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Heat Sinks 54.0 x 68.0 x 9.8 mm BGA Heat Sink - High Performance Device Specific - AMD Kria K26 Modules
*Image above is for illustration purpose only..
54.0 x 68.0 x 9.8 mm  BGA Heat Sink - High Performance Device Specific - AMD Kria K26 Modules
Heat Sink
Product Details
  • ATS-KRP-3561-C1-R0
  • 54.0 x 68.0 x 9.8 mm  BGA Heat Sink - High Performance Device Specific - AMD Kria K26 Modules
  • AMD Kria™ K26 SOM
  • Passive maxiFLOW heat sink
  • Screws
  • N/A
  • See detail
  • See detail
Product Details
  • Designed to fit the AMD Kria™ K26 System-on-Module
  • Included mounting hardware kit: ATS-HK544-R0.
  • Heat sink mounts directly to the heat spreader plate that comes standard on the K26 SOM
  • Provided with pre-assembled Thermal Interface Material (TIM) on base
Specifications
Part Number Lifecycle Status Length
(mm)
Width
(mm)
Height
(mm)
Mounting Hole Pattern
Center to Center
(mm)
Mounting Hole Diameter
(mm)
Weight
(g)
Material TIM Finish
ATS-KRP-3561-C1-R0 ACTIVE 54.0 68.0 9.8 61 x 28.5 3.4 34.0 AL6063 Chomerics T766 Black Anodized
Thermal Performance
Schematic Image. Air Velocity Thermal Resistance
(ft/min) (m/s) °C/W Unducted Flow °C/W Ducted Flow

*Image above is for illustration purpose only.
A: Length | B:Width | C: Height | D&E: Mounting Hole Pattern | F: Mounting Hole Diameter
100 0.5 2.0 14.9
200 1.0 1.3 N/A
300 1.5 1.0 N/A
400 2.0 0.9 N/A
500 2.5 0.8 N/A
  1. Dimensions A and B refer to heat sink size.
  2. Dimension C is the heat sink height from the bottom of the base to the top of the fin field.
  3. Dimensions D and E refer to the mounting hole pattern C-C (center to cente)
  4. Dimension F refers to the mounting hole diameter
  5. Thermal performance data are provided for reference only. Actual performance may vary by application.
  6. ATS reserves the right to update or change its products without notice to improve the design or performance.
  7. ATS certifies that this heat sink assembly is RoHS-6 and REACH compliant.
  8. Contact ATS to learn about custom options available.

ATS-KRP-3561-C1-R0   (Data Sheet)
54.0 x 68.0 x 9.8 mm  BGA Heat Sink - High Performance Device Specific - AMD Kria K26 Modules
download data sheet
ATS-KRP-3561-C1-R0
CAD MODEL (Fused Model) - use for Form and Fit
Download CAD MODEL (Fused Model) - use for Form and Fit
RoHS
Obtain RoHS Certificate
download data sheet