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The Online Publication and Book Series Dedicated to the Thermal Management of Electronics

Qpedia Thermal eMagazine was launched in 2007 as a monthly newsletter focused on the thermal management of electronics. Now in its 9th year of publication, Qpedia is a highly respected monthly magazine that is distributed at no charge to over 18,000 engineers. Written and published by the engineers of Advanced Thermal Solutions, Inc., Qpedia is a technical resource to help the engineering community solve the most challenging thermal problems. Each issue provides practical approaches to thermal management challenges and explains the new technologies for successfully cooling today and tomorrow’s hot-running electronics.

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Table of Contents - May 2009

Current Issues

May 2009

Heat Transfer Coefficient Correlations for Two-Phase Flow in Small Channels
Boiling in small channels has been extensively studied in recent years due to its promising applications for high power electrical device cooling applications. Understanding the application conditions and choosing the best boiling correlation are very important for modeling two-phase flow in mini-channels and micro-channels.

Estimating the Inside Air Temperature of a Natural Convection Sealed Enclosure
Sealed enclosures are normally used to protect the electronic equipments from corrosive or horse environment. The accumulation of heat in an enclosure is potentially damaging to electrical and electronic devices. Overheating can shorten the life expectancy of components or lead to catastrophic failure. This paper explains the three heat transfer modes and illustrates how to estimate the inside air temperature of the enclosure.

Simple Refrigeration Systems For Thermal Management
Simple refrigeration systems are widely used in commercial refrigerators and household air conditioners. They were introduced to personal computers by KryoTech for AMD’s Athlon processor and to servers by IBM for its S/390 G4 Mainframe in 1990s. Unlike traditional air-cooled heat sinks and liquid-cooled cold plates, refrigeration cooling utilizes the phase change of refrigerant to reduce the temperature. It takes the advantages of refrigerant’s low boiling point and high latent heat in phase change. 

Understanding Boiling Heat Transfer for Electronics Thermal Management
With the advent of hybrid automobiles, and well as high powered electronics, we are seeing more and more environments in which the heat flux in components is exceeding 1000 W/cm2 [1]. One of the promising methods for high capacity cooling is boiling heat transfer. This article reviews the basic principles of this important mechanism.