In light of several media spotlights on the TLC-100, including FrostyTech, EDN, and Electronics Product Magazine, ATS has released a new video showing the Liquid Crystal Thermography Kit in action. ATS engineer, Greg, shows us how liquid crystals begin turning red, then into different colors, representing the temperature distribution of the component or board. By applying these liquid crystals, engineers can visually find hotspots and temperature fields on chips and other electronic components.
Posted in Liquid Cooling
Tagged Advanced Thermal Solutions, component, electronics, electronics cooling, engineer, engineering, heat mapping, heat transfer, hot spot, liquid crystal, liquid crystal thermography, mechanical engineering, temperature field, temperature map, test, testing, thermal analysis, thermal engineering, thermal management, video
The holidays are a time for giving, but ATS provides the engineering community with educational services year round, offering short courses, tutorial programs and free monthly webinars. In addition, ATS publishes Qpedia Thermal eMagazine, the only monthly publication dedicated to the field of thermal management. Over 18,000 engineers subscribe to the magazine, looking to advance their professional careers, academic studies, or understanding of electronics cooling. Qpedia and coolingZONE are running a holiday sale, discounting Qpedia Books by 25%. The Qpedia Book Series is a must have for every engineer, providing detailed and technical explanations for real life challenges that arise in the professional environment of engineers. The promotion is only until December 31st, so don’t miss your chance to order these invaluable books at a discounted price.
Posted in Qpedia Thermal eMagazine
Tagged academia, Advanced Thermal Solutions, article, azar, book sale, book special, books, cooling, discount, education, electronics, electronics cooling, electronics design, engineer, engineering, engineering books, engineering student, heat sink, holiday sale, industry, journal, mechanical engineer, professor, promotion, publication, QPedia, reference, sale, scholar, science, tavassoli, technical, thermal analysis, thermal design, thermal engineering, thermal management, webinars
coolingZONE is running a holiday promotion on the Qpedia Book Series, discounting 25% off the normal retail value until December 31, 2012. Qpedia Thermal eMagazine is the official media sponsor of coolingZONE. The Qpedia book series provides an expert resource for engineering professionals, professors, students and others who want to learn more about the theories and applications of electronics thermal management.
The four volume set contains nearly 200 in-depth articles, researched and written by veteran engineers. They address the most critical areas of electronics cooling, with a wide spectrum of topics and thorough technical explanation. Each article features color illustrations and images along with important thermal calculations and formulas.
Qpedia Volume 1 topic highlights:
– Heat sink design
– Pool boiling
– Sensors
– Thermal chassis
– Pitot tubes
– Heat transfer
Qpedia Volume 2 topic highlights:
– Thermal grease
– Vapor chamber cooling
– Liquid cooling
– Natural convection cooling
– Phase change materials
Qpedia Volume 3 topic highlights:
– CFD modeling
– PCB optimization
– Jet impingement cooling
– LED cooling
– Cold plates
– Refrigeration systems
Qpedia Volume 4 topics highlights:
– Multilayer mini-channel heat sinks
– Electro-osmotic pumps
– Thermoelectric coolers
– High altitude heat transfer
– Data center cooling
– Defense electronics
– Automotive electronics cooling
Check out the video on Qpedia Volume 4
Over fifteen thermal and mechanical engineers combined their expertise to create the articles in this useful collection, including Kaveh Azar, Ph.D. and Bahman Tavassoli, Ph.D., both of whom are internationally recognized experts in the field of the thermal management of electronics. Qpedia Thermal eMagazine, published by Advanced Thermal Solutions, Inc. (ATS) was launched in 2007 as a technical publication dedicated to the thermal management of electronics.
Filled with careful explanations, step-by-step calculations, and practical examples from real life challenges, this expert collection of articles is a must have for any mechanical, electrical, and thermal engineer or anyone interested in the rapidly growing field of electronics cooling.
Order the Qpedia Book Series with 25% off now at www.coolingzone.com The books can be purchased as a complete set, combination, or individually. Volume discounts for organizations and academic institutions are also available.
Posted in Qpedia Thermal eMagazine
Tagged Advanced Thermal Solutions, azar, book, book promotion, book sale, cold plates, cooling technology, coolingzone, data center cooling, electrical engineer, electronics, electronics cooling, electronics industry, engineer, engineering book, engineering calculations, engineering challenges, engineering design, engineering education, engineering formulas, engineering fundamentals, engineering problems, engineering reference, engineering solutions, heat sink design, heat transfer, high altitude heat transfer, holiday sale, junction temperature, LED cooling, mechanical engineer, natural convection cooling, nausselt number, publication, QPedia, sensor, student, temperature measurement, thermal analysis, thermal conductivity, thermal engineering, thermal grease, thermal management, thermal management solutions, thermal studies, thermocouple, thermodynamics
Advanced Thermal Solutions, Inc. (ATS) has released a new thermal test instrument, the iFLOW-200, which assesses the thermal and hydraulic characteristics of cold plates in electronics cooling. It can be used to simulate a wide range of conditions to optimize a cold plate’s performance before it is commercialized or prior to its use in an actual application.
The iFLOW-200 measures coolant temperatures from 0-70°C with the high accuracy of ± 1°C. Differential pressure of the coolant in the cold plate is measured up to 103,000 Pa (15 psi), with the precise accuracy of ± 1%. Distilled water is used as the reference coolant. For test comparisons, the systems coolingVIEW software can also calculate thermal resistance and pressure drop as a function of flow rate for selected liquids.
The instrument system includes a pair of K-type thermocouples for measuring temperature changes on the cold plate surface. Temperatures are monitored on the coolingVIEW interface.
The iFLOW-200 system features easy set up and operation to save time when evaluating different cold plate models. Designed for accuracy and convenience, the iFLOW-200 simply requires setting the starting and ending coolant flow rates, and choosing the dwell time, pumping power and other parameters. These are easily done on any PC using the systemd user-friendly application program.
The iFLOW-200 system features separate controller and hydraulics enclosures with USB connections. The hydraulic package includes a fluid level indicator, coolant inlets and outlets from/to the cold plate under test, ports for surface temperature thermocouples, and a fluid cooling system for its internal heat exchanger. The iFLOW-200 is also ideal for testing alternative liquids.
More information about the iFLOW-200 Cold Plate Characterization System can be found at http://www.qats.com/Products/Temperature-and-Velocity-Measurement/Instruments/iFLOW-200
Posted in Cold Plates, Instrument, Product Highlights
Tagged analysis, cold plate, cold plate characterization, component test, coolant, cooling, electronics, electronics cooling, engineering, flow rate, hydraulic performance, instrument, liquid cooling, liquids, mechanical engineering, pressure drop, pressure measurement, product design, technology, temperature measurement, thermal analysis, thermal engineering, thermal management, thermal performance, thermal resistance, thermal test instrument, thermal testing, thermocouple