Category Archives: thermal engineering

This Fixed Cost Plan for Cooling Hot PCBs Saves Money, Simplifies Ordering

For one fixed cost, a QoolPCB plan includes the full set of ATS heat sinks,  attachment devices and all other parts required for the effective thermal management of a PCBs components. There are no additional costs for the thermal engineering, performance testing, procurement or shipping. The heat sinks and hardware are kitted and provided for the full volume of boards requiring cooling.

Pricing for a QoolPCB solutions is based on the number of heat sinks that a specific PCB requires for efficient thermal management. For example, if thermal analysis and testing show that a PCB needs 10 heat sinks to operate safely, the fixed price for the heat sinks and hardware for a production volume of that PCB would be just $50 per board. For larger boards, or those with many hot components, the unit cost per heat sink is reduced.

Whether the solutions are for off-the-shelf heat sinks, custom designed, or a combination of both, the QoolPCB program from ATS provides it at fixed cost. QoolPCB eliminates separate costs for design, tooling, samples, verification and supply chain management. The program offers multiple benefits for companies looking to reduce their product development costs, speed time-to-market and ensure thermal reliability.

To participate, PCB developers simply provide 3D CAD models of their board layout, along with the technical specifications, including power dissipation of all board components. ATS performs a full thermal analysis of the PCB and develops a comprehensive cooling solution for each component on the board. Where possible, ATS engineers will specify existing heat sinks from a portfolio of more than 3000 off-the-shelf and application-specific designs and with in-stock attachment systems.

If any custom heat sinks are required to bring certain components within their manufacturer-designated running temperatures, ATS assumes all tooling charges and sample production costs, including any customized heat sink attachment hardware. In addition, ATS will perform all physical testing at its Thermal Characterization Laboratory, which features advanced open loop and closed loop wind tunnels, temperature and velocity measurement sensors and other analysis instrumentation, to verify the cooling design. All designs and performance reports are provided to customers, who can perform their own thermal analyses and verification studies using the ATS characterization lab and samples of the actual heat sink solutions at no extra cost.

More information about the QoolPCB thermal management program from ATS is available at: http://www.qats.com/Services/QoolPCB—PCB-Cooling-At-Fixed-Cost/57.aspx

 

Great Viewing: ADI’s New White Board Series on Thermocouples

In our Twitter feed we saw that ADI has a new 8-video series on thermo- couples. It’s a great set of videos on this topic. Well presented and informative, we’d recommend our reader’s put them in their bookmarks to check out. Well worth your time.

You can reach the full series by visiting ADI’s site here:  ADI’s Thermocouple 101 Video Series

ATS has also covered thermocouples here on our blog. Click to this link to read our two part series, “Thermocouples for Thermal Analysis: What they are and How they Work“.

Here’s one of the first of ADI’s thermocouple series to check out!

ATS Launches Thermal Engineering Reference Kit for Materials

We just launched a new reference kit for thermal engineering that is focused on materials for heat sinks and other thermal management applications.We’ve put together this handy list to help you make the best use of your time in your projects. Whether it’s copper, aluminum, or an advanced material, our kit will give you unbiased information so you can make a fact based decision.

You can get your copy by clicking to: Heat Sink and Thermal Management Material Reference Kit

How To Place the ATS Candlestick Sensor For Thermal Analysis

ATS’s Candlestick Sensor is our best selling sensor to collect air temperature and air velocity in thermal analysis. Like all of our thermal engineering instruments, ATS developed our Candlestick sensor out of necessity: we were simply breaking too many standard sensors and needed a more robust and accurate sensor. And the Candlestick Sensor was born!

Many of our customers often ask how our thermal engineers place the Candlestick Sensor in a wind tunnel in order to analyze a heat sink or other device. In this one minute video, Greg shows you just how we do it.