Technical Case Study - Power Electronics - CFD Validation

High-Density GaN and SiC Power Module Cooling with Ducted Airflow and CFD Validation

ATS performed analytical and CFD-based thermal design for a power supply company whose high-density GaN and SiC power stage operated at 40°C ambient. The objective was to keep multiple GaN and SiC devices below their temperature limits using a ducted air-cooling architecture compatible with an IP-rated enclosure.