Tag Archives: Extrusions

Industry Developments: Extrusion Profile Heat Sinks

By Norman Quesnel
Senior Member of Marketing Staff
Advanced Thermal Solutions, Inc. (ATS)

Extruded metal heat sinks are among the lowest cost, widest used heat spreaders in electronics thermal management. Besides their affordability, extruded heat sinks are lightweight, readily cut to size and shape, and capable of high levels of cooling.

Metal Choices

Most extruded heat sinks are made from aluminum alloys, mainly from the 6000 alloy series, where aluminum dominates. Trace amounts of other elements are added, including magnesium and silicon. These alloys are easy to extrude and machine, are weldable, and can be hardened.

Common alloys for extruded heat sinks are the 6063 metals. These can be extruded as complex shapes, with very smooth surfaces. 6061 aluminum is also used for extrusions. Its tensile strength (up to 240 MPa) is superior to 6063 alloys (up to 186 MPa). In addition to heat sinks, these aluminum alloys are popular for architectural applications such as window and door frames. [1]

Extrusion Profile Heat Sinks
Figure 1. An extruded aluminum heat sink with a black anodized finish. [2]

The surfaces of these metals can be anodized to replace their naturally occurring surface layer of aluminum oxide. Anodizing provides more heat transfer, corrosion resistance and better adhesion for paint primers. It is an electrochemical process that increases surface emissivity, corrosion and wear resistance, and electrical isolation.

The Extruding Process

Aluminum alloys are popular for extruding as heat sinks because they provide both malleability and formability. They can be easily machined and are as little as one-third the density of steel. This results in extrusions that are both strong and stable, at a reduced cost relative to other materials.

Figure 2. Heated aluminum alloy billets are pushed through a die to produce extruded length heat sinks and other parts. [3]

The aluminum extrusion process starts with designing and creating the die that will shape the heat sink profile. Once this has been done, a cylindrical billet of aluminum is heated up in a forge to high temperatures, generally between 800-925°F (427-496°C). Next, a lubricant is added to the aluminum to prevent it from sticking to any of the machinery. It is then placed on a loader and pressure is applied with a ram to push heated aluminum through the die.

During this process, nitrogen is added in order to prevent oxidation. The extruded part will pass completely through the die and out the other side. It has now been elongated in the shape of the die opening. The finished extrusion is then cooled, and if necessary, a process of straightening and hardening creates the finished product.

They can be cut to the desired lengths, drilled and machined, and undergo a final aging process before being ready for market. [4]

Finished heat sinks typically come with anodized surfaces, which can enhance their thermal performance. Alternatively, a chromate finish provides some corrosion protection, or can be used as a primer before a final paint or powder coating is applied. [5]

Shapes of Extruded Heat Sinks

Extruded heat sink profiles range from simple flat back fin structures to complex geometries for optimized cooling. They can be used for natural (passive) or forced convection (active) with an added fan or blower. Extruded profiles can also include special geometries and groove patterns for use with clip or push pin attachment systems. [6]

Figure 3. Extruded heat sinks are available in many shapes and lengths. [6]

Extrusions are also available in bulk lengths, e.g. 8 feet, which can be cut to different lengths per customer needs.

Optimizing Thermal Performance

6063 aluminum alloy has a thermal conductivity of 201-218 W/(mK). Higher tensile strength 6061 aluminum’s thermal conductivity ranges from 151-202 W/(mK).

Besides choosing the aluminum alloy, selecting an optimal extruded heat sink should factor in its overall dimensions and weight, the specified thermal resistance, and the extrusion shape (flat-back, flat-back with gap, hollow, double-sided, etc.). [7]

Extruded heat sinks can be designed with very thin, and thus more, fins than other sink types. They can be extruded with aspect ratios of around 8:1, which can greatly optimize heat sink performance. A heat sink’s aspect ratio is basically the comparison of its fin height to the distance between its fins.

In typical heat sinks the aspect ratio is between 3:1 and 5:1. A high aspect ratio heat sink has taller fins with a smaller distance between them for a ratio that can be 8:1 to 16:1 or greater.

Figure 4. Different thin fin extruded heat sinks mounted on a PCB. [8]

Thus, a high aspect ratio heat sink provides greater density of fins in a given footprint than with a more common size sink. The great benefit is the increased amount of heat dissipating surface area it provides due to its additional fins. Further, these heat sinks do not occupy any more length or width. The result is a more efficient heat sink with higher performance per gram in the same footprint. [9]

Applications

An extruded heat sink is used mainly to increase the surface area available for heat transfer from high-power semiconductor devices, thus reducing a given semiconductor’s external case temperature, as well as its internal junction temperature.

Figure 5. Extruded heat sinks mounted on processors by clips (left) and push pins (right). [10]

This allows the semiconductor devices to perform at their highest level, with maximum reliability. Such semiconductor devices include (but are not limited to) RF power transistors, RF power amplifiers, Power MOSFETs, IGBTs, inverter power modules, and thyristor modules.

Figure 5. Extruded heat sinks screwed onto a brick DC-DC converter. [11]

In some power conversion circuit applications, large diodes, rectifiers, diode modules and even high-power resistors (thick film, etc.) can also require thermal contact with an extruded heat sink. For cooling DC-DC power converters and power modules, extruded heat sinks are available for full, half, quarter and one-eighth brick sizes

References

  1. https://en.wikipedia.org/wiki/6063_aluminium_alloy
  2. http://www.aluminumextrusionsprofiles.com/sale-7552970-black-anodized-aluminium-heat-sink-profiles-extruded-aluminum-heatsink-radiators.html
  3. https://www.aec.org/page/basics_basics
  4. https://www.clintonaluminum.com/6061-aluminum-vs-6063-in-extrusion-applications
  5. http://www.wakefield-vette.com/products/natural-convection/thermal-extrusions-overview/CategoryID/15/Default.aspx
  6. https://www.boydcorp.com/thermal/heat-sinks/extruded.html
  7. http://www.richardsonrfpd.com/Pages/Product-End-Category.aspx?productCategory=10188
  8. http://www.getecna.com/products/heat-sinks/
  9. https://www.qats.com/cms/2013/04/11/increased-performance-from-high-aspect-ratio-heat-sinks/
  10. https://www.qats.com/Heat-Sink/Attachments
  11. https://www.powerelectronics.com/thermal-management/heat-sinks-cool-brick-dc-dc-converters

For more information about Advanced Thermal Solutions, Inc. (ATS) thermal management consulting and design services, visit https://www.qats.com/consulting or contact ATS at 781.769.2800 or ats-hq@qats.com. To register for Qpedia and to get access to its archives, visit 
https://www.qats.com/Qpedia-Thermal-eMagazine.

#WeCoverTheBoard: ATS Has Thermal Solutions to Cover the Whole Board

We Cover The Board

Advanced Thermal Solutions, Inc. (ATS) has an extensive line of heat sinks and board level thermal solutions that allow ATS engineers to work with industry-leading components and solve the industry’s toughest thermal challenges. (Advanced Thermal Solutions, Inc.)

Advanced Thermal Solutions, Inc. (ATS) has an extensive product line of innovative, off-the-shelf and custom heat sinks and attachments that provides the broadest range of designs to meet the demanding thermal challenges presented by today’s high-powered electronics. Led by its patented maxiFLOW™, which provides the highest thermal performance for physical volume it occupies compared to other heat sinks on the market, ATS has a solution to meet any thermal problem.

In addition, ATS engineers have world-renowned expertise in thermal management and are capable of designing liquid and air cooling solutions using heat sinks, heat pipes, heat exchangers, fans, and cold plates. ATS has more than two decades of solving the industry’s toughest thermal challenges and have a proven record of success in handling the industry’s leading components.

From the latest generation of Intel processors to Altera’s high-powered Stratix FPGA to Qualcomm’s ARM processors to Texas Instruments, Nvidia, NXP, Cavium, and many more, ATS has the experience, the analytical capability, and the products to provide you with the necessary thermal management.

Board Level Solutions

maxiFLOW™ – maxiFLOW™ heat sink design provides the highest thermal performance for the physical volume that it occupies as compared to other heat sink designs. maxiFLOW™ heat sinks are ideally suited to meet the thermal requirements of a broad range of electronics packages, including: BGA, QFP, LCC, LGA, CLCC, TSOP, DIPs and LQFP.

Straight Fin – ATS offers a large variety of high performance Straight fin heat sinks that can be used in many applications where the direction of the airflow is clearly defined. The straight fin heat sink can be utilized in areas where the maxiFLOW™ flair-fanned cannot be used, providing an excellent alternative for cooling thermally sensitive devices.

Cross-Cut – Electronics packages are numerous and range from BGA, QFP, LCC, LGA, CLCC, TSOP, DIPs, LQFP and many others. ATS offers a large variety of cross cut heat sinks that can be used in a variety of applications where the direction of the airflow is ambiguous. The cross cut allow for the heat sink to receive air from any direction.

Pin Fin – Electronics packages are numerous and range from BGA, QFP, LCC, LGA, CLCC, TSOP, DIPs, LQFP and many others. ATS offers a large variety of cross cut heat sinks that can be used in a variety of applications where the direction of the airflow is ambiguous. The cross cut tape on allow for the heat sink to receive air from any direction and can be easily attached to the device by a thermally conductive tape.

fanSINK™ – In many electronic systems, such as telecomm and datacom chassis, or 1U, 2U servers and blades, the system air flow rate is not adequate for cooling of high power devices. Therefore, additional air flow introduced at the device level is required. ATS offers a large family of fanSINK™ products for applications where FPGA or ASICs in BGA packages are deployed. ThefanSINK™ can be either clipped on to the device by maxiGRIP™ or superGRIP™ heat sink attachment technologies or taped on.

Power Brick – DC/DC power converters are an essential part of PCB design and their performance requires a stable temperature for optimum performance. ATS has produced a broad array of high performance power brick heat sinks, based off of the patented maxiFLOW™ design, to effectively cool DC/DC power converters and power modules deployed in a host of electronics applications. ATS’ power brick heat sinks are available in full, half, quarter and eighth packaging.

pushPIN™ – With over 108K different push pin heat sink assembly configurations, ATS offers the largest push pin heat sink offering in the market. Select from fine and ultra-fine pitch heat sinks designed for high velocity air flows and coarse pitch heat sinks for low velocity air flow conditions. Offered in straight fin, cross-cut and the ultra performance maxiFLOW™ fin geometries, ATS pushPIN™ heat sink line is suited to meet a wide variety of applications for components ranging in size from 25mm-70mm. Push pins are offered in brass and plastic and are packaged with different compression springs to achieve precise force required for secure attachment.

blueICE™ (Ultra Low Profile) – In many electronics systems, such as Telecomm, Datacomm, Biomedical equipment and others, card-to-card spacing is small, yet stringent thermal requirements remain the same. Electronics packages such as BGA, QFP, LCC, LGA, CLCC, TSOP, DIP, LQFP are commonly used with stringent thermal requirements in a tight space with limited airflow. Ultra low profile heat sinks offered by ATS range from 2 to 7mm in height and are ideally suited for tight-space application electronics since they offer the best thermal performance. Their thermal resistance is as low as 1.23° C/W within an air velocity of 600 ft/min.

Standard Board Level – ATS’ high quality, low cost, aluminum stamped heat sinks are ideal for low power thermal management solutions. The simple design and manufacturing of these heat sinks allows high volume manufacturing and reducing assembly costs. Stamped heat sinks are ideally used for TO packages and other power devices.

Extrusions – Aluminum extrusions are the most cost-effective solutions for the majority of electronic cooling applications. ATS offers a wide variety of aluminum profiles used for heat sink fabrication and other aluminum applications. Whether you are seeking a standard extrusion profile or the expertise from our design team to create a new and innovative profile, ATS has the capabilities and expertise to meet your requirements.

Heat Sink Attachments

superGRIP™ – superGRIP™ is a two component attachment system which quickly and securely mounts heat sinks to a wide range of components, without needing to drill holes in the PCB. superGRIP™ provides a strong, even attachment force with minimal space required around the components perimeter, making it ideal for densely populated PCBs. superGRIP™ is available with ATS maxiFLOW™ heat sink and straight fin heat sinks.

maxiGRIP™ – maxiGRIP™ is a unique, two component attachment system which quickly and securely mounts heat sinks to a wide range of components, without needing to drill holes in the PCB. The steady, even attachment force provided by maxiGRIP™ allows the heat sink and thermal interface material to achieve maximum thermal performance. maxiGRIP™ is available with ATS maxiFLOW™, straight fin, fanSINK™ and device specific heat sinks.

Thermal Tape
– The interface material plays a pivotal role in transporting the heat from the component to the heat sink. The tape is applied to the base of the heat sink and then the heat sink is attached to the component. For tape to work well, proper cleaning of the component surface and the base of heat sink is required. Also, it is usually necessary to apply the tape with a certain amount of pressure.