ATS’ own, Dr. Camil Ghiu, will be presenting “Driving Towards 0.1oC/W In Compact Air Cooled Heat Sinks: Advancements In Flow Management And Air Jet Impingement Cooling” at the Thermal Management Industry International Summit: coolingZONE-13. The Summit will be held in Boston, Massachusetts, October 21-23, 2013.
Considering the widespread use of compact systems, such as the 1U platform, and the drive to reduce costs from the system and deployment view points, air cooling continues to be sought for thermal management of such systems. The decrease in size of the new generation of electronic devices imposes a severe constraint on their incorporated thermal management devices. In this context, the development of low thermal resistance heat sinks (0.1 oC/W) for cooling compact electronics systems (1U form factor) continues to be a challenge for the thermal management community.
Dr. Ghiu’s presentation will present recent developments in designing compact heat sinks using advanced air flow management. Two main approaches will be presented, including heat sink design implementing jet impingement and sectional heat sinks. Both design approaches have been explored at ATS, and the experimental data and simulation results will be presented for further discussion.
coolingZONE-13 is the premiere engineering conference for the thermal management industry. Leading experts from academia and the electronics cooling industry will present emerging technologies in the most crucial areas of thermal engineering. A wide range of topics will be discussed, including liquid cooling, advanced heat sink and heat pipe design, thermal interface materials, data center cooling and analysis, CFD, and vapor compression cooling. Keynote speakers this year are Dr. Vincent Manno of Olin College, Dr. Marc Hodes of Tufts University and Dr. Kaveh Azar, CEO of Advanced Thermal Solutions, Inc. Additional speakers and exhibitors from Laird, CD-Adapco, Aavid, Cradle-CFD, Schneider Electric, and Future Facilities will also be presenting at the conference.
