Tag Archives: thermal engineering

ARM Microprocessors and ATS superGRIP: Attached at the Clip

Advanced Thermal Solutions, Inc., (ATS), has introduced a line of heat sinks compatible with the Sitara ARM Microprocessor family from Texas Instruments.

AM1707 from Texas Instruments

AM1707 from Texas Instruments

The Sitara ARM Microprocessors feature ARM Cortex-8 and ARM9 MPUs, which are used in a wide variety of Industrial, Medical, and Consumer Electronics applications.

The AM17x family consists of low-power ARM microprocessors that enable OEMs and ODMs to maximize product offerings by providing high processing performance life, advanced operating systems and rich user interfaces. Compatible operating systems include Neutrino, Integrity, Windows, Embedded CE, Linux, VXWorks and Android.

ATS patented maxiFLOW heat sinks with superGRIP clip attachment ensure long-term product reliability and maximum performance from the Sitara ARM Microprocessors. maxiFLOW high performance BGA heat sinks feature a low profile, spread fin array that maximizes surface area for more effective convection air cooling. The unique maxiFLOWTM design provides thermal performance that is 30-200% better than conventional heat sinks.

ATS' maxiFLOW Heat Sink with superGRIP Attachment

ATS’ maxiFLOW Heat Sink with superGRIP Attachment

maxiFLOW is available with pre-assembled phase change material, maxiGRIP clip attachments, and superGRIP clip attachments. The superGRIP attachment system features a plastic frame clip that fastens securely around the perimeter of a component and a metal spring clip that slips through a heat sinks fin field and locks securely to both ends of the plastic frame. The resulting superGRIP assembly applies steady even pressure to the component throughout the product lifecycle, improving thermal performance and long-term reliability. The ATS superGRIP heat sink attachment system permits the use of high performance phase changing thermal interface materials that improves heat transfer by as much as 20 times more than typical double-sided adhesive thermal tapes. It also allows for the heat sink to be detached and reattached without damaging the component or the PCB, an important feature for applications where PCB rework and ease of assembly and disassembly are important. The full range of ATS products compatible with Texas Instruments products can be viewed in the new heat sink selection tool on http://qats.com/Distributor/AE-Dist.php

To learn more about maxiFLOW heat sinks and the superGRIP clip attachment, please visit www.qats.com, email [email protected], or call 781-769-2800.

2013 Webinar Calendar Released

ATS will provide two free technical webinars each month in 2013. Presented by PhD-level thermal engineers, each event will focus on an important area of electronics thermal management. The tutorials will provide practical training and insights for all engineers, designers and program managers who want to learn more about electronics cooling.

Most of the ATS webinars are scheduled to run no longer than 15 minutes in respect to the time demands on todays engineers. But each quarter of 2013 will conclude with a one-hour event that presents deeper training on a crucial heat management topic.

Every webinar is free of charge. Attendees can submit questions during the live presentations. For later viewing, each webinar will be archived on the ATS website for free streaming at the engineers convenience. Questions and comments to the recorded webinars will be responded to by ATS engineers.

ATS Webinars

Here are the 2013 ATS webinar dates, run times and titles:

Jan 9: What is the Thermal Management of Electronics?

Jan 23: Thermal Interface Material Overview: Pros and Cons

Feb 13: Calculating Junction Temperature in Electronics Cooling

Feb 27: Important Factors When Doing Heat Sink Design

Mar 13: Analytical Modeling for Thermal Analysis

Mar 27: Heat Sink Materials: Choices and Tradeoffs

Apr 10: LED Cooling: Whats So Hot about LEDs?

Apr 24: LED Cooling: Analytical Thermal Analysis

May 8: LED Cooling: Computational Thermal Analysis

May 22: LED Cooling: Physical Thermal Analysis

Jun 12: Heat Sink Fin Spacing for Heat Transfer Optimization

Jun 26: Temperature Measurements Within Electronic Systems

Jul 10: Heat Sink Types: Pros and Cons

Jul 24: Heat Sink Manufacturing Processes

Aug 14: Thermal Conductivity: What It Is and Why You Should Care

Aug 28: How to Perform Pressure Drop Calculations

All webinars are on Wednesdays at 2pm. Please visit www.qats.com/training to view the entire list of webinars, on-demand webinars in the archive, and to register for the full hour, live tutorials.

New Video Showing Liquid Crystal Thermography


In light of several media spotlights on the TLC-100, including FrostyTech, EDN, and Electronics Product Magazine, ATS has released a new video showing the Liquid Crystal Thermography Kit in action. ATS engineer, Greg, shows us how liquid crystals begin turning red, then into different colors, representing the temperature distribution of the component or board. By applying these liquid crystals, engineers can visually find hotspots and temperature fields on chips and other electronic components.

Learn More about the TLC-100

Order the TLC-100

Request a Quote

 

The Perfect Holiday Gift for Any Engineer

Holiday Sale: 25% Off Qpedia Books

The holidays are a time for giving, but ATS provides the engineering community with educational services year round, offering short courses, tutorial programs and free monthly webinars. In addition, ATS publishes Qpedia Thermal eMagazine, the only monthly publication dedicated to the field of thermal management. Over 18,000 engineers subscribe to the magazine, looking to advance their professional careers, academic studies, or understanding of electronics cooling. Qpedia and coolingZONE are running a holiday sale, discounting Qpedia Books by 25%. The Qpedia Book Series is a must have for every engineer, providing detailed and technical explanations for real life challenges that arise in the professional environment of engineers. The promotion is only until December 31st, so don’t miss your chance to order these invaluable books at a discounted price.

Order Now!

 

Holiday Sale: 25 % Off Qpedia Book Series!

 

coolingZONE is running a holiday promotion on the Qpedia Book Series, discounting 25% off the normal retail value until December 31, 2012. Qpedia Thermal eMagazine is the official media sponsor of coolingZONE. The Qpedia book series provides an expert resource for engineering professionals, professors, students and others who want to learn more about the theories and applications of electronics thermal management.

The four volume set contains nearly 200 in-depth articles, researched and written by veteran engineers. They address the most critical areas of electronics cooling, with a wide spectrum of topics and thorough technical explanation. Each article features color illustrations and images along with important thermal calculations and formulas.

Qpedia Volume 1 topic highlights:

– Heat sink design

– Pool boiling

– Sensors

– Thermal chassis

– Pitot tubes

– Heat transfer

Qpedia Volume 2 topic highlights:

– Thermal grease

– Vapor chamber cooling

– Liquid cooling

– Natural convection cooling

– Phase change materials

Qpedia Volume 3 topic highlights:

– CFD modeling

– PCB optimization

– Jet impingement cooling

– LED cooling

– Cold plates

– Refrigeration systems

Qpedia Volume 4 topics highlights:

– Multilayer mini-channel heat sinks

– Electro-osmotic pumps

– Thermoelectric coolers

– High altitude heat transfer

– Data center cooling

– Defense electronics

– Automotive electronics cooling

Check out the video on Qpedia Volume 4

Over fifteen thermal and mechanical engineers combined their expertise to create the articles in this useful collection, including Kaveh Azar, Ph.D. and Bahman Tavassoli, Ph.D., both of whom are internationally recognized experts in the field of the thermal management of electronics. Qpedia Thermal eMagazine, published by Advanced Thermal Solutions, Inc. (ATS) was launched in 2007 as a technical publication dedicated to the thermal management of electronics.

Filled with careful explanations, step-by-step calculations, and practical examples from real life challenges, this expert collection of articles is a must have for any mechanical, electrical, and thermal engineer or anyone interested in the rapidly growing field of electronics cooling.

Order the Qpedia Book Series with 25% off now at www.coolingzone.com The books can be purchased as a complete set, combination, or individually. Volume discounts for organizations and academic institutions are also available.