, would keep heat from transferring from one cell to another in the case of a thermal event. Freudenberg developed a heat shield based on a silicone rubber that remains flexible under heat and adjusts to changing size of a cell during charging or over its lifetime.

The critical issue is to block the heat, which is caused by the cell in a thermal runaway state. Typical values are 600°C at the surface of the housing for some 30 seconds. The goal was to create a heat shield that could withstand those parameters while maintaining a temperature of 200°C or below.

The silicone rubber heat shield is made with a waffle structure that creates air pockets between the shield and the cell, as well as limits the amount of direct contact area between the shield and the cell surface.

Gap Filler Transfers Heat and Absorbs EM Waves

Fujipoly has introduced a new thermal interface material that also absorbs a wide range of unwanted electromagnetic energy. The tacky, gel-like consistency of Sarcon EGR-11F makes it easy to handle and apply without requiring additional adhesive. When placed on top of a heat source such as an IC chip, the compliant material fills any unwanted air gaps allowing for more efficient transfer of heat to nearby components or heat sinks. 

Sarcon EGR-11F also provides excellent shielding effectiveness across a broad frequency spectrum while exhibiting a thermal conductivity of 1.0 W/m°K (ASTM D 2326) and a thermal resistance of 1.05°Cin2/W at 14.5 PSI. This highly versatile material is available in three sheet thicknesses (0.5, 1.0, 1.5mm) up to a maximum dimension of 300mm x 200mm. Sarcon EGR-11F can also be ordered in die-cut form to fit almost any application shape.

The material is well-suited for environments with operating temperatures that range from -30 to +120°C and exhibits a UL94 flame retardant rating of V-0. 

High Performance IR Sensor Uses MEMS Technology

New Thermal Products

The D6T-1A-02 from Omron is the latest in sensory innovation with super-sensitive, infra-red (IR), non-contact temperature sensing capabilities using MEMS technology. The D6T thermal sensor is ideal for building automation applications, measuring the temperature in a room, or detecting occupancy, even when people are stationary.

Additionally, because the D6T is fully non-contact it offers a wider detection range, as well as ultra-sensitive heat sensors – an excellent alternative to PIR detectors and pyroelectric sensors. Making full use of MEMS technology, the D6T provides the ability to measure surface temps anywhere between -40° to 80°C (-40°-176°F) with an accuracy of +/- 1.5°C, and resolution of 0.06°.

The new sensor combines state-of-the-art MEMS thermopile, a sensor ASIC (Application Specific Integrated Circuit), and a signal processing microprocessor in a 12.0mm x 11.6mm x 9.2mm package. Its narrow field of view at 26.52 allows for accurate readings of a specific object within range.

For more information about Advanced Thermal Solutions, Inc. (ATS) thermal management consulting and design services, visit https://www.qats.com/consulting or contact ATS at 781.769.2800 or ats-hq@qats.com. To register for Qpedia and to get access to its archives, visit https://www.qats.com/Qpedia-Thermal-eMagazine.

Technology Review: Thermal Interface Materials

(This article was featured in an issue of Qpedia Thermal e-Magazine, an online publication dedicated to the thermal management of electronics. To get the current issue or to look through the archives, visit http://www.qats.com/Qpedia-Thermal-eMagazine.)

Qpedia continues its review of technologies developed for electronics cooling applications. We are presenting selected patents that were awarded to developers around the world to address cooling challenges. After reading the series, you will be more aware of both the historic developments and the latest breakthroughs in both product design and applications.

Thermal Interface Materials
This Technology Review will focus on recent developments in Thermal Interface Materials. (Wiklmedia Commons)

We are specifically focusing on patented technologies to show the breadth of development in thermal management product sectors. Please note that there are many patents within these areas. Limited by article space, we are presenting a small number to offer a representation of the entire field. You are encouraged to do your own patent investigation.

Further, if you have been awarded a patent and would like to have it included in these reviews, please send us your patent number or patent application.

In this issue our spotlight is on thermal interface materials.

There are many U.S. patents in this area of technology, and those presented here are some recent. These patents show some of the salient features that are the focus of different inventors.

Thermal Interface Material with Carbon Nanotubes
US 7253442 B2 – Hua Huang, Chang-Hong Liu and Shou-Shan Fan


A thermal interface material includes a macromolecular material, and a plurality of carbon nanotubes embedded in the macromolecular material uniformly. The thermal interface material includes a first surface and an opposite second surface. Each carbon nanotube is open at both ends thereof, and extends from the first surface to the second surface of the thermal interface material. A method for manufacturing the thermal interface material includes the steps of: (a) forming an array of carbon nanotubes on a substrate; (b) submerging the carbon nanotubes in a liquid macromolecular material; (c) solidifying the liquid macromolecular material; and (d) cutting the solidified liquid macromolecular material to obtain the thermal interface material with the carbon nanotubes secured therein.

An object of the present invention is to provide a thermal interface material having a reduced thickness, small thermal interface resistance, good flexibility and excellent heat conduction. To achieve the above-mentioned object, the present invention provides a thermal interface material comprising macromolecular material and a plurality of carbon nanotubes embedded in the macromolecular material uniformly. The thermal interface material also comprises a first surface and an opposite second surface. Each carbon nanotube is open at two ends thereof, and extends from the first surface to the second surface of the thermal interface material.

Unlike in a conventional thermal interface material, the carbon nanotubes of the thermal interface material of the present invention are disposed in the macromolecular material uniformly and directionally. Thus, each carbon nanotube of the thermal interface material can provide a heat conduction path in a direction perpendicular to a main heat absorbing surface of the thermal interface material. This ensures that the thermal interface material has a high heat conduction coefficient. Furthermore, the thickness of the thermal interface material of the present invention can be controlled by cutting the macromolecular material. This further enhances the heat conducting efficiency of the thermal interface material and reduces the volume and weight of the thermal interface material.

Moreover, each carbon nanotube is open at two ends thereof, and extends from the first surface to the second surface of the thermal interface material. This ensures the carbon nanotubes can contact an electronic device and a heat sink directly. Thus, the thermal interface resistance between the carbon nanotubes and the electronic device is reduced, and the thermal interface resistance between the carbon nanotubes and the heat sink is reduced. Therefore, the heat conducting efficiency of the thermal interface material is further enhanced.

Transferrable Compliant Fibrous Thermal Interface
US 6676796 – Michael Pinter, Nancy Dean, William Willet, Amy Gettings and Charles Smith

In one aspect of the invention there is provided a fibrous interface material sandwiched between two layers of a removable paper or release liner. The interface comprises flocked, e.g. electroflocked, mechanically flocked, pneumatically flocked, etc., thermally conductive fibers embedded in an adhesive or tacky substance in substantially vertical orientation with portions of the fibers extending out of the adhesive. An encapsulant is disposed to fill spaces between portions of the fibers that extend out of the adhesive, leaving a free fiber structure at the fiber tips.

Another aspect of the invention is a method of making a fibrous interface. In the method, thermally conductive fibers of desired length are provided and, if necessary, cleaned. A release liner is coated with an adhesive or tacky substance, and the fibers are flocked to that release liner so as to embed the fibers into the adhesive or tacky substance with a portion of the fibers extending out of the adhesive.

The adhesive is cured and the space between fibers if filled with a curable encapsulant. A second piece of release liner is placed over the fiber ends. Then the fibers in the adhesive with the release liner over the fibers in the adhesive with the encapsulant in the spaces between the fibers is compressed to a height less than the normal fibers’ length and clamped at the compressed height.

Thereafter the encapsulant is cured while under compression to yield a free fiber tip structure with the fiber tips extending out of the encapsulant.

Liquid Metal Thermal Interface for an Integrated Circuit Device
US 7348665 B2 – Ioan Sauciuc and Gregory Chrysler


One possible solution to meet the heat dissipation needs of microprocessors and other processing devices is to employ an active cooling system—e.g., a liquid based cooling system that relies, at least in part, on convective heat transfer initiated by the movement of a working fluid—rather than (or in combination with) heat sinks and other passive heat removal components. Disclosed herein are embodiments of a cooling system for an integrated circuit (IC) device—as well as embodiments of a method of cooling an IC device—wherein the cooling system includes a liquid metal thermal interface that is disposed between a die and a heat transfer element, such as a heat spreader or a heat sink. Embodiments of a method of making a liquid metal thermal interface are also disclosed.

This patent is for a liquid metal thermal interface for an integrated circuit die. The liquid metal thermal interface may be disposed between the die and another heat transfer element, such as a heat spreader or heat sink. The liquid metal thermal interface includes a liquid metal in fluid communication with a surface of the die, and liquid metal moving over the die surface transfers heat from the die to the heat transfer element. A surface of the heat transfer element may also be in fluid communication with the liquid metal.

Per Figure 2, the cooling system 200 is coupled with an IC die 10. During operation of the IC die 10, the die may generate heat, and the cooling system 200 is capable of dissipating at least some of this heat, such as may be accomplished by transferring heat away from the IC die 10 and to the ambient environment. The IC die 10 may comprise any type of integrated circuit device, such as a microprocessor, network processor, application specific integrated circuit (ASIC), or other processing device.

Heterogeneous Thermal Interface for Cooling
US 7219713 B2 – Jeffrey Gelorme, Supratik Guha, Nancy LaBianca, Yves Martin and Theodore Van Kessel

The present invention is a thermal interface for coupling a heat source to a heat sink. One embodiment of the invention comprises a mesh and a liquid, e.g., a thermally conductive liquid, disposed in the mesh. The mesh and the thermally conductive liquid are adapted to contact both the heat source and the heat sink when disposed there between. In one embodiment, the mesh may comprise a metal or organic material compatible with the liquid. In one embodiment, the liquid may comprise liquid metal. For example, the liquid may comprise a gallium indium tin alloy. A gasket may optionally be used to seal the mesh and the liquid between the heat source and the heat sink. In one embodiment, the heat source is an integrated circuit chip.

In another aspect of the invention, a method for cooling a heat source with a heat sink is provided. In one embodiment, the method includes providing a thermal interface having a mesh and a liquid disposed in the mesh. The thermal interface is interposed between the heat source and the heat sink, such that the mesh and the liquid are in contact with the heat source on a first side of the thermal interface and in contact with the heat sink on a second side of the thermal interface.

In another aspect of the invention, a method of fabricating a thermal interface for assisting the thermal transfer of heat from a heat source to a heat sink is provided. In one embodiment, the method includes providing a mesh. A liquid is disposed in the mesh in sufficient quantity to substantially fill the mesh. The liquid comprises liquid metal. Optionally, the liquid metal may subsequently be frozen in place.

For more information about Advanced Thermal Solutions, Inc. (ATS) thermal management consulting and design services, visit https://www.qats.com/consulting or contact ATS at 781.769.2800 or ats-hq@qats.com. To register for Qpedia and to get access to its archives, visit https://www.qats.com/Qpedia-Thermal-eMagazine.

Webinar on Heat Sink Design and Selection

Advanced Thermal Solutions, Inc. (ATS) is hosting a series of monthly, online webinars covering different aspects of the thermal management of electronics. This month’s webinar will be held on Thursday, Feb. 21 from 2-3 p.m. ET and will cover heat sink design and selection. Learn more and register at https://qats.com/Training/Webinars.

Heat Sink Design Webinar

ATS Wind Tunnels Designed for SSD and PCIe Thermal Characterization

As was outlined in an earlier article on this blog, it is critical for manufacturers to characterize solid-state drives (SSD) to establish performance parameters in real-world conditions. The previous article explained that SSD experience higher failure rates and reduced lifespan when temperatures increase beyond the standard operating range of 30-40°C.

Wind Tunnels
ATS designed wind tunnels for companies looking to characterize solid-state drives in the PCIe form factor, as show above. (Wikimedia Commons)

Testing processes for SSD are similar to those used for characterizing typical semiconductors. A wind tunnel provides a consistent, controlled, and repeatable environment for data collection and sensors, thermocouples, and an analog-to-digital capture system allows engineers to measure performance when the SSD is impacted by external factors.

ATS designs and fabricates research-quality wind tunnels that can be used for characterizing SSD. The wind tunnels give engineers control over air temperature and velocity. Closed-loop wind tunnels can create environments with temperatures as high as 80°C to provide stressed conditions well above standard operating temperatures. The manufacturer can use this data to set reference points for different environments, such as in 1-U telecommunications chassis or large server boxes.

Recently, ATS has worked with two of the industry’s largest producers of SSD to design wind tunnels that could be used for characterizing drives in PCIe applications. PCIe (peripheral component interconnect express) cards are high-speed serial computer extension cards that connect peripheral devices to the motherboard. In addition to SSD, these cards can be used for graphics processors, Wi-Fi, or other hard drives.

ATS wind tunnels can be used to test airflow and thermal performance for components and boards, as shown in this smoke flow visualization test over a maxiFLOW™ heat sink. (Advanced Thermal Solutions, Inc.)

One of the wind tunnels was a standard, open loop CWT-107™. It can produce uniform and homogeneous flow, up to 5.5 m/s (1100 ft/min) within the wind tunnel’s test section due to its polynomial shape and internal flow management system, which features honeycombs and screens to break up turbulence. The wind tunnel can be operated either vertically or horizontally and the customer chose to use it lying down.

In fact, the customer was very creative in its use of the wind tunnel. A customized cart was built for the wind tunnel to be bolted to and then the cart was wheeled into a large environmental chamber where temperatures could be raised to test levels. The SSD being characterized was a PCIe card with memory installed. There was no fan for the memory and the memory had no shielding or housing.

The customer placed its PCIe-based SSD flat in the test chamber. Power was pulled through the test ports included in the test chamber of the CLWT-107™ (as shown below).

While the wind tunnel was bought for testing SSD, it could be used by the customer to test any electronic component or board.

The second customer purchased a CLWT-115™ closed-loop wind tunnel. In this case, the application required the SSD to be powered through the PCIe back plane, so ATS custom-designed slots in the test section to fit the PCIe form factor. The slots allowed the SSD to remain inside the test section and be connected to a motherboard residing outside the wind tunnel (see below).

Again, the wind tunnel could be used to test any PCIe cards, not just SSD, if the customer desired, as there were also fillers created for the slots to allow the wind tunnel to be used when testing other devices.

The second customer did all of its air velocity and temperature testing in the CLWT-115™, rather than using an environmental chamber like the first customer, because the wind tunnel has a self-contained heating unit that heats air while it circulates during testing.

Wind tunnel controllers and ATVS systems were also purchased by both customers to ensure accurate data collection. The first customer bought an ATVS-NxT™, which is a fully portable scanner that operates with an embedded PC and touch screen control, while the second customer bought the ATVS-2020™, which allows single- or multi-point measurement of both temperature and velocity, and a CLWTC-1000™, which automatically controlled the airflow and temperature through the test chamber.

Both come with Candlestick sensors to control the air velocity in the wind tunnel and thermocouples to control the temperature.

One of the customers also requested a custom, rugged sensor to avoid damage through multiple uses. ATS was able to adapt one of its handheld surface probes, a stainless-steel probe with a pointed tip for exact positioning of the sensor on the desired spot, by reducing the length and designing a custom port that would hold the sensor in place.

SSD are gaining traction in the market, with major hard drive manufacturers and the companies that utilize them both making the switch to solid-state technology. This means that thermal characterization of SSD and thermal management systems deployed to dissipate the heat of these drives are going to be of increasing importance in the coming years.

Using research-quality wind tunnels gives manufacturers a leg up in determining how their drives will perform in different real-world environments and makes the process of SSD characterization easier for users. By working with ATS, companies can tailor their wind tunnels to their specific applications and can be assured of the accuracy of the data that they collect.

Learn more about ATS wind tunnels, sensors, and the entire line of next-generation thermal test instruments at https://www.qats.com/Products/
Instruments. If you have questions about any products or ATS thermal testing services, email ats-hq@qats.com.


For more information about Advanced Thermal Solutions, Inc. (ATS) thermal management consulting and design services, visit https://www.qats.com/consulting or contact ATS at 781.769.2800 or ats-hq@qats.com.