The Online Publication and Book Series Dedicated to the Thermal Management of Electronics
Qpedia Thermal eMagazine was launched in 2007 as a monthly newsletter focused on the thermal management of
electronics. Now in its 9th year of publication, Qpedia is a highly respected monthly magazine that is distributed
at no charge to over 18,000 engineers. Written and published by the engineers of Advanced Thermal Solutions, Inc.,
Qpedia is a technical resource to help the engineering community solve the most challenging thermal problems. Each
issue provides practical approaches to thermal management challenges and explains the new technologies for
successfully cooling today and tomorrow’s hot-running electronics.
Table of Contents -
February 2009
February 2009
The most recent issue of Qpedia Thermal eMagazine is now available for download. As always, this month's issue includes four technical articles focused on the thermal management of electronic devices including:
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The Performance Impact of Different Heat Sink Materials
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Estimating Juction Temperatures Using JEDEC Thermal Resistances
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Heat Transfer Coefficients for Circuit Packs
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Thermal Interface Materials
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