Tag Archives: sensors

ATS Wind Tunnels Designed for SSD and PCIe Thermal Characterization

As was outlined in an earlier article on this blog, it is critical for manufacturers to characterize solid-state drives (SSD) to establish performance parameters in real-world conditions. The previous article explained that SSD experience higher failure rates and reduced lifespan when temperatures increase beyond the standard operating range of 30-40°C.

Wind Tunnels
ATS designed wind tunnels for companies looking to characterize solid-state drives in the PCIe form factor, as show above. (Wikimedia Commons)

Testing processes for SSD are similar to those used for characterizing typical semiconductors. A wind tunnel provides a consistent, controlled, and repeatable environment for data collection and sensors, thermocouples, and an analog-to-digital capture system allows engineers to measure performance when the SSD is impacted by external factors.

ATS designs and fabricates research-quality wind tunnels that can be used for characterizing SSD. The wind tunnels give engineers control over air temperature and velocity. Closed-loop wind tunnels can create environments with temperatures as high as 80°C to provide stressed conditions well above standard operating temperatures. The manufacturer can use this data to set reference points for different environments, such as in 1-U telecommunications chassis or large server boxes.

Recently, ATS has worked with two of the industry’s largest producers of SSD to design wind tunnels that could be used for characterizing drives in PCIe applications. PCIe (peripheral component interconnect express) cards are high-speed serial computer extension cards that connect peripheral devices to the motherboard. In addition to SSD, these cards can be used for graphics processors, Wi-Fi, or other hard drives.

ATS wind tunnels can be used to test airflow and thermal performance for components and boards, as shown in this smoke flow visualization test over a maxiFLOW™ heat sink. (Advanced Thermal Solutions, Inc.)

One of the wind tunnels was a standard, open loop CWT-107™. It can produce uniform and homogeneous flow, up to 5.5 m/s (1100 ft/min) within the wind tunnel’s test section due to its polynomial shape and internal flow management system, which features honeycombs and screens to break up turbulence. The wind tunnel can be operated either vertically or horizontally and the customer chose to use it lying down.

In fact, the customer was very creative in its use of the wind tunnel. A customized cart was built for the wind tunnel to be bolted to and then the cart was wheeled into a large environmental chamber where temperatures could be raised to test levels. The SSD being characterized was a PCIe card with memory installed. There was no fan for the memory and the memory had no shielding or housing.

The customer placed its PCIe-based SSD flat in the test chamber. Power was pulled through the test ports included in the test chamber of the CLWT-107™ (as shown below).

While the wind tunnel was bought for testing SSD, it could be used by the customer to test any electronic component or board.

The second customer purchased a CLWT-115™ closed-loop wind tunnel. In this case, the application required the SSD to be powered through the PCIe back plane, so ATS custom-designed slots in the test section to fit the PCIe form factor. The slots allowed the SSD to remain inside the test section and be connected to a motherboard residing outside the wind tunnel (see below).

Again, the wind tunnel could be used to test any PCIe cards, not just SSD, if the customer desired, as there were also fillers created for the slots to allow the wind tunnel to be used when testing other devices.

The second customer did all of its air velocity and temperature testing in the CLWT-115™, rather than using an environmental chamber like the first customer, because the wind tunnel has a self-contained heating unit that heats air while it circulates during testing.

Wind tunnel controllers and ATVS systems were also purchased by both customers to ensure accurate data collection. The first customer bought an ATVS-NxT™, which is a fully portable scanner that operates with an embedded PC and touch screen control, while the second customer bought the ATVS-2020™, which allows single- or multi-point measurement of both temperature and velocity, and a CLWTC-1000™, which automatically controlled the airflow and temperature through the test chamber.

Both come with Candlestick sensors to control the air velocity in the wind tunnel and thermocouples to control the temperature.

One of the customers also requested a custom, rugged sensor to avoid damage through multiple uses. ATS was able to adapt one of its handheld surface probes, a stainless-steel probe with a pointed tip for exact positioning of the sensor on the desired spot, by reducing the length and designing a custom port that would hold the sensor in place.

SSD are gaining traction in the market, with major hard drive manufacturers and the companies that utilize them both making the switch to solid-state technology. This means that thermal characterization of SSD and thermal management systems deployed to dissipate the heat of these drives are going to be of increasing importance in the coming years.

Using research-quality wind tunnels gives manufacturers a leg up in determining how their drives will perform in different real-world environments and makes the process of SSD characterization easier for users. By working with ATS, companies can tailor their wind tunnels to their specific applications and can be assured of the accuracy of the data that they collect.

Learn more about ATS wind tunnels, sensors, and the entire line of next-generation thermal test instruments at https://www.qats.com/Products/
Instruments. If you have questions about any products or ATS thermal testing services, email [email protected].


For more information about Advanced Thermal Solutions, Inc. (ATS) thermal management consulting and design services, visit https://www.qats.com/consulting or contact ATS at 781.769.2800 or [email protected].

In the ATS Labs – Where Thermal Solutions Advance to Meet Industry Demands

Thermal management innovations need to match the rapid pace at which the electronics industry is advancing. As consumers demand new and more powerful devices or greater amounts of information at faster speeds, cooling solutions of the past will not be enough. Today’s cooling solutions must be smaller, lighter, and offer higher performance, but also need to be cost-effective, meet demanding project specifications, and be reliable for many years.

Advanced Thermal Solutions, Inc. (ATS) understands the importance of creating cutting-edge thermal solutions for its customers and has geared its thermal design capability and its research and development to match the innovations taking place in electronics design.

ATS Labs

An ATS engineer assembles a rig for testing cold plates in one of ATS’ six state-of-the-art labs. (Advanced Thermal Solutions, Inc.)

To meet the need for innovative solutions, ATS engineers are hard at work in the company’s six state-of-the-art laboratories at the ATS headquarters, located in Norwood, Mass. (south of Boston). Thermal issues of all kinds are recognized, broken down, and resolved and cooling solutions are designed, simulated, prototyped, and rigorously tested in these research-grade facilities.

When someone thinks of a research lab, the initial picture is scientists in white coats working for major corporations, such as IBM, Microsoft, or Google, but the development of new ideas is an essential tool for any company in the technology field. Working with empirical tests in a lab environment pushes concepts from the white board or the computer screen to reality. There comes a time when engineers need to produce tangible data to ensure that a design works as planned.

ATS thermal engineers are no different. They use state-of-the-art instruments and software in each of the six labs to conduct a long list of characterization, quality-assurance, and validation tests. In addition to finding custom cooling solutions for customers, ATS engineers produce thermal management products for commercial uses, including a variety of next generation heat sink, heat pipe, vapor chamber, and liquid cooling designs.

Engineers test ATS instruments using a wind tunnel and sensors in the Characterization Lab. (Advanced Thermal Solutions, Inc.)

Among the most common tests performed in the ATS labs are:

• Measurements of air velocity, direction, pressure and temperature;
• Characterization of heat sink designs, fans and cold plates
• Flow visualization of liquid and air flow
• Image visualization characterization using infrared and liquid crystal thermography.

Many of the instruments that these tests are performed on were designed and fabricated by ATS. That includes open-loop, closed-loop, and bench-top wind tunnels; the award-winning iQ-200™, which measures air temperature, velocity, and pressure with one instrument; and the thermVIEW™ liquid crystal thermography system. Engineers also use specially-designed sensors, such as the ATS Candlestick Sensor, to get the most accurate analysis possible.

Smoke flow visualization tests run in ATS wind tunnels demonstrate how air flows through a system. (Advanced Thermal Solutions, Inc.)

Heat pipes and vapor chambers are increasingly common cooling solutions, particularly for mobile devices and other consumer electronics, and ATS engineers are working to expand the company’s offerings for these solutions and to develop next generation technology that optimizes the thermal performance of these products. This research involves advanced materials, new fabrication methods, performance testing, and innovative designs that are ready for mass production.

ATS engineer Vineet Barot sets up a thermal imaging camera for temperature mapping studies in the lab. (Advanced Thermal Solutions. Inc.)

ATS has also developed products to meet the growing demand across the electronics industry for liquid cooling systems. From new designs for recirculating and immersion chillers to multi-channel cold plates to tube-to-fin heat exchangers, ATS is continuing to expand its line of liquid cooling solutions to maximize the transfer of heat from liquid to air and researching new manufacturing methods, advanced materials, and other methods of enhancing the technology.

As liquid cooling technology has grown, ATS has met this demand with new instruments and lab capabilities, such as the iFLOW-200™, which measures a cold plate’s thermal and hydraulic characteristics, and full liquid loops to test ATS products under real-world conditions.

ATS Labs

ATS engineer Reza Azizian (right) works with intern Vladislav Blyakhman on a liquid cooling loop in the lab. (Advanced Thermal Solutions, Inc.)

The labs at ATS are up to even the toughest electronics cooling challenges that the company’s global customers present. Thanks to its extensive lab facilities, ATS has provided thousands of satisfied customers with the state-of-the-art thermal solutions that they demand.

For more information about Advanced Thermal Solutions, Inc. (ATS) thermal management consulting and design services, visit www.qats.com/consulting or contact ATS at 781.769.2800 or [email protected].

Sensors for Temperature Measurement and Their Application (part 1 of 3)

Today we start a three part series on on Temperature Measurement and Their Application. There is an IT axiom that says, “garbage in, garbage out” and no where is that more true than in thermal analysis. If you measure your data incorrectly, you’ll have no chance of getting the data you need to design the best thermal management solution for your application.

In todays market, it is very rare to see electronic equipment that has not undergone extensive thermal evaluation, either by measurement or simulation. Inevitably, the temperature of the device junction or case, or the enclosure, has been measured to ensure that the system will operate to its intended specifications. A quick look at the equations associated with stress in a lead wire, and with the acceleration factor used in reliability calculations, will show why temperature plays such an important role in electronics equipment [1].

equations showing the linear and exponential relationship of temperatureEquations 1 and 2 clearly demonstrate the linear and exponential relationships that temperature has in the operation of the electronic components. Concurrently, simulation tools are used extensively in todays thermal design. But, due to the complexity of the electronics packaging and composite nature of the materials used, the simulation data must be verified in order to ensure reliable data is obtained. In this article, we present different sensors and their application domains in electronics thermal management.

Table 1 shows six primary sensors used in temperature measurement:

table showing various temperature transducers for thermal analysisTable 1. Standard Temperature Transducers [2]

In part 2 of our three part series, we’ll start consider each sensor in detail, focusing on the resistor thermometer, thermocouple and diode transistor.

References:
1. Klinger, D., Nakada, Y., Menendez, M., AT&T Reliability Manual,
Van Nostrand Reinhold, 1990.
2. Azar, K., Thermal Measurement in Electronics Cooling, CRC Press,
1997.
3. Advanced Thermal Solutions, Inc., Tutorial Series, Principles of
Temperature Measurement.
4. thermVIEW System, product of Advanced Thermal Solutions, Inc.
5. White, F., Viscous Fluid Flow, McGraw-Hill, 3rd Ed., 2005.

If you are in need of sensors for thermal measurement, click now to ATS’ sensor family. Including our industry leading Candlestick Sensor.You can also email or call us with your questions on temperature measurement and one of our engineers will be happy to help you. Email us at [email protected] or call us at 781-769-2800.