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The Online Publication and Book Series Dedicated to the Thermal Management of Electronics

Qpedia Thermal eMagazine was launched in 2007 as a monthly newsletter focused on the thermal management of electronics. Now in its 9th year of publication, Qpedia is a highly respected monthly magazine that is distributed at no charge to over 18,000 engineers. Written and published by the engineers of Advanced Thermal Solutions, Inc., Qpedia is a technical resource to help the engineering community solve the most challenging thermal problems. Each issue provides practical approaches to thermal management challenges and explains the new technologies for successfully cooling today and tomorrow’s hot-running electronics.

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Table of Contents - June 2010

Current Issues

June 2010




Using Thermoelectric Coolers in Electronics Cooling

When a DC current is applied to the circuit, the thermoelectric module can work as a cooler or heater, depending on the current’s direction. A thermoelectric cooler (TEC), or solid state heat pump, transfers heat from one side of the device to the other side against the temperature gradient.


How Obstruction Effects the Performance of a Fan

Proper performance of the fan, irrespective of its type, is the corner-stone of a cooling system. Yet, as engineers are designing such systems, or when systems with fans are deployed on premises, it is common that little attention is given to the placement of the fan or to objects in its vicinity. Thus, the fans tend not to work at their optimum stages.


Localized Cooling Using Cold Plates

Many applications in electronics cooling require a cold plate to remove heat from discrete components laid out on a board. In these circumstances, it is more efficient that the liquid does not completely fill the cold plate, but is only transferred to areas that need to be cooled.



Two-Resistor Compact Modeling for Multiple Die and Multi-Chip Packages

For an analyst, the attractiveness of the two-resistance compact model is that there is no need to model the complex 3D details of the package; it is simple and intuitive. However, the challenge in the derivation of two-resistor models comes from the complexity brought about by multiple die junctions, power and thermal resistances.


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